SN54LS75
These latches are ideally suited for use as temporary storage for binary information between processing units and input/output or indicator units. Information present at a data (D) input is transferred to the Q output when the enable (C) is high and the Q output will follow the data input as long as the enable remains high. When the enable goes low, the information (that was present at the data input at the time the transition occurred) is retained at the Q output until the enable is permitted to go high.
The '75 and 'LS75 feature complementary Q and Q\ outputs from a 4-bit latch, and are available in various 16-pin packages. For higher component density applications, the '77 and 'LS77 4-bit latches are available in 14-pin flat packages.
These circuits are completely compatible with all popular TTL families. All inputs are diode-clamped to minimize transmission-line effects and simplify system design. Series 54 and 54LS devices are characterized for operation over the full military temperature range of -55°C to 125°C; Series 74, and 74LS devices are characterized for operation from 0°C to 70°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | 4-Bit Bistable Latches datasheet | 1988/03/01 | |
* | SMD | SN54LS75 SMD 7601201EA | 2016/06/21 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022/12/15 | |
Selection guide | Logic Guide (Rev. AB) | 2017/06/12 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015/12/02 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007/01/16 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002/08/29 | ||
Application note | Designing With Logic (Rev. C) | 1997/06/01 | ||
Application note | Designing with the SN54/74LS123 (Rev. A) | 1997/03/01 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996/10/01 | ||
Application note | Live Insertion | 1996/10/01 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
CFP (W) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치