TS3A26746E
- Ultra Low RON for GND Switch (80-mΩ typical)
- RON for MIC Switch <10-Ω
- 3.0V to 3.6V V+ Operation
- Control Input is 1.8-V Logic Compatible
- 6-bump, 0.5mm pitch CSP Package (1.45mm × 0.95mm × 0.5mm)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 500-V Charged-Device Model (C101)
- ESD Performance (SLEEVE,
RING2)
- ±8-kV Contact Discharge (IEC 61000-4-2)
The TS3A26746E is a 2 × 2 cross-point switch that is used to interchange the Ground and MIC connections on a headphone connector. The Ground switch has an ultra low RON of <0.1Ω to minimize voltage drop across it, preventing undesired increases in headphone ground reference voltage. The switch state is controlled via the SEL input. When SEL=High, GND is connected to RING2 and MIC is connected to SLEEVE. When SEL=Low, GND is connected to SLEEVE and MIC is connected to RING2. An internal 100k pull-up resistor on the SEL input sets the default state of the switch.
技術文件
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| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | 2 X 2 CROSSPOINT SWITCH FOR AUDIO APPLICATIONS datasheet (Rev. C) | 2013/5/23 | |||
| 技術文章 | USB Type-C audio: Do I need to buy a new pair of headphones? | PDF | HTML | 2016/7/7 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
介面轉接器
LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器
EVM-LEADLESS1 電路板允許快速測試和麵包板搭建 TI 常見的無引腳封裝。 此電路板具有封裝設計，可將 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面黏著封裝轉換為 100mil DIP 接頭。
使用指南:
PDF
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YZP) | 6 | Ultra Librarian |
訂購與品質
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