제품 상세 정보

Bits (#) 8 Data rate (max) (Mbps) 200 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 0.65 Vin (max) (V) 4.9 Vout (min) (V) 1.25 Vout (max) (V) 5.5 Applications GPIO, I2C, JTAG, MDIO, SDIO, SMBus, SPI, UART Features Output enable, Wettable flanks package Prop delay (ns) 2.2 Technology family LSF Supply current (max) (mA) 0.0015 Rating Catalog Operating temperature range (°C) -40 to 125
Bits (#) 8 Data rate (max) (Mbps) 200 Topology Open drain, Push-Pull Direction control (typ) Auto-direction Vin (min) (V) 0.65 Vin (max) (V) 4.9 Vout (min) (V) 1.25 Vout (max) (V) 5.5 Applications GPIO, I2C, JTAG, MDIO, SDIO, SMBus, SPI, UART Features Output enable, Wettable flanks package Prop delay (ns) 2.2 Technology family LSF Supply current (max) (mA) 0.0015 Rating Catalog Operating temperature range (°C) -40 to 125
TSSOP (PW) 20 41.6 mm² 6.5 x 6.4 VQFN (RKS) 20 11.25 mm² 4.5 x 2.5 VSSOP (DGS) 20 24.99 mm² 5.1 x 4.9
  • Provides bidirectional voltage translation with no direction pin
  • Supports up to 100-MHz up translation and greater than 100-MHz down translation at ≤ 30 pF capacitive load and up To 40-MHz up or down translation at 50 pF capacitive load
  • Allows bidirectional voltage-level translation between
    • 0.65 V ↔ 1.8/2.5/3.3/5 V
    • 0.95 V ↔ 1.8/2.5/3.3/5 V
    • 1.2 V ↔ 1.8/2.5/3.3/5 V
    • 1.8 V ↔ 2.5/3.3/5 V
    • 2.5 V ↔ 3.3/5 V
    • 3.3 V ↔ 5 V
  • Low standby current
  • 5-V tolerance I/O port to support TTL
  • Low R ON provides less signal distortion
  • High-impedance I/O pins for EN = Low
  • Flow-through pinout for easy PCB trace routing
  • Latch-up performance >100 mA per JESD 17
  • –40°C to 125°C operating temperature range
  • Provides bidirectional voltage translation with no direction pin
  • Supports up to 100-MHz up translation and greater than 100-MHz down translation at ≤ 30 pF capacitive load and up To 40-MHz up or down translation at 50 pF capacitive load
  • Allows bidirectional voltage-level translation between
    • 0.65 V ↔ 1.8/2.5/3.3/5 V
    • 0.95 V ↔ 1.8/2.5/3.3/5 V
    • 1.2 V ↔ 1.8/2.5/3.3/5 V
    • 1.8 V ↔ 2.5/3.3/5 V
    • 2.5 V ↔ 3.3/5 V
    • 3.3 V ↔ 5 V
  • Low standby current
  • 5-V tolerance I/O port to support TTL
  • Low R ON provides less signal distortion
  • High-impedance I/O pins for EN = Low
  • Flow-through pinout for easy PCB trace routing
  • Latch-up performance >100 mA per JESD 17
  • –40°C to 125°C operating temperature range

The LSF family of devices supports bidirectional voltage translation without the need for DIR pin which minimizes system effort (for PMBus, I 2C, SMBus, and so forth). The LSF family of devices supports up to 100-MHz up translation and greater than 100-MHz down translation at ≤ 30 pF capacitive load and up to 40-MHz up or down translation at 50 pF capacitive load which allows the LSF family to support more consumer or telecom interfaces (MDIO or SDIO).

LSF family supports 5-V tolerance on I/O port which makes it compatible with TTL levels in industrial and telecom applications. The LSF family is able to set up different voltage translation levels on each channel which makes it very flexible.

The LSF family of devices supports bidirectional voltage translation without the need for DIR pin which minimizes system effort (for PMBus, I 2C, SMBus, and so forth). The LSF family of devices supports up to 100-MHz up translation and greater than 100-MHz down translation at ≤ 30 pF capacitive load and up to 40-MHz up or down translation at 50 pF capacitive load which allows the LSF family to support more consumer or telecom interfaces (MDIO or SDIO).

LSF family supports 5-V tolerance on I/O port which makes it compatible with TTL levels in industrial and telecom applications. The LSF family is able to set up different voltage translation levels on each channel which makes it very flexible.

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기술 자료

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14개 모두 보기
유형 직함 날짜
* Data sheet LSF0108 Channel Auto-Bidirectional Multi-Voltage Level Translator for Open-Drain datasheet (Rev. M) 2023/04/21
Application note Top Questions About Auto Bi-Direction LSF Family Translators PDF | HTML 2024/12/26
Application note Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators PDF | HTML 2024/07/12
Application note Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) PDF | HTML 2024/07/03
Application brief Integrated vs. Discrete Open Drain Level Translation PDF | HTML 2024/01/09
Application brief Future-Proofing Your Level Shifter Design with TI's Dual Footprint Packages PDF | HTML 2023/09/05
Selection guide Voltage Translation Buying Guide (Rev. A) 2021/04/15
Application note Factors Affecting VOL for TXS and LSF Auto-bidirectional Translation Devices 2017/11/19
Application note Biasing Requirements for TXS, TXB, and LSF Auto-Bidirectional Translators 2017/10/30
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B) 2015/04/30
Application note Voltage-Level Translation With the LSF Family (Rev. B) 2015/03/12
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Selection guide Logic Guide (Rev. AC) PDF | HTML 1994/06/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

14-24-LOGIC-EVM — 14핀~24핀 D, DB, DGV, DW, DYY, NS 및 PW 패키지용 로직 제품 일반 평가 모듈

14-24-LOGIC-EVM 평가 모듈(EVM)은 14핀~24핀 D, DW, DB, NS, PW, DYY 또는 DGV 패키지에 있는 모든 로직 장치를 지원하도록 설계되었습니다.

사용 설명서: PDF | HTML
TI.com에서 구매 불가
평가 보드

LSF-EVM — 1~8비트 LSF 변환기 제품군 평가 모듈

LSF 장치 제품군은 0.95V 및 5V의 전압 범위를 지원하고 방향 핀 없이 다중 전압 양방향 변환을 제공하는 레벨 변환기입니다.

LSF-EVM은 LSF0108PWR 장치로 채워져 있으며 LSF0101DRYR, LSF0102DCTR 및 LSF0204PWR 장치와 호환되는 랜딩 패턴이 있습니다.

LSF-EVM은 100MHz 이상의 데이터 속도에 대한 반사를 줄여 고속 변환에 최적화됩니다. 또한 보드의 설계를 사용하면 여러 연결 인터페이스를 사용할 수 있고 점퍼 연결을 통해 쉽게 연결하거나 분리할 수 있는 풀업이 채워져 있어 간단한 (...)

사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

LSF0108 IBIS Model (Rev. A)

SDLM022A.ZIP (56 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
TSSOP (PW) 20 Ultra Librarian
VQFN (RKS) 20 Ultra Librarian
VSSOP (DGS) 20 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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