제품 상세 정보

Type Module, Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -30 to 85 Rating Catalog
Type Module, Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -30 to 85 Rating Catalog
QFM (MOG) 35 98 mm² 14 x 7
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

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기술 자료

star =TI에서 선정한 이 제품의 인기 문서
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22개 모두 보기
유형 직함 날짜
* Data sheet CC2564MODx Bluetooth® Host Controller Interface (HCI) Module datasheet (Rev. E) 2016/01/16
* Radiation & reliability report CC2564MODA Reliability Data – Reliability Estimate 2019/06/25
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022/05/13
Selection guide 무선 연결 기술 선택 가이드 (Rev. B) 2022/03/07
Certificate CC2564MODA EC Declaration of Conformity (DoC) (Rev. A) 2021/03/03
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 2021/01/15
User guide CC2564x Demo Applications User's Guide PDF | HTML 2020/12/17
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020/05/18
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020/05/18
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 2019/01/07
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 2017/10/16
White paper Which TI Bluetooth® solution should I choose? 2017/05/05
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 2017/05/04
More literature Streamline the challenges of RF design with certified wireless modules 2017/01/25
Technical article Maximize your IoT design with new dual-mode Bluetooth® + MSP432™ MCU bundle PDF | HTML 2016/12/22
Technical article Driving industrial markets with TI’s dual-mode Bluetooth® module PDF | HTML 2016/05/05
Technical article The dual-mode Bluetooth® module you’ve been waiting for is here PDF | HTML 2016/02/17
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) 2016/02/03
User guide TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide PDF | HTML 2015/07/08
User guide Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board 2015/07/07
User guide CC2564MODA Evaluation Board Quick Start Guide 2015/07/01
White paper Three Flavors of Bluetooth: Which One to Choose? 2014/03/25

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

BOOST-CC2564MODA — TMP107 온도 센서 데이지 체인 BoosterPack™ 플러그인 모듈

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

사용 설명서: PDF
TI.com에서 구매 불가
평가 보드

CC2564MODAEM — 통합 안테나 평가 보드를 갖춘 듀얼 모드 Bluetooth® CC2564 모듈

The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.


For a complete evaluation solution, (...)

사용 설명서: PDF | HTML
TI.com에서 구매 불가
평가 보드

CC2564MODNEM — 듀얼 모드 Bluetooth® CC2564 모듈 평가 보드

The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.

For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)

사용 설명서: PDF
TI.com에서 구매 불가
평가 보드

CC256XQFNEM — 듀얼 모드 Bluetooth® CC2564 평가 보드

CC256XQFNEM 평가 보드는 CC2564B 장치를 포함하고 있으며 CC256x 장치의 평가 및 설계 목적으로 설계되었습니다.

완벽한 평가 솔루션을 위해 CC256XQFNEM 보드는 TI 하드웨어 개발 키트에 직접 연결됩니다. MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X 및 기타 MCU. 또한 MSP430(CC256XMSPBTBLESW), TM4C12x MCU(CC256XM4BTBLESW) 및 기타 MCU(CC256XSTBTBLESW)에 대해 인증되고 로열티가 없는 TI Bluetooth (...)

사용 설명서: PDF
TI.com에서 구매 불가
인터페이스 어댑터

CC256XSTBTBLESW — STM32F4 MCU의 TI 듀얼 모드 Bluetooth® 스택

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)

사용 설명서: PDF | HTML
소프트웨어 개발 키트(SDK)

TIBLUETOOTHSTACK-SDK — TI 듀얼 모드 Bluetooth® 스택

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

사용 설명서: PDF | HTML
드라이버 또는 라이브러리

CC256XB-BT-SP — CC256xB용 Bluetooth 서비스 팩

The package contains Init Scripts (for BT4.0 and BT4.1) and Add-Ons (for Audio/Voice Processing and for BLE support).

CC256x -BT-SP

The CC256x Bluetooth Service Packs (SP) are mandatory initialization scripts that contain bug fixes and platform specific configurations. They must be loaded into the (...)

사용 설명서: PDF
드라이버 또는 라이브러리

CC256XM4BTBLESW — TM4C MCU에 대한 TI 듀얼 모드 Bluetooth® 스택

TI’s Dual-mode Bluetooth stack on TM4C MCUs software for Bluetooth + Bluetooth Low Energy enables the TM4C12x MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), provides (...)
사용 설명서: PDF
드라이버 또는 라이브러리

CC256XMS432BTBLESW — MSP432 MCU의 TI 듀얼 모드 Bluetooth 스택

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
사용 설명서: PDF
드라이버 또는 라이브러리

CC256XMSPBTBLESW — MSP430™ MCU에 있는 TI 듀얼 모드 Bluetooth® 스택

TI’s Dual-mode Bluetooth stack on MSP430™ MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP430 MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), (...)
사용 설명서: PDF
드라이버 또는 라이브러리

TI-BT-STACK-LINUX-ADDON — WL18xx 및 CC256x를 지원하는 AM335x EVM, AM437x EVM and BeagleBone용 TI Bluetooth Linux 애드온

This package contains the install package, pre-compiled object and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM or BeagleBone. The software was built with Linaro GCC 4.7 and can be added to Linux SDKs that use (...)
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.

시작 다운로드 옵션
인증

CC256X-CERTIFICATION — 듀얼 모드 Bluetooth에 대한 무선 인증

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
인증

CC256X-REPORTS Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Wi-Fi 제품
CC2564 EDR(Enhanced Data Rate), LE(Low Energy) 및 ANT를 지원하는 Bluetooth ® 4.0 CC2564C BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy)를 지원하는 Bluetooth® 5.1 CC2564MODA 안테나가 통합된 BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy) 모듈이 포함된 Bluetooth ® 4.1 CC2564MODN BR(Basic Rate), EDR(Enhanced Data Rate), LE(Low Energy) 모듈이 포함된 Bluetooth ® 4.1
하드웨어 개발
평가 보드
BOOST-CC2564MODA TMP107 온도 센서 데이지 체인 BoosterPack™ 플러그인 모듈 CC2564MODAEM 통합 안테나 평가 보드를 갖춘 듀얼 모드 Bluetooth® CC2564 모듈 CC2564MODNEM 듀얼 모드 Bluetooth® CC2564 모듈 평가 보드 CC256XCQFN-EM CC2564C 듀얼 모드 Bluetooth® 컨트롤러 평가 모듈 CC256XQFNEM 듀얼 모드 Bluetooth® CC2564 평가 보드
다운로드 옵션
설계 툴

DUALMODE-BT-DESIGN-REVIEWS — CC256x 장치에 대한 하드웨어 설계 검토

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
사용 설명서: PDF
거버(Gerber) 파일

CC2564MODAEM Design Files

SWRC317.ZIP (1326 KB)
레퍼런스 디자인

TIDA-00554 — Bluetooth 연결을 이용한 휴대용 화학 물질 분석용 DLP 울트라 모바일 NIR 분광계

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

BT-MSPAUDSINK-RD — Bluetooth 및 MSP430 오디오 싱크 레퍼런스 디자인

TI's Bluetooth + MSP430 Audio sink reference design can be used by customers to create a variety of applications for low end, low power audio solutions. Some application possibilities - toys, low end bluetooth speakers, audio streaming accessories. This reference design is a cost effective audio (...)
사용 설명서: PDF
회로도: PDF
레퍼런스 디자인

CC256XEM-RD — CC256x Bluetooth® 레퍼런스 디자인

This CC256x Bluetooth® evaluation module reference design is an RF reference design with antenna which can be easily connected to many Microcontroller Units (MCUs), such as TI's MSP430 or Tiva C series MCUs. The reference design can be copied into your board, allowing for a cost-effective design (...)
사용 설명서: PDF
회로도: PDF
레퍼런스 디자인

BT-MSPAUDSOURCE-RD — Bluetooth 및 MSP MCU 오디오 소스 레퍼런스 디자인

The Bluetooth and low-power MSP microcontroller Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference (...)
사용 설명서: PDF
회로도: PDF
패키지 CAD 기호, 풋프린트 및 3D 모델
QFM (MOG) 35 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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