TX73L64

ACTIVO

Pulsador de 64 canales, 3 niveles, 1 A con formador de haces de transmisión integrado y amplificador

Detalles del producto

Device type Transmitter Number of input channels 64 Active supply current (typ) (mA) 20 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type LVDS/Serial Rating Catalog
Device type Transmitter Number of input channels 64 Active supply current (typ) (mA) 20 Supply voltage (max) (V) 5.5 Operating temperature range (°C) 0 to 70 Interface type LVDS/Serial Rating Catalog
FCCSP (ACP) 196 144 mm² 12 x 12
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 1A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 400Ω || 125pF load
      • 22MHz for a ±100-V supply
    • Very low receive power: 2.8mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 22Ω
    • Turn on and Turn off time: 100ns
    • 2:1 Channel Muxing to LNA input
  • LNA
    • Supports a maximum input swing of 500mVpp
    • Gain of 24dB
    • HD2 of -55 dBc and HD3 of 40dBc at 5MHz
    • Programmable input impedance to match source impedance 100, 200. 400 and 800Ω with DTGC support
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 1A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 400Ω || 125pF load
      • 22MHz for a ±100-V supply
    • Very low receive power: 2.8mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 22Ω
    • Turn on and Turn off time: 100ns
    • 2:1 Channel Muxing to LNA input
  • LNA
    • Supports a maximum input swing of 500mVpp
    • Gain of 24dB
    • HD2 of -55 dBc and HD3 of 40dBc at 5MHz
    • Programmable input impedance to match source impedance 100, 200. 400 and 800Ω with DTGC support
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch

TX73L64 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches), 32 LNA circuits, and supports on-chip beamformer (TxBF). The T/R switches also perform a 2:1 multiplexing operation to multiplex inputs of 2 channels to 1 LNA. The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX73L64 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.

Device can be used as a transmitter device for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

TX73L64 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches), 32 LNA circuits, and supports on-chip beamformer (TxBF). The T/R switches also perform a 2:1 multiplexing operation to multiplex inputs of 2 channels to 1 LNA. The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX73L64 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.

Device can be used as a transmitter device for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

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Documentación técnica

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Tipo Título Fecha
* Data sheet TX73L64 3-Level, 64-Channel Transmitter with On-Chip Beamformer, T/R Switch, 32- Channel Multiplexed Receivers with LNA datasheet PDF | HTML 29 abr 2025
Application note An Overview of TI's Transmitter Products for Ultrasound Applications PDF | HTML 08 jul 2025
Certificate TX73L64EVM EU Declaration of Conformity (DoC) 28 feb 2025

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TX73L64EVM — Módulo de evaluación TX73L64

El TX73L64EVM se usa para la evaluación del dispositivo TX73L64 bajo diversas fuerzas de accionamiento, distintos niveles de tensión y distintos modos del dispositivo. El módulo de evaluación contiene todas las señales de control necesarias y la generación de energía integrada, lo que reduce la (...)
Controlador o biblioteca

TX73L64-DESIGN TX73L64 design resources

The full data sheet and other design resources for this device are available here
Productos y hardware compatibles

Productos y hardware compatibles

Productos
AFE de ultrasonido
TX73L64 Pulsador de 64 canales, 3 niveles, 1 A con formador de haces de transmisión integrado y amplificador
Desarrollo de hardware
Placa de evaluación
TX73L64EVM Módulo de evaluación TX73L64
Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® para TI es un entorno de diseño y simulación que ayuda a evaluar la funcionalidad de los circuitos analógicos. Esta completa suite de diseño y simulación utiliza un motor de análisis analógico de Cadence®. Disponible sin ningún costo, PSpice para TI incluye una de las bibliotecas de modelos (...)
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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