SN74F374
- Eight D-Type Flip-Flops in a Single Package
- 3-State Bus-Driving True Outputs
- Full Parallel Access for Loading
- Buffered Control Inputs
- Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight flip-flops of the ´F374 are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels that were set up at the data (D) inputs.
A buffered output enable (
) input can be used to place the eight outputs in either
a normal logic state (high or low) or a high-impedance state. In the
high-impedance state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and the increased drive
provide the capability to drive bus lines without need for interface
or pullup components.
The output enable (
)
input does not affect internal operations of the flip-flop. Old data
can be retained or new data can be entered while the outputs are in
the high-impedance state.
The SN74F374 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F374 is characterized for operation from 0°C to 70°C.
관심 가지실만한 유사 제품
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet (Rev. A) | 1993/10/01 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치