인터페이스 LVDS, M-LVDS 및 PECL

SN65LVDM1676

활성

16채널 LVDM 트랜시버

제품 상세 정보

Function Transceiver Protocols LVDM, LVDS Number of transmitters 16 Number of receivers 16 Supply voltage (V) 3.3 Signaling rate (MBits) 200 Input signal LVDM, LVTTL Output signal LVDM, LVTTL Rating Catalog Operating temperature range (°C) -40 to 85
Function Transceiver Protocols LVDM, LVDS Number of transmitters 16 Number of receivers 16 Supply voltage (V) 3.3 Signaling rate (MBits) 200 Input signal LVDM, LVTTL Output signal LVDM, LVTTL Rating Catalog Operating temperature range (°C) -40 to 85
TSSOP (DGG) 64 137.7 mm² 17 x 8.1
  • Sixteen Low-Voltage Differential Transceivers. Designed for Signaling Rates up to 200 Mbps per Receiver or 650 Mbps per Transmitter.
  • Simplex (Point-to-Point) or Half-Duplex (Multipoint) Interface
  • Typical Differential Output Voltage of 340 mV Into a 50- Line Termination on 'LVDM1677 Product
  • Propagation Delay Time:
    • Driver: 2.5 ns Typ
    • Receiver: 3 ns Typ
  • Driver is High Impedance When Disabled or With VCC < 1.5 V for Power Up/Down Glitch-Free Performance and Hot-Plugging Events
  • Bus-Terminal ESD Protection Exceeds 12 kV
  • Low-Voltage TTL (LVTTL) Logic Input Levels Are 5-V Tolerant
  • Packaged in Thin Shrink Small-Outline Package With 20 mil Terminal Pitch

  • Sixteen Low-Voltage Differential Transceivers. Designed for Signaling Rates up to 200 Mbps per Receiver or 650 Mbps per Transmitter.
  • Simplex (Point-to-Point) or Half-Duplex (Multipoint) Interface
  • Typical Differential Output Voltage of 340 mV Into a 50- Line Termination on 'LVDM1677 Product
  • Propagation Delay Time:
    • Driver: 2.5 ns Typ
    • Receiver: 3 ns Typ
  • Driver is High Impedance When Disabled or With VCC < 1.5 V for Power Up/Down Glitch-Free Performance and Hot-Plugging Events
  • Bus-Terminal ESD Protection Exceeds 12 kV
  • Low-Voltage TTL (LVTTL) Logic Input Levels Are 5-V Tolerant
  • Packaged in Thin Shrink Small-Outline Package With 20 mil Terminal Pitch

The SN65LVDM1676 and SN65LVDM1677 (integrated termination) are sixteen differential line transmitters or receivers (tranceivers) that use low-voltage differential signaling (LVDS) to achieve signaling rates up to 200 Mbps per transceiver configured as a receiver and up to 650 Mbps per transceiver configured as a transmitter. These products are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts except that the output current of the drivers are doubled. This modification provides a minimum differential output voltage magnitude of 247 mV into a 50- load and allows double-terminated lines and half-duplex operation. The receivers detect a voltage difference of 100 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of transceivers integrated into the same substrate along with the low pulse skew of balanced signaling, allows extremely precise timing alignment of clock and data for synchronous parallel data transfers. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.)

The SN65LVDM1676 and SN65LVDM1677 are characterized for operation from -40°C to 85°C.

The SN65LVDM1676 and SN65LVDM1677 (integrated termination) are sixteen differential line transmitters or receivers (tranceivers) that use low-voltage differential signaling (LVDS) to achieve signaling rates up to 200 Mbps per transceiver configured as a receiver and up to 650 Mbps per transceiver configured as a transmitter. These products are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts except that the output current of the drivers are doubled. This modification provides a minimum differential output voltage magnitude of 247 mV into a 50- load and allows double-terminated lines and half-duplex operation. The receivers detect a voltage difference of 100 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables. The large number of transceivers integrated into the same substrate along with the low pulse skew of balanced signaling, allows extremely precise timing alignment of clock and data for synchronous parallel data transfers. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.)

The SN65LVDM1676 and SN65LVDM1677 are characterized for operation from -40°C to 85°C.

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기술 문서

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모두 보기4
유형 직함 날짜
* Data sheet High-Speed Differential Line Transceivers datasheet (Rev. D) 2007/06/14
Application note An Introduction to M-LVDS and Clock and Data Distribution Applications (Rev. C) PDF | HTML 2023/06/22
Application brief How Far, How Fast Can You Operate MLVDS? 2018/08/06
Application note SPI-Based Data Acquisition/Monitor Using the TLC2551 Serial ADC (Rev. A) 2001/11/20

설계 및 개발

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시뮬레이션 모델

SN65LVDM1676/77 IBIS Model Version 1.1 (Rev. A)

SLLC051A.ZIP (38 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
시뮬레이션 툴

TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
사용 설명서: PDF
패키지 다운로드
TSSOP (DGG) 64 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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