홈 마이크로컨트롤러(MCU) 및 프로세서 Microcontrollers Real-time motor control & automation MCUs
홈
마이크로컨트롤러(MCU) 및 프로세서
Microcontrollers
Real-time motor control & automation MCUs

AM263P2

활성

opTI 플래시 및 실시간 제어를 지원하는 최대 400MHz의 듀얼 코어 Arm®Cortex®-R5F MCU | ZCZ | 324

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AM263P2

활성
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제품 상세 정보

CPU Arm Cortex-R5F ADC type 5 12-bit SAR Total processing (MIPS) 0.0008 Features Automation, CAN, CAN FD, EnDat 2.2, EtherCAT, EtherNet/IP, Ethernet, External memory interface, Hardware encryption (AES/DES/SHA/MD5), I2C, IO-Link, Integrated industrial protocols, OSPI, Profinet, QSPI, SD/SDIO, SPI, UART UART 6 CAN (#) 8 (CAN-FD) PWM (Ch) 64 Number of ADC channels 30 SPI 8 Operating temperature range (°C) -40 to 125 Rating Catalog Communication interface CAN, CAN-FD, I2C, OSPI, QSPI, SD/SDIO, SPI, UART Operating system BareMetal (No OS), FreeRTOS, ThreadX, Zephyr RTOS Hardware accelerators Trigonometric math accelerator Edge AI enabled Yes Number of GPIOs 140 Security Cryptographic acceleration, Device lifecycle management, Secure boot, Secure debug, Secure provisioning
CPU Arm Cortex-R5F ADC type 5 12-bit SAR Total processing (MIPS) 0.0008 Features Automation, CAN, CAN FD, EnDat 2.2, EtherCAT, EtherNet/IP, Ethernet, External memory interface, Hardware encryption (AES/DES/SHA/MD5), I2C, IO-Link, Integrated industrial protocols, OSPI, Profinet, QSPI, SD/SDIO, SPI, UART UART 6 CAN (#) 8 (CAN-FD) PWM (Ch) 64 Number of ADC channels 30 SPI 8 Operating temperature range (°C) -40 to 125 Rating Catalog Communication interface CAN, CAN-FD, I2C, OSPI, QSPI, SD/SDIO, SPI, UART Operating system BareMetal (No OS), FreeRTOS, ThreadX, Zephyr RTOS Hardware accelerators Trigonometric math accelerator Edge AI enabled Yes Number of GPIOs 140 Security Cryptographic acceleration, Device lifecycle management, Secure boot, Secure debug, Secure provisioning
NFBGA (ZCZ) 324 225 mm² 15 x 15

Processor Cores:

  • Single, dual, and quad-core Arm Cortex-R5F MCU with each core running up to 400MHz
    • 16KB I-cache with 64-bit ECC per CPU core
    • 16KB D-cache with 32-bit ECC per CPU core
    • x256 integrated VIM per CPU Core
    • 256KB Tightly-Coupled Memory (TCM) with 32-bit ECC per CPU core cluster
    • Lockstep or Dual-core capable clusters
  • Trigonometric Math Unit (TMU) for accelerating trigonometric functions
    • Up to 4x, one per R5F MCU core

Memory:

  • 1x Flash Subsystem with OptiFlash memory technology and eXecute In Place (XIP) support
    • 1x Octal Serial Peripheral Interface (OSPI), up to 133MHz SDR and DDR
    • AM263P Flash-in-Package (ZCZ_F) variant includes 8MB OSPI Flash
  • 3MB of On-Chip RAM (OCSRAM)
    • 6 Banks x 512KB
    • ECC error protection
    • Internal DMA engine support
    • Remote L2 Cache for external memory, software programmable up to 128KB per CPU core

System on Chip (SoC) Services and Architecture:

  • 1x EDMA to support data movement functions
    • 2x Transfer Controllers (TPTC)
    • 1x Channel Controller (TPCC)
  • Device Boot supported from the following interfaces:
    • UART (Primary/Backup)
    • QSPI NOR Flash (4S/1S) (Primary)
    • OSPI NOR Flash (8S 50MHz SDR Mode0, 8S 25MHz DDR XSPI) (Primary)
  • Interprocessor communication modules
    • SPINLOCK module for synchronizing processes running on multiple cores
    • MAILBOX functionality implemented through CTRLMMR registers
  • Central Platform Time Sync (CPTS) support with time-sync and compare-event interrupt routers
  • Timer Modules:
    • 4x Windowed Watchdog Timer (WWDT)
    • 8x Real Time Interrupt (RTI) timer

General Connectivity:

  • 6x Universal Asynchronous RX-TX (UART)
  • 8x Serial Peripheral Interface (SPI) controllers
  • 5x Local Interconnect Network (LIN) ports
  • 4x Inter-Integrated Circuit (I2C) ports
  • 8x Modular Controller Area Network (MCAN) modules with CAN-FD support
  • 4x Fast Serial Interface Transmitters (FSITX)
  • 4x Fast Serial Interface Receivers (FSIRX)
  • Up to 139 General-Purpose I/O (GPIO) pins

Sensing & Actuation:

  • Real-time Control Subsystem (CONTROLSS)
  • Flexible Input/Output Crossbars (XBAR)
  • 5x 12-bit Analog-to-Digital Converters (ADC)
    • 6-input SAR ADC up to 4MSPS
      • 6x Single-ended channels OR
      • 3x Differential channels
    • Highly Configurable ADC Digital Logic
      • XBAR Start of Conversion Triggers (SOC)
      • User-defined Sample and Hold (S+H)
      • Flexible Post-processing Blocks (PPB)
  • 1x Resolver subsystem (ZCZ-S and ZCZ-F packages) with:
    • 2x Resolver to Digital Converter (RDC) OR
    • 2x 12-bit ADCs can also be used for general purpose
      • 4-input SAR ADC up to 3MSPS
        • 4x Single-ended channels OR
        • 2x Differential channels
  • 10x Analog Comparators with Type-A programmable DAC reference (CMPSSA)
  • 10x Analog Comparators with Type-B programmable DAC reference (CMPSSB)
  • 1x 12-bit Digital-to-Analog Converter (DAC)
  • 32x Pulse Width Modulation (EPWM) modules
    • Single or Dual PWM channels
    • Advanced PWM Configurations
    • Extended HRPWM time resolution
  • 16x Enhanced Capture (ECAP) modules
  • 3x Enhanced Quadrature Encoder Pulse (EQEP) modules
  • 2x 4-Ch Sigma-Delta Filter Modules (SDFM)
  • Additional Signal-multiplex Crossbars (XBAR)

Industrial Connectivity:

  • Programmable Real-Time Unit - Industrial Communication Subsystem (PRU-ICSS)
    • Dual core Programmable Real-Time Unit Subsystem (PRU0 / PRU1)
      • Deterministic Hardware
      • Dynamic Firmware
    • 20-channel enhanced input (eGPI) per PRU
    • 20-channel enhanced output (eGPO) per PRU
    • Embedded Peripherals and Memory
      • 1x UART, 1x ECAP, 1x MDIO, 1x IEP
      • 1x 32KB Shared General Purpose RAM
      • 2x 8KB Shared Data RAM
      • 1x 16KB IRAM per PRU
      • ScratchPad (SPAD), MAC/CRC
    • Digital encoder and sigma-delta control loops
    • The PRU-ICSS enables advanced industrial protocols including:
      • EtherCAT, Ethernet/IP™,
      • PROFINET, IO-Link for order
    • Dedicated Interrupt Controller (INTC)
    • Dynamic CONTROLSS XBAR Integration

High-Speed Interfaces:

  • Integrated 3-port Gigabit Ethernet switch (CPSW) supporting up to two external ports
    • MII (10/100), RMII (10/100), or RGMII (10/100/1000)
    • IEEE 1588 (2008 Annex D, Annex E, Annex F) with 802.1AS PTP
    • Clause 45 MDIO PHY management
    • 512x ALE engine-based Packet Classifiers
    • Priority flow control with up to 2KB packet size
    • Four CPU hardware interrupt pacing
    • IP/UDP/TCP checksum offload in hardware

Security:

  • Hardware Security Module (HSM) with support for Auto SHE 1.1/EVITA
    • Arm Cortex-M4F based dedicated security controller
    • Isolated and secured RAMs
    • Peripherals like Timers, WWDT, RTC, Interrupt Controller
    • Safety related peripherals like CRC, ESM, PBIST
  • Secure boot support
    • Device Take Over Protection
    • Hardware-enforced root-of-trust (RoT)
      • Support for two sets of RoT keys
    • Authenticated boot support
      • Encrypted boot support
    • SW Anti-rollback protection
  • Debug security
    • Secure device debug only after cryptographic authentication
    • Support for permanent debug/JTAG disable
  • Device ID and Key Management
    • Unique ID (SoC ID)
    • Support for OTP Memory (FUSEROM)
  • Extensive Firewall Support
    • System Memory Protection Units (MPU) present at various interfaces
  • Cryptographic Acceleration
    • Cryptographic cores with DMA Support
    • AES - 128/192/256-bit key sizes
    • SHA2 - 256/384/512-bit support
    • Deterministic random bit generator (DRBG) with pseudo and true random number generator (TRNG)
    • Public Key Accelerator (PKA) to assist in RSA/Elliptic Curve Cryptography (ECC) processing

Functional Safety:

  • Enables design of systems with functional safety requirements
    • Error Signaling Module (ESM) with designated SAFETY_ERRORn pin
    • ECC or parity on calculation-critical memories
    • 4x Dual Clock Comparators (DCC)
    • 3x Self-Test Controller (STC)
    • Programmable Built-In Self-Test (PBIST) and fault-injection for CPU and on-chip RAM
    • Runtime internal diagnostic modules including voltage, temperature, and clock monitoring, windowed watchdog timers, CRC engines for memory integrity checks
  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation to be made available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL-3 targeted
    • Hardware integrity up to SIL-3 targeted
    • Safety-related certification
      • IEC 61508 planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation to be made available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL-D targeted
    • Hardware integrity up to ASIL-D targeted
    • Safety-related certification
      • ISO 26262 planned

Data Storage

  • 1x 4-bit Multi-Media Card/Secure Digital (MMC/SD) interface

Power Management

  • Recommended TPS653860-Q1 Power Management ICs (PMIC)
    • Companion PMIC specially designed to meet device power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Technology / Package:

  • AEC-Q100 qualified for automotive applications
  • 45nm technology
  • ZCZ Package
    • AM263x Compatible (ZCZ-C)
      • Pin-to-Pin compatible option with AM263x
    • AM263Px Resolver (ZCZ-S)
      • Adds new Resolver Subsystem functionality
    • AM263Px Resolver with Flash-in-Package (ZCZ-F)
      • Includes 1x internally connected Silicon in Package (SIP) 64Mb ISSI IS25LX064-JWLA3 OSPI Flash device; up to 133MHz SDR and DDR
    • 324-pin NFBGA
    • 15.0mm x 15.0mm
    • 0.8mm pitch

Processor Cores:

  • Single, dual, and quad-core Arm Cortex-R5F MCU with each core running up to 400MHz
    • 16KB I-cache with 64-bit ECC per CPU core
    • 16KB D-cache with 32-bit ECC per CPU core
    • x256 integrated VIM per CPU Core
    • 256KB Tightly-Coupled Memory (TCM) with 32-bit ECC per CPU core cluster
    • Lockstep or Dual-core capable clusters
  • Trigonometric Math Unit (TMU) for accelerating trigonometric functions
    • Up to 4x, one per R5F MCU core

Memory:

  • 1x Flash Subsystem with OptiFlash memory technology and eXecute In Place (XIP) support
    • 1x Octal Serial Peripheral Interface (OSPI), up to 133MHz SDR and DDR
    • AM263P Flash-in-Package (ZCZ_F) variant includes 8MB OSPI Flash
  • 3MB of On-Chip RAM (OCSRAM)
    • 6 Banks x 512KB
    • ECC error protection
    • Internal DMA engine support
    • Remote L2 Cache for external memory, software programmable up to 128KB per CPU core

System on Chip (SoC) Services and Architecture:

  • 1x EDMA to support data movement functions
    • 2x Transfer Controllers (TPTC)
    • 1x Channel Controller (TPCC)
  • Device Boot supported from the following interfaces:
    • UART (Primary/Backup)
    • QSPI NOR Flash (4S/1S) (Primary)
    • OSPI NOR Flash (8S 50MHz SDR Mode0, 8S 25MHz DDR XSPI) (Primary)
  • Interprocessor communication modules
    • SPINLOCK module for synchronizing processes running on multiple cores
    • MAILBOX functionality implemented through CTRLMMR registers
  • Central Platform Time Sync (CPTS) support with time-sync and compare-event interrupt routers
  • Timer Modules:
    • 4x Windowed Watchdog Timer (WWDT)
    • 8x Real Time Interrupt (RTI) timer

General Connectivity:

  • 6x Universal Asynchronous RX-TX (UART)
  • 8x Serial Peripheral Interface (SPI) controllers
  • 5x Local Interconnect Network (LIN) ports
  • 4x Inter-Integrated Circuit (I2C) ports
  • 8x Modular Controller Area Network (MCAN) modules with CAN-FD support
  • 4x Fast Serial Interface Transmitters (FSITX)
  • 4x Fast Serial Interface Receivers (FSIRX)
  • Up to 139 General-Purpose I/O (GPIO) pins

Sensing & Actuation:

  • Real-time Control Subsystem (CONTROLSS)
  • Flexible Input/Output Crossbars (XBAR)
  • 5x 12-bit Analog-to-Digital Converters (ADC)
    • 6-input SAR ADC up to 4MSPS
      • 6x Single-ended channels OR
      • 3x Differential channels
    • Highly Configurable ADC Digital Logic
      • XBAR Start of Conversion Triggers (SOC)
      • User-defined Sample and Hold (S+H)
      • Flexible Post-processing Blocks (PPB)
  • 1x Resolver subsystem (ZCZ-S and ZCZ-F packages) with:
    • 2x Resolver to Digital Converter (RDC) OR
    • 2x 12-bit ADCs can also be used for general purpose
      • 4-input SAR ADC up to 3MSPS
        • 4x Single-ended channels OR
        • 2x Differential channels
  • 10x Analog Comparators with Type-A programmable DAC reference (CMPSSA)
  • 10x Analog Comparators with Type-B programmable DAC reference (CMPSSB)
  • 1x 12-bit Digital-to-Analog Converter (DAC)
  • 32x Pulse Width Modulation (EPWM) modules
    • Single or Dual PWM channels
    • Advanced PWM Configurations
    • Extended HRPWM time resolution
  • 16x Enhanced Capture (ECAP) modules
  • 3x Enhanced Quadrature Encoder Pulse (EQEP) modules
  • 2x 4-Ch Sigma-Delta Filter Modules (SDFM)
  • Additional Signal-multiplex Crossbars (XBAR)

Industrial Connectivity:

  • Programmable Real-Time Unit - Industrial Communication Subsystem (PRU-ICSS)
    • Dual core Programmable Real-Time Unit Subsystem (PRU0 / PRU1)
      • Deterministic Hardware
      • Dynamic Firmware
    • 20-channel enhanced input (eGPI) per PRU
    • 20-channel enhanced output (eGPO) per PRU
    • Embedded Peripherals and Memory
      • 1x UART, 1x ECAP, 1x MDIO, 1x IEP
      • 1x 32KB Shared General Purpose RAM
      • 2x 8KB Shared Data RAM
      • 1x 16KB IRAM per PRU
      • ScratchPad (SPAD), MAC/CRC
    • Digital encoder and sigma-delta control loops
    • The PRU-ICSS enables advanced industrial protocols including:
      • EtherCAT, Ethernet/IP™,
      • PROFINET, IO-Link for order
    • Dedicated Interrupt Controller (INTC)
    • Dynamic CONTROLSS XBAR Integration

High-Speed Interfaces:

  • Integrated 3-port Gigabit Ethernet switch (CPSW) supporting up to two external ports
    • MII (10/100), RMII (10/100), or RGMII (10/100/1000)
    • IEEE 1588 (2008 Annex D, Annex E, Annex F) with 802.1AS PTP
    • Clause 45 MDIO PHY management
    • 512x ALE engine-based Packet Classifiers
    • Priority flow control with up to 2KB packet size
    • Four CPU hardware interrupt pacing
    • IP/UDP/TCP checksum offload in hardware

Security:

  • Hardware Security Module (HSM) with support for Auto SHE 1.1/EVITA
    • Arm Cortex-M4F based dedicated security controller
    • Isolated and secured RAMs
    • Peripherals like Timers, WWDT, RTC, Interrupt Controller
    • Safety related peripherals like CRC, ESM, PBIST
  • Secure boot support
    • Device Take Over Protection
    • Hardware-enforced root-of-trust (RoT)
      • Support for two sets of RoT keys
    • Authenticated boot support
      • Encrypted boot support
    • SW Anti-rollback protection
  • Debug security
    • Secure device debug only after cryptographic authentication
    • Support for permanent debug/JTAG disable
  • Device ID and Key Management
    • Unique ID (SoC ID)
    • Support for OTP Memory (FUSEROM)
  • Extensive Firewall Support
    • System Memory Protection Units (MPU) present at various interfaces
  • Cryptographic Acceleration
    • Cryptographic cores with DMA Support
    • AES - 128/192/256-bit key sizes
    • SHA2 - 256/384/512-bit support
    • Deterministic random bit generator (DRBG) with pseudo and true random number generator (TRNG)
    • Public Key Accelerator (PKA) to assist in RSA/Elliptic Curve Cryptography (ECC) processing

Functional Safety:

  • Enables design of systems with functional safety requirements
    • Error Signaling Module (ESM) with designated SAFETY_ERRORn pin
    • ECC or parity on calculation-critical memories
    • 4x Dual Clock Comparators (DCC)
    • 3x Self-Test Controller (STC)
    • Programmable Built-In Self-Test (PBIST) and fault-injection for CPU and on-chip RAM
    • Runtime internal diagnostic modules including voltage, temperature, and clock monitoring, windowed watchdog timers, CRC engines for memory integrity checks
  • Functional Safety-Compliant targeted [Industrial]
    • Developed for functional safety applications
    • Documentation to be made available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL-3 targeted
    • Hardware integrity up to SIL-3 targeted
    • Safety-related certification
      • IEC 61508 planned
  • Functional Safety-Compliant targeted [Automotive]
    • Developed for functional safety applications
    • Documentation to be made available to aid ISO 26262 functional safety system design
    • Systematic capability up to ASIL-D targeted
    • Hardware integrity up to ASIL-D targeted
    • Safety-related certification
      • ISO 26262 planned

Data Storage

  • 1x 4-bit Multi-Media Card/Secure Digital (MMC/SD) interface

Power Management

  • Recommended TPS653860-Q1 Power Management ICs (PMIC)
    • Companion PMIC specially designed to meet device power supply requirements
    • Flexible mapping and factory programmed configurations to support different use cases

Technology / Package:

  • AEC-Q100 qualified for automotive applications
  • 45nm technology
  • ZCZ Package
    • AM263x Compatible (ZCZ-C)
      • Pin-to-Pin compatible option with AM263x
    • AM263Px Resolver (ZCZ-S)
      • Adds new Resolver Subsystem functionality
    • AM263Px Resolver with Flash-in-Package (ZCZ-F)
      • Includes 1x internally connected Silicon in Package (SIP) 64Mb ISSI IS25LX064-JWLA3 OSPI Flash device; up to 133MHz SDR and DDR
    • 324-pin NFBGA
    • 15.0mm x 15.0mm
    • 0.8mm pitch

The AM263Px Sitara™ Arm® Microcontrollers are built to meet the complex real-time processing needs of next generation industrial and automotive embedded products. The AM263Px MCU family consists of multiple pin-to-pin compatible devices with up to four 400MHz Arm® Cortex®-R5F cores. As an option, the Arm® R5F subsystem can be programmed to run in lockstep or dual-core mode for multiple functional safety configurations. The industrial communications subsystem (PRU-ICSS) enables integrated industrial Ethernet communication protocols such as PROFINET®, Ethernet/IP®, EtherCAT® (among many others), standard Ethernet connectivity, and even custom I/O interfaces. The family is designed for the future of motor control and digital power applications with advanced analog sensing and digital actuation modules.

The multiple R5F cores are arranged in cluster subsystems with 256KB of shared tightly coupled memory (TCM) along with 3MB of shared SRAM, greatly reducing the need for external memory. Extensive ECC is included for on-chip memories, peripherals, and interconnects for enhanced reliability. Granular firewalls managed by the Hardware Security Manager (HSM) enable developers to implement stringent security-minded system design requirements. Cryptographic acceleration and secure boot are also available on AM263Px devices.

TI provides a complete set of microcontroller software and development tools for the AM263Px family of microcontrollers.

The AM263Px Sitara™ Arm® Microcontrollers are built to meet the complex real-time processing needs of next generation industrial and automotive embedded products. The AM263Px MCU family consists of multiple pin-to-pin compatible devices with up to four 400MHz Arm® Cortex®-R5F cores. As an option, the Arm® R5F subsystem can be programmed to run in lockstep or dual-core mode for multiple functional safety configurations. The industrial communications subsystem (PRU-ICSS) enables integrated industrial Ethernet communication protocols such as PROFINET®, Ethernet/IP®, EtherCAT® (among many others), standard Ethernet connectivity, and even custom I/O interfaces. The family is designed for the future of motor control and digital power applications with advanced analog sensing and digital actuation modules.

The multiple R5F cores are arranged in cluster subsystems with 256KB of shared tightly coupled memory (TCM) along with 3MB of shared SRAM, greatly reducing the need for external memory. Extensive ECC is included for on-chip memories, peripherals, and interconnects for enhanced reliability. Granular firewalls managed by the Hardware Security Manager (HSM) enable developers to implement stringent security-minded system design requirements. Cryptographic acceleration and secure boot are also available on AM263Px devices.

TI provides a complete set of microcontroller software and development tools for the AM263Px family of microcontrollers.

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23개 모두 보기
상위 문서 유형 직함 형식 옵션 날짜
* Data sheet AM263Px Sitara™ Microcontrollers with Optional Flash-in-Package datasheet (Rev. D) PDF | HTML 2025/05/19
* User guide AM263Px Sitara Microcontrollers Technical Reference Manual (Rev. D) PDF | HTML 2025/07/29
* User guide AM263Px Sitara Microcontrollers Register Addendum (Rev. B) 2025/06/02
Application note AM26 Ethercat SubDevice with TwinCat PDF | HTML 2025/12/10
White paper Integrating EVCC, DCDC, and Host Architecture: TI Automotive MCUs for Next-Generation EV Charging (Rev. A) PDF | HTML 2025/11/13
Functional safety information AM263Px TÜV SÜD Functional Safety Certificate 2025/05/27
Functional safety information AM263Px TÜV SÜD Functional Safety Certificate Report 2025/05/27
Application note AM26x Custom PCB System Getting Started Guide (Rev. A) PDF | HTML 2025/05/13
White paper AM261x 和 AM263Px 使用的工业通信协议 PDF | HTML 2025/05/12
User guide AM26x Hardware Design Guidelines (Rev. D) PDF | HTML 2025/05/02
User guide AM263Px MCAL user guide 2025/04/28
Functional safety information AM263x and AM263Px Software Diagnostics Library TUV SUD Functional Safety Certificate (Rev. A) 2025/02/25
Application note Microcontroller Abstraction Layer on Jacinto™ and Sitara™ Embedded Processors PDF | HTML 2025/01/28
Application note AM26x Family Migration Overview (Rev. A) PDF | HTML 2024/11/15
Application brief Achieving Faster Secure Boot Time on AM26x Devices PDF | HTML 2024/11/13
Application note MCU로의 절연 모듈레이터 디지털 인터페이스를 사용한 클록 에지 지 연 보상 (Rev. A) PDF | HTML 2024/08/21
User guide AM263P OSPI, QSPI Flash Selection Guide PDF | HTML 2024/04/22
Application note OptiFlash Memory Technology (Rev. A) PDF | HTML 2023/11/27
Product overview Functional Safety for AM2x and Hercules™ Microcontrollers PDF | HTML 2023/11/08
Application note Integration of MbedTLS on SITARA MCU Devices PDF | HTML 2023/08/03
White paper Time Sensitive Networking for Industrial Automation (Rev. C) 2023/07/31
Certificate BP-AM2BLDCSERVO EU Declaration of Conformity (DoC) 2023/06/28
Application note Intra Drive Communication Using 8b-10b Line Code With Programmable Real Time Uni PDF | HTML 2023/05/24

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TMDSHSECDOCK-AM263 — GPMC, JTAG/TRACE, MCAN 및 LIN 신호용 AM263x-CC HSEC 도크 및 브레이크아웃 보드.

이 평가 모듈은 TMDSCNCD263(AM263x controlCARD) 및 TMDSCNCD263P(AM263Px controlCARD)용 HSEC(고속 에지 카드) 도크이며 키 I/O 및 하드웨어 주변 장치를 분해합니다. 이 보드에는 평가 및 개발 단계의 고객을 위한 AM263x 및 AM263Px에 대한 MCU+ SDK의 기능이 표시됩니다. TMDSHSECDOCK의 기능 외에도 이 보드에는 CAN/LIN, GPMC(AM263x만 해당), 추적 및 JTAG와 같은 추가 AM263x 및 AM263Px 제품군 기능에 대한 하드웨어 (...)
사용 설명서: PDF | HTML
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LB-3P-TRACE32-ARM — Arm® 기반 마이크로컨트롤러 및 프로세서용 Lauterbach TRACE32® 디버그 및 트레이스 시스템

Lauterbach의 TRACE32® 툴은 개발자가 모든 종류의 Arm® 기반 마이크로컨트롤러 및 프로세서를 분석, 최적화 및 인증할 수 있도록 하는 첨단 하드웨어 및 소프트웨어 구성 요소 제품군입니다. 세계적으로 유명한 임베디드 시스템 및 SoC용 디버그 및 트레이스 솔루션은 초기 사전 실리콘 개발부터 현장의 제품 인증 및 문제 해결에 이르기까지 모든 개발 단계를 위한 완벽한 솔루션입니다. Lauterbach 툴의 직관적인 모듈형 설계는 엔지니어에게 현존하는 최고의 성능을 제공하고 요구 사항 변화에 따라 적응하고 성장하는 (...)

발송: Lauterbach GmbH
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디버그 프로브

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

발송: TASKING Germany GmbH
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소프트웨어 개발 키트(SDK)

AM263PX-MCAL-SDK — Microcontroller Abstraction Layer (MCAL) and Complex Device Drivers (CDD) for AM263PX

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
요청
소프트웨어 개발 키트(SDK)

AM263PX-RESTRICTED-SECURITY — AM263Px restricted security content

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
요청
소프트웨어 개발 키트(SDK)

IBV-3P-ICECAT — 임베디드 시스템용 IBV EtherCAT MainDevice SDK

The icECAT EtherCAT Master Stack library by IBV is a Software Development Kit (SDK) for creating an EtherCAT MainDevice (master) system achieving best performance with lowest resource usage. It is especially designed for use on embedded systems with optimized Link Layer drivers with DMA support (...)
발송: IBV - Echtzeit- und Embedded GmbH & Co. KG
파트너 사이트 방문
소프트웨어 개발 키트(SDK)

INDUSTRIAL-COMMUNICATIONS-SDK-AM263PX — Industrial Communications SDK for AM263Px

This software development kit (SDK) includes real-time industrial communication protocols (EtherCAT, EtherNet/IP, PROFINET, IO-Link, etc.) on TI processors. It also has PRU-ICSS firmware, drivers, communication stack libraries, and application examples, along with documentation.

What's new:

  • (...)
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
찾아보기 다운로드 옵션
소프트웨어 개발 키트(SDK)

MCU-PLUS-SDK-AM263PX — MCU+ SDK for AM263Px - RTOS, No-RTOS

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
찾아보기 다운로드 옵션
소프트웨어 개발 키트(SDK)

MOTOR-CONTROL-SDK-AM263PX — Motor control SDK for AM263Px

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
찾아보기 다운로드 옵션
애플리케이션 소프트웨어 및 프레임워크

AM263PX-RESTRICTED-SAFETY — AM263Px restricted functional safety content

The AM263Px microcontroller (MCU) plus software development kit (SDK) is a unified software platform for embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demonstrations. This software accelerates application development schedules by eliminating (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
요청
펌웨어

USIT-3P-SECIC-HSM — Uni-Sentry SecIC-HSM 펌웨어

SecIC-HSM은 MCU/SoC 칩에 필요한 사이버 보안 요건을 충족하도록 설계되었습니다. HSM 펌웨어는 자동차, 신에너지, 태양광, 로봇 공학, 헬스케어, 항공 등의 분야에 적용될 수 있습니다. 이용 가능한 사이버 보안 기능으로는 보안 부팅, SecOC(보안 통신), 보안 진단, 보안 스토리지, 보안 업데이트, 보안 디버깅 및 키 관리 등이 있습니다. SecIC-HSM의 장점: 여러 칩 시리즈와 종합적인 소프트웨어 호환성을 지원하는 원스톱 사이버 보안 솔루션으로, 업계를 선도하는 성능을 제공하며, 약 30곳의 OEM 대량 (...)
발송: Shanghai Uni-Sentry Intelligent Technology Co., LTD
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펌웨어

USIT-3P-SECIC-PQC — Uni-Sentry SecIC-PQC 알고리즘 펌웨어

Uni-Sentry의 보안 솔루션은 양자 컴퓨터가 기존의 암호화 알고리즘에 미치는 복호화 위협에 맞설 수 있는 PQC 알고리즘을 채택합니다. PQC 펌웨어는 HSM(Hardware Security Module)과 공동 최적화되어 하드웨어 가속 및 보안 향상을 활용해 암호화 알고리즘 실행 효율성과 보안을 개선합니다. 


Uni-Sentry는 세계의 양자 컴퓨팅 발전 양상을 꾸준히 모니터링하여 자사 알고리즘 포트폴리오를 업데이트합니다. 현재 PQC 제품 기능의 예를 들면 다음과 같습니다:

  • SP 800-208: LMS 및 XMSS 
  • (...)
발송: Shanghai Uni-Sentry Intelligent Technology Co., LTD
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시작하기

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작하기
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
IDE, 구성, 컴파일러 또는 디버거

SYSCONFIG — Standalone desktop version of SysConfig

SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.

SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
온라인 교육

AM26X-ACADEMY — AM26x Academy

AM26x Academy features easy-to-use training modules ranging from the basics of getting started to advanced development topics.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
찾아보기
소프트웨어 프로그래밍 도구

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
시작 다운로드 옵션
지원 소프트웨어

MATHW-3P-AM26X-EC — 텍사스 인스트루먼트 AM26x MCU 임베디드 코더 지원 패지

TI는 다양한 AM26x 장치 및 평가 보드를 위한 모델 기반 설계 워크플로를 제공합니다.

AM26x controlCARD 및 LaunchPad 보드용 Embedded Coder® 지원 패키지를 사용하면 Simulink® 모델을 사용하여 AM26x 장치에서 알고리즘을 자동으로 빌드, 로드 및 실행할 수 있습니다.  Simulink에서 모델을 설계하고, 임베디드 코더를 사용하여 코드를 생성하고, 수동 프로그래밍을 사용하지 않고 실시간 제어 애플리케이션용으로 설계된 AM263x, AM263Px, AM261x 하드웨어 플랫폼에서 실행 (...)
발송: MathWorks, Inc.
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시뮬레이션 모델

AM263Px BSDL Model

SPRM835.ZIP (9 KB) - BSDL Model
다운로드
시뮬레이션 모델

AM263Px IBIS Model

SPRM834.ZIP (4124 KB) - IBIS Model
다운로드
시뮬레이션 모델

AM263Px Thermal Model

SPRM833.ZIP (6 KB) - Thermal Model
다운로드
계산 툴

AM263PX-PWR-EST-CALC — AM263Px power-estimation tool

The power estimation spreadsheet provides power consumption estimates based on measured and simulated data; they are provided “as is” and are not ensured within a specified precision.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어
다운로드 옵션
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
NFBGA (ZCZ) 324 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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