TPA2000D4
- Ideal for Notebook PCs and USB-Powered Speakers
- 2 W Into 4 From 5-V Supply
- Integrated Class-AB Headphone Amplifier
- Second-Generation Modulation Technique
- Filterless Operation
- Improved Efficiency
- Low Supply Current...9 mA typ at 5 V
- Shutdown Control...< 0.05 µA Typ
- Shutdown Pin Is TTL Compatible
- –40°C to 85°C Operating Temperature Range
- Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
PowerPAD is a trademark of Texas Instruments.
The TPA2000D4 is a 2-W stereo bridge-tied-load (BTL) class-D amplifier designed to drive speakers with as low as 4- impedance. The amplifier uses TIs second-generation modulation technique, which results in improved efficiency and SNR, and also allows the device to be connected directly to the speaker without the use of the LC output filter commonly associated with class-D amplifiers (this will result in an EMI which must be shielded at the system level). These features make the device ideal for use in notebook PCs where high-efficiency is needed to extend battery run-time. For speakers powered off the USB bus, the high-efficiency allows for higher output power levels without tripping the USBs over-current circuitry.
The gain of the amplifier is controlled by two input terminals, GAIN1, and GAIN0. This allows the amplifier to be configured for a gain of 5, 11, 17 and 23 dB. The differential input terminals are high-impedance CMOS inputs, and can be used as summing nodes.
The headphone amplifier is a stereo single-ended (SE) class-AB amplifier which requires two external resistors per channel to set the gain. The MODE pin selects which amplifier is active; the unused amplifier is placed in shutdown to reduce supply current.
Both the class-D BTL amplifier, and the class-AB SE amplifier include depop circuitry to reduce the amount of turnon pop at power up, when cycling SHUTDOWN\, and when switching modes of operation.
The TPA2000D4 is available in the 32-pin thermally-enhanced TSSOP package (DAP) which allows stereo 2-W continuous output power levels in 4- loads when placed on a board with proper thermal board design. The TPA2000D4 operates over an ambient temperature range of 40°C to 85°C.
These packages deliver levels of thermal performance that were previously only achievable in TO-220-type packages. Thermal impedances of less than 35°C/W are readily realized in multilayer PCB applications when using the DAP package.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Stereo 2-W Class-D Audio Power Amplifier with Stereo HP Amplifier datasheet (Rev. B) | 2005/11/07 | |
Application note | Layout Guidelines For TPA300x Series Parts (Rev. A) | 2020/06/24 | ||
Application note | Measuring Class-D Amplifiers for Audio Speaker Overstress Testing | 2005/10/28 | ||
User guide | TPA2000D4EVM - User Guide (Rev. A) | 2001/04/06 |
설계 및 개발
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패키지 | 핀 | 다운로드 |
---|---|---|
HTSSOP (DAP) | 32 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치