CY74FCT2257T
- Function and Pinout Compatible With FCT and F Logic
- 25-
Output Series Resistors to Reduce Transmission-Line Reflection Noise - TTL Output Level Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- Fully Compatible With TTL Input and Output Logic Levels
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- 12-mA Output Sink Current
15-mA Output Source Current - 3-State Outputs
The CY74FCT2257T has four identical two-input multiplexers that select four bits of data from two sources under the control of a common data-select (S) input. The I0 inputs are selected when S is low, and the I1 inputs are selected when S is high. Data appears at the output in noninverted form for the CY74FCT2257T. On-chip termination resistors at the outputs reduce system noise caused by reflections. The CY74FCT2257T can replace the FCT257T to reduce noise in an existing design.
The CY74FCT2257T is a logic implementation of a four-pole, two-position switch, in which the position of the switch is determined by the logic levels supplied to S. Outputs are forced to the high-impedance off state when the output-enable (OE\) input is high.
All but one device must be in the high-impedance state to prevent currents from exceeding the maximum ratings if outputs are tied together. Design of the OE\ signals must ensure that there is no overlap when outputs of 3-state devices are tied together.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 날짜 |
|---|---|---|---|---|
| * | Data sheet | Quad 2-Input Multiplexer With 3-State Outputs datasheet (Rev. B) | 2001/06/19 | |
| Selection guide | Logic Guide (Rev. AC) | PDF | HTML | 2025/11/13 | |
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
| Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004/06/22 | ||
| User guide | CYFCT Parameter Measurement Information | 2001/04/02 | ||
| Selection guide | Advanced Bus Interface Logic Selection Guide | 2001/01/09 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SSOP (DBQ) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치