홈 로직 및 전압 변환 플립플롭, 래치 및 레지스터 D형 플립플롭
홈
로직 및 전압 변환
플립플롭, 래치 및 레지스터
D형 플립플롭

SN74LVC2G74-EP

활성

클리어 및 프리셋을 지원하는 EP(Enhanced Product) 싱글 포지티브 에지 D형 플립플롭

지금 주문
데이터시트

SN74LVC2G74-EP

활성
데이터시트 지금 주문

제품 상세 정보

Number of channels 1 Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 200 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product
Number of channels 1 Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 200 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product
VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • Controlled Baseline
    • One Assembly Site
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 7.9 ns at 3.3 V
  • Low Power Consumption, 10 µA Max ICC
  • ±24 mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Partial Power Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly Site
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 7.9 ns at 3.3 V
  • Low Power Consumption, 10 µA Max ICC
  • ±24 mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Partial Power Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

This single positive edge triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

This device is fully specified for partial power down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This single positive edge triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

This device is fully specified for partial power down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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기술 문서

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모두 보기30
유형 직함 날짜
* Data sheet Single Positive Edge Triggered D-Type Flip-Flop With Clear And Preset datasheet 2008/05/29
* VID SN74LVC2G74-EP VID V6208617 2016/06/21
* Radiation & reliability report SN74LVC2G74MDCUTEP Reliability Report 2015/02/06
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022/12/15
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 2003/11/06
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 2002/12/18
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002/06/13
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002/05/22
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 2002/05/10
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 2002/03/27
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note LVC Characterization Information 1996/12/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Design guide Low-Voltage Logic (LVC) Designer's Guide 1996/09/01
Application note Understanding Advanced Bus-Interface Products Design Guide 1996/05/01

설계 및 개발

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주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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