DS90CF384
- 20 to 65 MHz shift clock support
- Programmable transmitter (DS90C383) strobe select
(Rising or Falling edge strobe) - Single 3.3V supply
- Chipset (Tx + Rx) power consumption < 250 mW (typ)
- Power-down mode (< 0.5 mW total)
- Single pixel per clock XGA (1024x768) ready
- Supports VGA, SVGA, XGA and higher addressability.
- Up to 227 Megabytes/sec bandwidth
- Up to 1.8 Gbps throughput
- Narrow bus reduces cable size and cost
- 290 mV swing LVDS devices for low EMI
- PLL requires no external components
- Low profile 56-lead TSSOP package.
- DS90CF384 also available in 64 ball, 0.8mm fine pitch
ball grid array(FBGA) package - Falling edge data strobe Receiver
- Compatible with TIA/EIA-644 LVDS standard
- ESD rating >7 kV
- Operating Temperature: –40°C to +85°C
The DS90C383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF384 receiver converts the LVDS data streams back into 28 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec. The transmitter is offered with programmable edge data strobes for convenient interface with a variety of graphics controllers. The transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge transmitter will inter-operate with a Falling edge receiver (DS90CF384) without any translation logic. The DS90CF384 is also offered in 64 ball, 0.8mm fine pitch ball grid array(FBGA) package which provides a 44 % reduction in PCB footprint (available Q3, 1999).
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | DS90C383/F384 3.3VProg LVDS Trans 24Bit FPD, 65MHz,3.3VLVDS Rcvr 24Bit FPD 65MHz datasheet (Rev. A) | 2004/5/13 | |||
| 應用說明 | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018/6/29 | ||||
| 應用說明 | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017/8/8 | ||||
| 應用說明 | Receiver Skew Margin for Channel Link I and FPD Link I Devices | PDF | HTML | 2016/1/13 | |||
| 應用說明 | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004/5/15 | ||||
| 應用說明 | AN-1056 STN Application Using FPD-Link | 2004/5/14 | ||||
| 應用說明 | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004/5/14 |
設計與開發
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FLINK3V8BT-85 — 適用於 FPD-Link 系列之串聯器和解串器 LVDS 產品的評估套件
The FPD-Link evaluation kit includes a transmitter (Tx) board, a receiver (Rx) board and interfacing cables. This kit shows the chipsets interfacing from test equipment or a graphics controller using low-voltage differential signaling (LVDS) to a receiver board.
The transmitter board accepts (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (DGG) | 56 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。