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Interruptores y multiplexores
Interruptores y multiplexores para protocolos específicos

TS3DS10224

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Multiplexor analógico de 2 canales diferencial 2:1, 3.3 V, monocanal diferencial 4:1

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TS3DS10224

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Detalles del producto

Protocols USB 2.0 Configuration Crosspoint/exchange Number of channels 2 Bandwidth (MHz) 1200 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 13000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 50 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) Yes ESD CDM (kV) 1 Input/output continuous current (max) (mA) 100 COFF (typ) (pF) 6 CON (typ) (pF) 12 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 5 Propagation delay time (µs) 0.00005 Ron (max) (mΩ) 19000 Ron channel match (max) (Ω) 2.5 RON flatness (typ) (Ω) 4 Turnoff time (disable) (max) (ns) 100 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 2.3 VIL (max) (V) 0.6
Protocols USB 2.0 Configuration Crosspoint/exchange Number of channels 2 Bandwidth (MHz) 1200 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 13000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 50 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) Yes ESD CDM (kV) 1 Input/output continuous current (max) (mA) 100 COFF (typ) (pF) 6 CON (typ) (pF) 12 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 5 Propagation delay time (µs) 0.00005 Ron (max) (mΩ) 19000 Ron channel match (max) (Ω) 2.5 RON flatness (typ) (Ω) 4 Turnoff time (disable) (max) (ns) 100 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 2.3 VIL (max) (V) 0.6
WQFN (RUK) 20 9 mm² 3 x 3
  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)
  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.
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Documentación técnica

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Tipo Título Fecha
* Data sheet TS3DS10224 High-Speed Differential Crosspoint, 1:4 Differential Multiplexer and Demultiplexer, 2 Channel Differential 1:2 Multiplexer and Demultiplexer, or Fan-Out Switch datasheet (Rev. E) PDF | HTML 17 oct 2019
Application note Preventing Excess Power Consumption on Analog Switches 03 jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004

Diseño y desarrollo

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Adaptador de interfaz

LEADLESS-ADAPTER1 — Adaptador de montaje superficial a conector macho DIP para pruebas de encapsulados sin plomo de 6, 8

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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Modelo de simulación

TS3DS10224 HSpice AIO (Linux) Model

SCDM137.ZIP (511 KB) - HSpice Model
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Modelo de simulación

TS3DS10224 HSpice AIO (Windows) Model

SCDM136.ZIP (511 KB) - HSpice Model
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Modelo de simulación

TS3DS10224 IBIS Model

SCDM301.ZIP (4 KB) - IBIS Model
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Paquete Pasadores Descargar
WQFN (RUK) 20 Ver opciones
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  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
  • Lugar de ensamblaje

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