전원 관리 DC/DC power modules Power modules (integrated inductor)

TPSM63606

활성

5mm x 5.5mm 향상된 HotRod™ QFN의 고밀도 36V 입력, 1V~16V 출력, 6A 전원 모듈

제품 상세 정보

Iout (max) (A) 6 Vin (max) (V) 36 Vin (min) (V) 3 Vout (max) (V) 16 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Features EMI Tested, Enable, Frequency synchronization, Low Noise, Overcurrent protection, Power good, Spread Spectrum Control mode current mode Switching frequency (max) (Hz) 2200000 Switching frequency (min) (Hz) 200000
Iout (max) (A) 6 Vin (max) (V) 36 Vin (min) (V) 3 Vout (max) (V) 16 Vout (min) (V) 1 Rating Catalog Operating temperature range (°C) -40 to 125 Topology Buck, Inverting Buck-Boost, Synchronous Buck Features EMI Tested, Enable, Frequency synchronization, Low Noise, Overcurrent protection, Power good, Spread Spectrum Control mode current mode Switching frequency (max) (Hz) 2200000 Switching frequency (min) (Hz) 200000
B3QFN (RDL) 20 27.5 mm² 5.5 x 5
  • Functional Safety-Capable
  • Versatile 36-VIN, 6-AOUT synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Adjustable output voltage from 1 V to 16 V
    • 5.0-mm × 5.5-mm × 4-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • 95%+ peak efficiency
    • External bias option for improved efficiency
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Spread-spectrum modulation (S suffix)
    • Resistor-adjustable switch-node slew rate
    • Meets CISPR 11 and 32 class B emissions
  • Suitable for scalable power supplies
    • Pin compatible with the TPSM63604 (36 V, 4 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63606 with the WEBENCH Power Designer
  • Functional Safety-Capable
  • Versatile 36-VIN, 6-AOUT synchronous buck module
    • Integrated MOSFETs, inductor, and controller
    • Adjustable output voltage from 1 V to 16 V
    • 5.0-mm × 5.5-mm × 4-mm overmolded package
    • –40°C to 125°C junction temperature range
    • Frequency adjustable from 200 kHz to 2.2 MHz
    • Negative output voltage capability
  • Ultra-high efficiency across the full load range
    • 95%+ peak efficiency
    • External bias option for improved efficiency
    • Shutdown quiescent current of 0.6 µA (typical)
  • Ultra-low conducted and radiated EMI signatures
    • Low-noise package with dual input paths and integrated capacitors reduces switch ringing
    • Spread-spectrum modulation (S suffix)
    • Resistor-adjustable switch-node slew rate
    • Meets CISPR 11 and 32 class B emissions
  • Suitable for scalable power supplies
    • Pin compatible with the TPSM63604 (36 V, 4 A)
  • Inherent protection features for robust design
    • Precision enable input and open-drain PGOOD indicator for sequencing, control, and VIN UVLO
    • Overcurrent and thermal shutdown protections
  • Create a custom design using the TPSM63606 with the WEBENCH Power Designer

Deriving from a family of synchronous buck modules, the TPSM63606 is a highly integrated 36-V, 6-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 16 V, the TPSM63606 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63606 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum option for improved EMI, integrated VCC, bootstrap, and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

Deriving from a family of synchronous buck modules, the TPSM63606 is a highly integrated 36-V, 6-A DC/DC solution that combines power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module has VIN and VOUT pins located at the corners of the package for optimized input and output capacitor placement. Four larger thermal pads beneath the module enable a simple layout and easy handling in manufacturing.

With an output voltage from 1 V to 16 V, the TPSM63606 is designed to quickly and easily implement a low-EMI design in a small PCB footprint. The total solution requires as few as four external components and eliminates the magnetics and compensation part selection from the design process.

Although designed for small size and simplicity in space-constrained applications, the TPSM63606 module offers many features for robust performance: precision enable with hysteresis for adjustable input-voltage UVLO, resistor-programmable switch node slew rate and spread spectrum option for improved EMI, integrated VCC, bootstrap, and input capacitors for increased reliability and higher density, constant switching frequency over the full load current range, and a PGOOD indicator for sequencing, fault protection, and output voltage monitoring.

다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치보다 업그레이드된 기능을 지원하는 즉각적 대체품
TPSM63606E 활성 55°C의 확장된 온도 범위를 지원하는 고밀도, 36V 입력, 1V~16V 출력, 6A 전원 모듈 Same functionality and pinout, but has more extensive qualifications to withstand extended cold temperature range: -55°C to 125°C.
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TPSM63608 활성 7.5mm x 6.5mm HotRod™ QFN의 고밀도 36V 입력, 1V~20V 출력, 6A 전원 모듈 Performance features with larger package
신규 TPSM64406 활성 고밀도, 36V, 0.8V~16V 출력, 듀얼 3A 출력 전원 모듈 Dual-output 3A device configurable for 6A single output

기술 문서

star =TI에서 선정한 이 제품의 인기 문서
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모두 보기7
유형 직함 날짜
* Data sheet TPSM63606 High-Density, 3-V to 36-V Input, 1-V to 16-V Output, 6-A Synchronous Buck DC/DC Power Module With Enhanced HotRod™ QFN Package datasheet (Rev. B) PDF | HTML 2022/04/25
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 2024/03/14
Application note How to Implement a Simple Constant Current Regulation Scheme to a PCM Based Buck PDF | HTML 2023/08/16
Functional safety information TPSM63606 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA PDF | HTML 2022/02/18
Certificate TPSM63606SEVM EU RoHS Declaration of Conformity (DoC) 2021/10/26
User guide TPSM63606EVM and TPSM63606SEVM Evaluation Module User’s Guide PDF | HTML 2021/09/29
Certificate TPSM63606EVM EU RoHS Declaration of Conformity (DoC) 2021/09/02

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TPSM63606EVM — TPSM63606 평가 보드 3V~36V 입력, 1V~16V, 6A 출력, 전원 모듈

TPSM63606EVM 및 TPSM63606SEVM 고밀도 평가 모듈(EVM)은 TPSM63606 36V, 6A 동기식 벅 DC/DC 벅 전원 모듈의 성능을 보여줄 수 있도록 설계되었습니다. 이러한 EVM은 3V~36V의 넓은 입력 전압 범위에서 작동하여 1% 이상의 설정값 정확도와 최대 6A 출력 전류를 가진 고정 5V 출력을 제공합니다. EVM의 "S" 버전에는 낮은 EMI를 위한 의사 랜덤 확산 스펙트럼(PRSS)이 포함되어 있습니다. 전원 모듈은 향상된 EMI 성능, 고효율 및 고신뢰성을 갖춘 고급 패키지 및 핀아웃 (...)
사용 설명서: PDF | HTML
시뮬레이션 모델

TPSM63606 PSpice Transient Model

SLVMDQ6.ZIP (387 KB) - PSpice Model
계산 툴

TPSM6360XDESIGN-CALC — TPSM6360X 제품군 전원 모듈 빠른 시작 계산기 툴

TPSM63602, TPSM63603, TPSM63604 및 TPSM63606 전원 모듈 빠른 시작 설계 툴을 시작합니다. 이 독립형 툴은 이 동기식 벅 전원 모듈 제품군에 기반한 DC/DC 벅 레귤레이터 설계를 통해 전원 공급 장치 엔지니어를 용이하게 하고 지원합니다. 따라서 사용자는 애플리케이션 요구 사항을 충족하기 위해 최적화된 설계에 신속하게 도착할 수 있습니다.
사용 설명서: PDF | HTML
사용 설명서: PDF | HTML
PCB 레이아웃

TPSM63606EVM PCB Layout Files

SLVRBI7.ZIP (1950 KB)
패키지 다운로드
B3QFN (RDL) 20 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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