TLV314

現行

單路、5.5-V、3-MHz、低靜態電流 (65-μA)、RRIO 運算放大器

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OPA310 現行 單路、5.5-V、3-MHz、高輸出電流 (150 mA)、快速關機 (1 μs) 運算放大器 Better accuracy (1.4mV Vos max), higher output current (150mA)

產品詳細資料

Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 3 Slew rate (typ) (V/µs) 1.5 Vos (offset voltage at 25°C) (max) (mV) 3 Iq per channel (typ) (mA) 0.15 Vn at 1 kHz (typ) (nV√Hz) 16 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 2 Features Cost Optimized, EMI Hardened CMRR (typ) (dB) 96 Iout (typ) (A) 0.02 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.2 Input common mode headroom (to positive supply) (typ) (V) 0.2 Output swing headroom (to negative supply) (typ) (V) 0.005 Output swing headroom (to positive supply) (typ) (V) -0.005
Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 5.5 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 1.8 Rail-to-rail In, Out GBW (typ) (MHz) 3 Slew rate (typ) (V/µs) 1.5 Vos (offset voltage at 25°C) (max) (mV) 3 Iq per channel (typ) (mA) 0.15 Vn at 1 kHz (typ) (nV√Hz) 16 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 2 Features Cost Optimized, EMI Hardened CMRR (typ) (dB) 96 Iout (typ) (A) 0.02 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) -0.2 Input common mode headroom (to positive supply) (typ) (V) 0.2 Output swing headroom (to negative supply) (typ) (V) 0.005 Output swing headroom (to positive supply) (typ) (V) -0.005
SOT-23 (DBV) 5 8.12 mm² (2.9 mm × 2.8 mm) SOT-SC70 (DCK) 5 4.2 mm² (2 mm × 2.1 mm)
  • Low Offset Voltage: 0.75 mV (typ)
  • Low Input Bias Current: 1 pA (typ)
  • Wide Supply Range: 1.8 V to 5.5 V
  • Rail-to-Rail Input and Output
  • Gain Bandwidth: 3 MHz
  • Low IQ: 250 µA/Ch (max)
  • Low Noise: 16 nV/√Hz at 1 kHz
  • Internal RF/EMI Filter
  • Extended Temperature Range:
    –40°C to +125°C
  • Low Offset Voltage: 0.75 mV (typ)
  • Low Input Bias Current: 1 pA (typ)
  • Wide Supply Range: 1.8 V to 5.5 V
  • Rail-to-Rail Input and Output
  • Gain Bandwidth: 3 MHz
  • Low IQ: 250 µA/Ch (max)
  • Low Noise: 16 nV/√Hz at 1 kHz
  • Internal RF/EMI Filter
  • Extended Temperature Range:
    –40°C to +125°C

The TLV314 family of single-, dual-, and quad-channel operational amplifiers represents a new generation of low-power, general-purpose operational amplifiers. Rail-to-rail input and output swings (RRIO), low quiescent current (150 µA typically at 5 V) combine with a wide bandwidth of 3 MHz to make this family very attractive for a variety of battery-powered applications that require a good balance between cost and performance. Additionally, the TLV314 family architecture achieves a low input bias current of 1 pA, allowing for applications with MΩ source impedances.

The robust design of the TLV314 devices provides ease-of-use to the circuit designer: unity-gain stability, RRIO, capacitive loads of up to 300 pF, an integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).

These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to +125°C.

The TLV314 (single) is available in both 5-pin SC70 and SOT-23 packages. The TLV2314 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314 is offered in a 14-pin TSSOP package.

The TLV314 family of single-, dual-, and quad-channel operational amplifiers represents a new generation of low-power, general-purpose operational amplifiers. Rail-to-rail input and output swings (RRIO), low quiescent current (150 µA typically at 5 V) combine with a wide bandwidth of 3 MHz to make this family very attractive for a variety of battery-powered applications that require a good balance between cost and performance. Additionally, the TLV314 family architecture achieves a low input bias current of 1 pA, allowing for applications with MΩ source impedances.

The robust design of the TLV314 devices provides ease-of-use to the circuit designer: unity-gain stability, RRIO, capacitive loads of up to 300 pF, an integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).

These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to +125°C.

The TLV314 (single) is available in both 5-pin SC70 and SOT-23 packages. The TLV2314 (dual) is offered in 8-pin SOIC and VSSOP packages. The quad-channel TLV4314 is offered in a 14-pin TSSOP package.

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TLVx314 3-MHz, Low-Power, Internal EMI Filter, RRIO, Operational Amplifier datasheet (Rev. A) PDF | HTML 2016/3/22
Application brief Active Filtering in Automotive Audio Applications (Rev. A) 2019/8/15
電子書 The Signal e-book: A compendium of blog posts on op amp design topics PDF | HTML 2017/3/28
電子書 Analog Engineer’s Pocket Reference Guide Fifth Edition (Rev. D) PDF | HTML 2014/9/30

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開發板

AMP-PDK-EVM — 放大器性能開發套件評估模組

放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。

AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:

  • D (SOIC-8 和 SOIC-14)
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV (SOT23-5 和 SOT23-6)
  • DCK (SC70-5 和 SC70-6)
使用指南: PDF | HTML
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DIP-ADAPTER-EVM — DIP 轉接器評估模組

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

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開發板

DIYAMP-EVM — 通用自製 (DIY) 放大器電路評估模組

DIYAMP-EVM 是一系列評估模組 (EVM),提供工程師與自組愛好者 (DIYers) 實作型放大器電路,協助快速驗證設計概念並模擬結果。提供三種業界標準封裝(SC70、SOT-23 和 SOIC)與 12 種常見放大器配置,支援單電源與雙電源架構的放大器、濾波器、穩定補償與比較器應用。

DIYAMP-EVM 可快速製作電路原型,並採用常見的 0805 或 0603 表面裝載元件。透過多種組合方式,此 EVM 可建立從簡單放大器電路到複雜訊號鏈的各種評估電路。此 EVM 支援模擬板、超微型 A 版 (SMA)、接頭和有線介面連接方式,並與大多數類比數位轉換器 (ADC) (...)

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模擬型號

TLV314 PSpice Model (Rev. C)

SBOM974C.ZIP (23 KB) - PSpice 模型
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模擬型號

TLV314 TINA-TI Reference Design (Rev. A)

SBOM973A.ZIP (21 KB) - TINA-TI 參考設計
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模擬型號

TLV314 TINA-TI Spice Model (Rev. A)

SBOM972A.ZIP (5 KB) - TINA-TI Spice 模型
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
SOT-23 (DBV) 5 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian

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