TPA4411
- Space Saving Packages
- 20-Pin, 4 mm × 4 mm Thin QFN
- PA4411 — Thermally Optimized PowerPAD™ Package
- TTPA4411M — Thermally Enhanced PowerPAD™ Package
- 16-Ball, 2.18 mm × 2.18 mm WCSP
- 20-Pin, 4 mm × 4 mm Thin QFN
- Ground-Referenced Outputs Eliminate
DC-Bias Voltages on Headphone Ground Pin- No Output DC-Blocking Capacitors
- Reduced Board Area
- Reduced Component Cost
- Improved THD+N Performance
- No Degradation of Low-Frequency Response Due to Output Capacitors
- Wide Power Supply Range: 1.8 V to 4.5 V
- 80-mW/Ch Output Power into 16-
at 4.5 V - Independent Right and Left Channel
Shutdown Control - Short-Circuit and Thermal Protection
- Pop Reduction Circuitry
- No Output DC-Blocking Capacitors
- APPLICATIONS
- Notebook Computers
- CD / MP3 Players
- Smart Phones
- Cellular Phones
- PDAs
The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.
The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load
at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have
±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the
right and left audio channels.
The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 80-mW DirectPath(TM) Stereo Headphone Driver datasheet (Rev. E) | 2008/03/04 | |
| Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019/08/26 | ||
| Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019/06/27 | ||
| Analog Design Journal | 2Q 2010 Issue Analog Applications Journal | 2010/05/06 | ||
| Analog Design Journal | Precautions for connecting APA outputs to other devices | 2010/05/06 | ||
| EVM User's guide | TPA4411EVM - User Guide (Rev. A) | 2008/01/09 | ||
| More literature | TPA4411_NanoEVM_ Schematic | 2007/02/13 | ||
| More literature | TPA4411_NanoEVM_OV | 2007/01/29 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TPA4411EVM — TPA4411 EVM(평가 모듈)
The TPA4411 is a stereo headphone driver evaluation module. The TPA4411 device is designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The evaluation module consists of a TI TPA4411 80-mW audio power amplifier in a small QFN package. It is ideal (...)
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| DSBGA (YZH) | 16 | 옵션 보기 |
| WQFN (RTJ) | 20 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.