Home Power management DC/DC switching regulators Step-down (buck) regulators Buck modules (integrated inductor)

TPSM41625

ACTIVE

4-V to 16-V, 25-A, stackable power module

Product details

Iout (max) (A) 25 Vin (min) (V) 4 Vin (max) (V) 16 Vout (min) (V) 0.6 Vout (max) (V) 7.1 Soft start Adjustable Features Current Sharing, EMI Tested, Frequency synchronization, Phase Interleaving, Power good, Remote Sense Operating temperature range (°C) -40 to 125 Iq (typ) (mA) 4.3 Regulated outputs (#) 1 Switching frequency (max) (kHz) 1000 Switching frequency (min) (kHz) 300 Topology Buck, Synchronous Buck Type Module Rating Catalog Control mode ACM
Iout (max) (A) 25 Vin (min) (V) 4 Vin (max) (V) 16 Vout (min) (V) 0.6 Vout (max) (V) 7.1 Soft start Adjustable Features Current Sharing, EMI Tested, Frequency synchronization, Phase Interleaving, Power good, Remote Sense Operating temperature range (°C) -40 to 125 Iq (typ) (mA) 4.3 Regulated outputs (#) 1 Switching frequency (max) (kHz) 1000 Switching frequency (min) (kHz) 300 Topology Buck, Synchronous Buck Type Module Rating Catalog Control mode ACM
QFM (MOV) 69 176 mm² 16 x 11
  • Integrated inductor power solution
  • 11-mm × 16-mm × 4.2-mm QFN package
    • All pins accessible from package perimeter
  • Input voltage range: 4 V to 16 V
  • Wide-output voltage range: 0.6 V to 7.1 V
  • Selectable internal reference (±0.5% accuracy)
  • Stackable up to two devices
    • Parallel outputs for higher current
    • Phase-interleaving for reduced ripple
  • Efficiencies up to 97%
  • Adjustable fixed switching frequency (300 kHz to 1 MHz)
  • Allows synchronization to an external clock
  • Advanced current mode provides ultra-fast load step response
  • Power-good output
  • Meets EN55011 radiated EMI limits
  • Operating ambient range: –40°C to +105°C
  • Operating IC junction range: –40°C to +125°C
  • Pin compatible with: 15-A TPSM41615
  • Create a custom design using the TPSM41625 With the WEBENCH Power Designer
  • Integrated inductor power solution
  • 11-mm × 16-mm × 4.2-mm QFN package
    • All pins accessible from package perimeter
  • Input voltage range: 4 V to 16 V
  • Wide-output voltage range: 0.6 V to 7.1 V
  • Selectable internal reference (±0.5% accuracy)
  • Stackable up to two devices
    • Parallel outputs for higher current
    • Phase-interleaving for reduced ripple
  • Efficiencies up to 97%
  • Adjustable fixed switching frequency (300 kHz to 1 MHz)
  • Allows synchronization to an external clock
  • Advanced current mode provides ultra-fast load step response
  • Power-good output
  • Meets EN55011 radiated EMI limits
  • Operating ambient range: –40°C to +105°C
  • Operating IC junction range: –40°C to +125°C
  • Pin compatible with: 15-A TPSM41615
  • Create a custom design using the TPSM41625 With the WEBENCH Power Designer

The TPSM41625 power module is an easy-to-use integrated power supply that combines a DC/DC converter with power MOSFETs, a shielded inductor, and passives into a compact QFN package. This power solution requires few external components while maintaining the ability to adjust key parameters to meet specific design requirements. Applications requiring increased current can benefit from the ability to parallel two TPSM41625 devices.

The 11-mm × 16-mm × 4.2-mm, 69-pin QFN package with optimal package layout has excellent power dissipation capability which enhances thermal performance. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device. The TPSM41625 offers flexibilty with many features including power good signal, clock synchronization, programmable UVLO, soft-start timing selection, prebias start-up, as well as overcurrent and overtemperature protection making it a great product for powering a wide range of devices and systems.

space

space

space

The TPSM41625 power module is an easy-to-use integrated power supply that combines a DC/DC converter with power MOSFETs, a shielded inductor, and passives into a compact QFN package. This power solution requires few external components while maintaining the ability to adjust key parameters to meet specific design requirements. Applications requiring increased current can benefit from the ability to parallel two TPSM41625 devices.

The 11-mm × 16-mm × 4.2-mm, 69-pin QFN package with optimal package layout has excellent power dissipation capability which enhances thermal performance. The package footprint has all signal pins accessible from the perimeter and large thermal pads beneath the device. The TPSM41625 offers flexibilty with many features including power good signal, clock synchronization, programmable UVLO, soft-start timing selection, prebias start-up, as well as overcurrent and overtemperature protection making it a great product for powering a wide range of devices and systems.

space

space

space

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
TPSM41615 ACTIVE 4-V to 16-V, 15-A, stackable power module Lower current equivalent with adjustable current limit.
Same functionality with different pin-out to the compared device
TPS543C20A ACTIVE 4-V to 16-V, 40-A synchronous SWIFT™ buck converter with adaptive internal compensation Higher current discrete equivalent
NEW TPSM8287A12 ACTIVE 6-V input, 12-A stackable DC-DC buck module with I2C and integrated inductor Alternative, scalable solution with smaller BOM size, frequency synch and I2C option; lower input voltage range

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 8
Type Title Date
* Data sheet TPSM41625 4-V to 16-V Input, 25-A DC/DC Power Module with Current Sharing datasheet (Rev. A) PDF | HTML 07 Dec 2020
EVM User's guide TPSM41625 2-Phase Power Module Evaluation Module User's Guide (Rev. A) PDF | HTML 06 May 2021
EVM User's guide TPSM416x5 Power Module Evaluation Module User's Guide (Rev. B) PDF | HTML 06 May 2021
Application note Non-Isolated Point-of-Load Solutions for Tiger Lake in PC Applications (Rev. B) PDF | HTML 29 Apr 2021
Technical article 3 ways to reduce power-supply noise with power modules PDF | HTML 15 Dec 2020
Application note Enhance Stability of TPSM41625 Buck Module Designs with Minimized Ceramic Output PDF | HTML 09 Sep 2020
Certificate TPSM41625-2X-EVM EU Declaration of Conformity (DoC) 04 Aug 2020
Certificate TPSM41625EVM EU Declaration of Conformity (DoC) 04 Aug 2020

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPSM41625-2X-EVM — Parallel, 4-V to 16-V Input, 0.6-V to 7.1-V output, 2X 25-A power module evaluation board

The TPSM41625-2X-EVM evaluation module (EVM) is configured to evaluate the operation of two TPSM41625 power modules in parallel for current up to 50 A. The input voltage range is 4 V to 16 V. The output voltage range is 0.6 V to 7.1 V. The evaluation board makes it easy to evaluate the TPSM41625 (...)
User guide: PDF | HTML
Not available on TI.com
Evaluation board

TPSM41625EVM — 4-V to 16-V input, 0.6-V to 7.1-V output, 25-A power module evaluation board

The TPSM41625 evaluation board (EVM) is configured to evaluate the operation of the TPSM41625 power module for current up to 25 A. The input voltage range is 4 V to 16 V. The output voltage range is 0.6 V to 7.1 V. The evaluation board makes it easy to evaluate the TPSM41625 operation.
User guide: PDF | HTML
Not available on TI.com
Simulation model

TPSM41625 PSpice Transient Model

SLVMDF0.ZIP (525 KB) - PSpice Model
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins Download
QFM (MOV) 69 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos