CSDM65695T
Quad-phase 280A power module in 9x10x5mm package with trans-inductor voltage regulator (TLVR)
CSDM65695T
- Topside-cooled 9mm x 10mm x 5mm LGA package, industry common footprint
- Integrated inductor
- High output current capability:
- Peak current: 280A
- Continuous current: 160A RMS (Subject to thermal boundary condition)
- Operating VIN input voltage: 4.5V to 16V
- Operating VCC Bias: 4.5V to 5.5V
- High-frequency operation (up to 2MHz)
- Integrated clamping circuitry for avalanche free operation
- Intergrated current sense with 5 µA/A gain
- Body braking mode (BB)
- Forced continuous conduction mode (FCCM) operation
- Green, RoHS compliant without exemption, and completely Pb free
- Fault detection
- High-side short (HSS)
- Fault protection
- Over temperature (OT)
- Cycle-by-cycle negative over current limiting (NOC)
- Over current protection (OCP)
- BOOT UVLO
The CSDM65695x family of devices are 4-phase smart power stage modules with high peak current capability. The device family is highly optimized design for use in high-power, high-density synchronous buck converter applications. This product family integrates the driver IC and power MOSFETs into one Pb-free monolithic design to complete the power stage switching function. There are VIN and VCC bypass capacitors integrated into the package for minimum loop inductance and improved ringing.
This combination produces high-current, high-efficiency, and high-speed switching capability in a small industry standard 9 mm x 10 mm x 5mm footprint.
CSDM65695x integrates accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. This power stage module also includes cycle-by-cycle current limiting, over temperature and short circuit protection, and is designed to be compatible with TPS537xx series controllers.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 날짜 |
|---|---|---|---|---|
| * | Data sheet | CSDM65695x Quad-Phase Buck Smart Power Stage Module datasheet | PDF | HTML | 2026/03/04 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| QFN-FCMOD (VCV) | 35 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.