제품 상세 정보

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5 Protocols Analog Ron (typ) (Ω) 5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 200 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
SOIC (D) 14 51.9 mm² 8.65 x 6 SSOP (DB) 14 48.36 mm² 6.2 x 7.8 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 TVSOP (DGV) 14 23.04 mm² 3.6 x 6.4 VQFN (RGY) 14 12.25 mm² 3.5 x 3.5
  • Standard ’125-Type Pinout (D, DB, DGV, and PW Packages)
  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels

  • Standard ’125-Type Pinout (D, DB, DGV, and PW Packages)
  • 5- Switch Connection Between Two Ports
  • TTL-Compatible Input Levels

The SN74CBT3125 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE)\ input is high.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74CBT3125 quadruple FET bus switch features independent line switches. Each switch is disabled when the associated output-enable (OE)\ input is high.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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유형 직함 날짜
* Data sheet SN74CBT3125 datasheet (Rev. I) 2002/09/19

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치