제품 상세 정보

DSP (max) (MHz) 66, 80 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
DSP (max) (MHz) 66, 80 Rating HiRel Enhanced Product Operating temperature range (°C) -55 to 125
QFP (PQ) 132 768.347775 mm² 27.945 x 27.495
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • Military Operating Temperature Range: –55°C to 125°C
  • Industrial Operating Temperature Range: -40°C to 85°C
  • Fast Instruction Cycle Time (30 ns and 40 ns) and 25 ns for Industrial Temp Range
  • Source-Code Compatible With All TMS320C1x and TMS320C2x Devices
  • RAM-Based Operation
    • 9K × 16-Bit Single-Cycle On-Chip Program/Data RAM
    • 1056 × 16-Bit Dual-Access On-Chip Data RAM
  • 2K × 16-Bit On-Chip Boot ROM
  • 224K × 16-Bit Maximum Addressable External Memory Space (64K Program, 64K Data, 64K I/O, and 32K Global)
  • 32-Bit Arithmetic Logic Unit (ALU)
    • 32-bit Accumulator (ACC)
    • 32-Bit Accumulator Buffer (ACCB)
  • 16-Bit Parallel Logic Unit (PLU)
  • 16 × 16-Bit Multiplier, 32-Bit Product
  • 11 Context-Switch Registers
  • Two Buffers for Circular Addressing
  • Full-Duplex Synchronous Serial Port
  • Time-Division Multiplexed Serial Port (TDM)
  • Timer With Control and Counter Registers
  • 16 Software-Programmable Wait-State Generators
  • Divide-by-One Clock Option
  • IEEE 1149.1 Boundary Scan Logic
  • Operations Are Fully Static
  • Enhanced Performance Implanted CMOS (EPIC™) Technology Fabricated by Texas Instruments
  • Packaging
    • 132-Lead Plastic Quad Flat Package (PQ Suffix)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
EEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture EPIC is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • Military Operating Temperature Range: –55°C to 125°C
  • Industrial Operating Temperature Range: -40°C to 85°C
  • Fast Instruction Cycle Time (30 ns and 40 ns) and 25 ns for Industrial Temp Range
  • Source-Code Compatible With All TMS320C1x and TMS320C2x Devices
  • RAM-Based Operation
    • 9K × 16-Bit Single-Cycle On-Chip Program/Data RAM
    • 1056 × 16-Bit Dual-Access On-Chip Data RAM
  • 2K × 16-Bit On-Chip Boot ROM
  • 224K × 16-Bit Maximum Addressable External Memory Space (64K Program, 64K Data, 64K I/O, and 32K Global)
  • 32-Bit Arithmetic Logic Unit (ALU)
    • 32-bit Accumulator (ACC)
    • 32-Bit Accumulator Buffer (ACCB)
  • 16-Bit Parallel Logic Unit (PLU)
  • 16 × 16-Bit Multiplier, 32-Bit Product
  • 11 Context-Switch Registers
  • Two Buffers for Circular Addressing
  • Full-Duplex Synchronous Serial Port
  • Time-Division Multiplexed Serial Port (TDM)
  • Timer With Control and Counter Registers
  • 16 Software-Programmable Wait-State Generators
  • Divide-by-One Clock Option
  • IEEE 1149.1 Boundary Scan Logic
  • Operations Are Fully Static
  • Enhanced Performance Implanted CMOS (EPIC™) Technology Fabricated by Texas Instruments
  • Packaging
    • 132-Lead Plastic Quad Flat Package (PQ Suffix)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
EEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture EPIC is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

The SM320C50-EP digital signal processor (DSP) is a high-performance, 16-bit, fixed-point processor manufactured in 0.72-µm double-level metal CMOS technology. The C50 is the first DSP from TI designed as a fully static device. Full-static CMOS design contributes to low power consumption while maintaining high performance, making it ideal for applications such as battery-operated communications systems, satellite systems, and advanced control algorithms.

A number of enhancements to the basic C2x architecture give the C50 a minimum 2× performance over the previous generation. A four-deep instruction pipeline, that incorporates delayed branching, delayed call to subroutine, and delayed return from subroutine, allows the C50 to perform instructions in fewer cycles. The addition of a parallel logic unit (PLU) gives the C50 a method for manipulating bits in data memory without using the accumulator and ALU. The C50 has additional shifting and scaling capability for proper alignment of multiplicands or storage of values to data memory.

The C50 achieves its low-power consumption through the IDLE2 instruction. IDLE2 removes the functional clock from the internal hardware of the C50, which puts it into a total-sleep mode that uses only 7 µ:A. A low-logic level on an external interrupt with a duration of at least five clock cycles ends the IDLE2 mode.

The SM320C50-EP is available with a clock speed of 66 MHz providing a 30-ns cycle time and a clock speed of 80 MHz providing a 25-ns cycle time.

The SM320C50-EP digital signal processor (DSP) is a high-performance, 16-bit, fixed-point processor manufactured in 0.72-µm double-level metal CMOS technology. The C50 is the first DSP from TI designed as a fully static device. Full-static CMOS design contributes to low power consumption while maintaining high performance, making it ideal for applications such as battery-operated communications systems, satellite systems, and advanced control algorithms.

A number of enhancements to the basic C2x architecture give the C50 a minimum 2× performance over the previous generation. A four-deep instruction pipeline, that incorporates delayed branching, delayed call to subroutine, and delayed return from subroutine, allows the C50 to perform instructions in fewer cycles. The addition of a parallel logic unit (PLU) gives the C50 a method for manipulating bits in data memory without using the accumulator and ALU. The C50 has additional shifting and scaling capability for proper alignment of multiplicands or storage of values to data memory.

The C50 achieves its low-power consumption through the IDLE2 instruction. IDLE2 removes the functional clock from the internal hardware of the C50, which puts it into a total-sleep mode that uses only 7 µ:A. A low-logic level on an external interrupt with a duration of at least five clock cycles ends the IDLE2 mode.

The SM320C50-EP is available with a clock speed of 66 MHz providing a 30-ns cycle time and a clock speed of 80 MHz providing a 25-ns cycle time.

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기술 문서

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기2
유형 직함 날짜
* Data sheet SM320C50-EP Digital Signal Processor datasheet (Rev. A) 2005/11/30
* VID SM320C50-EP VID V6203613 2016/06/21

설계 및 개발

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설계 툴

PROCESSORS-3P-SEARCH — Arm 기반 MPU, arm 기반 MCU 및 DSP 타사 검색 툴

TI는 여러 회사와의 협력을 통해 TI 프로세서를 사용하여 광범위한 소프트웨어, 툴 및 SOM을 제공해서 생산 단계로 가는 속도를 높이고 있습니다. 이 검색 툴을 다운로드하여 타사 솔루션을 빠르게 검색하고 필요에 맞는 올바른 타사를 찾아보세요. 여기에 나열된 소프트웨어, 툴 및 모듈은 텍사스 인스트루먼트가 아닌 독립적인 타사에서 생산 및 관리하고 있습니다.

검색 툴은 다음과 같이 제품 유형별로 분류되어 있습니다.

  • 툴에는 IDE/컴파일러, 디버그 및 추적, 시뮬레이션 및 모델링 소프트웨어, 플래시 프로그래머가 포함되어 있습니다.
  • OS에는 (...)
패키지 다운로드
QFP (PQ) 132 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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