DRV8816
- H-Bridge Motor Driver Individual
- Drives a DC Motor or Other Loads
- Low RDS(on) MOSFETs (0.4-Ω TYP)
- Low-Power Sleep Mode
- 100% PWM Supported
- 8- to 38-V Operating Supply Voltage Range
- Thermally Enhanced Surface Mount Package
- Configurable Overcurrent Limit
- Protection Features
- VBB Undervoltage Lockout (UVLO)
- Charge Pump Undervoltage (CPUV)
- Overcurrent Protection (OCP)
- Short-to-Supply Protection (STS)
- Short-to-Ground Protection (STG)
- Overtemperature Warning (OTW)
- Overtemperature Shutdown (OTS)
- Fault Condition Indication Pin (nFAULT)
The DRV8816 provides a versatile power driver solution with two independent ½-H bridge drivers. The device can drive one brushed DC motor or one winding of a stepper motor, as well as other devices like solenoids. A simple INx/ENx interface allows easy interfacing to controller circuits.
The output stages use N-channel power MOSFETs configured as ½-H-bridges. The DRV8816 is capable of peak output currents up to ±2.8 A and operating voltages up to 38 V. An internal charge pump generates needed gate drive voltages.
A low-power sleep mode is provided which shuts down internal circuitry to achieve very-low quiescent current draw. This sleep mode can be set using a dedicated nSLEEP pin.
Internal protection functions are provided for UVLO, charge pump fault, OCP, short-to-supply protection, short-to-ground protection, overtemperature warning, and overtemperature shutdown. Fault conditions are indicated through a nFAULT pin
The DRV8816 is packaged in a 16-pin HTSSOP package with PowerPAD™ (Eco-friendly: RoHS & no Sb/Br)
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | DRV8816 DMOS Dual 1/2-H-Bridge Motor Drivers datasheet (Rev. C) | PDF | HTML | 2016/4/12 | ||
| 應用說明 | Best Practices for Board Layout of Motor Drivers (Rev. B) | PDF | HTML | 2021/10/14 | |||
| 應用說明 | L1 and L2 EV Charger Electric Vehicle Service Equipment Design Considerations (Rev. B) | 2021/6/9 | ||||
| 應用說明 | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018/7/6 | ||||
| Application brief | PowerPAD™ Made Easy (Rev. B) | 2004/5/12 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HTSSOP (PWP) | 16 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。