PGA305
- Analog features:
- Analog front-end for resistive bridge sensors
- Accommodates sensor sensitivities from 1mV/V to 135mV/V
- On-chip temperature sensor
- Programmable gain
- 24-bit sigma-delta analog-to-digital converter for signal channel
- 24-bit sigma-delta analog-to-digital converter for temperature channel
- 14-bit output DAC
- Digital features:
- FSO accuracy across temperature: < 0.1%
- System response time: < 220µs
- Third-order offset, gain, and nonlinearity temperature compensation
- Diagnostic functions
- Integrated EEPROM for device operation, calibration data and user data
- Peripheral features:
- I2C interface for data reading and device configuration
- One-wire interface enables communication through the power supply pin without using additional lines
- Current loop interface: 4mA to 20mA
- Ratiometric and absolute voltage output
- Power management control
- Analog low-voltage detect
- General features:
- Industrial temperature range: –40°C to 150°C
- Power supply:
- On-chip power management accepts wide power-supply voltage from 3.3V to 30V
- Integrated reverse-protection circuit
The PGA305 device supplies an interface for piezoresistive and strain-gauge pressure-sense elements. The device is a full system-on-chip (SoC) solution that includes programmable analog front end (AFE), ADC, and digital signal processing that enable direct connection to the sense element. The PGA305 device also includes integrated voltage regulators and an oscillator to minimize the number of external components. The PGA305 device can employ third-order temperature and nonlinearity compensation to achieve high accuracy. The device can also use the integrated I2C interface or the one-wire serial interface (OWI) to achieve external communication and simplify the system calibration process. An Integrated DAC supports absolute-voltage, ratiometric-voltage, and 4mA to 20mA current-loop outputs.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | PGA305 Signal Conditioner and Transmitter for Pressure Sensors datasheet | PDF | HTML | 2024/08/14 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치