LM6144
- Rail-to-rail Input CMVR −0.25V to 5.25V
- Rail-to-Rail Output Swing 0.005V to 4.995V
- Wide Gain-Bandwidth: 17MHz at 50kHz (typ)
- Slew Rate:
- Small Signal, 5V/μs
- Large Signal, 30V/μs
- Low Supply Current 650μA/Amplifier
- Wide Supply Range 1.8V to 24V
- CMRR 107dB
- Gain 108dB with RL = 10k
- PSRR 87dB
At VS = 5V. Typ Unless Noted.
All trademarks are the property of their respective owners.
Using patent pending new circuit topologies, the LM6142/LM6144 provides new levels of performance in applications where low voltage supplies or power limitations previously made compromise necessary. Operating on supplies of 1.8V to over 24V, the LM6142/LM6144 is an excellent choice for battery operated systems, portable instrumentation and others.
The greater than rail-to-rail input voltage range eliminates concern over exceeding the common-mode voltage range. The rail-to-rail output swing provides the maximum possible dynamic range at the output. This is particularly important when operating on low supply voltages.
High gain-bandwidth with 650μA/Amplifier supply current opens new battery powered applications where previous higher power consumption reduced battery life to unacceptable levels. The ability to drive large capacitive loads without oscillating functionally removes this common problem.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LM6142/LM6144 17 MHz Rail-to-Rail Input-Output Operational Amplifiers datasheet (Rev. D) | 2013年 3月 13日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 與 SOT23-6)
- DCK(SC70-5 與 SC70-6)
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (N) | 14 | Ultra Librarian |
SOIC (D) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點