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協定專用交換器與多工器

TS3A26746E

現行

適用音訊應用的 80-mΩ、3.3-V、2 x 2 交叉點開關

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產品規格表

TS3A26746E

現行
產品規格表 立即訂購

產品詳細資料

Protocols Analog Audio Configuration Crosspoint/exchange Number of channels 2 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 80 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 40 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 ESD CDM (kV) 0.5 Input/output continuous current (max) (mA) 100 OFF-state leakage current (max) (µA) 0.5 Propagation delay time (µs) 0.01 Ron (max) (mΩ) 110 RON flatness (typ) (Ω) 1 Turnoff time (disable) (max) (ns) 10 Turnon time (enable) (max) (ns) 200 VIH (min) (V) 1.2 VIL (max) (V) 0.4
Protocols Analog Audio Configuration Crosspoint/exchange Number of channels 2 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 80 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 40 ESD HBM (typ) (kV) 2 Operating temperature range (°C) -40 to 85 ESD CDM (kV) 0.5 Input/output continuous current (max) (mA) 100 OFF-state leakage current (max) (µA) 0.5 Propagation delay time (µs) 0.01 Ron (max) (mΩ) 110 RON flatness (typ) (Ω) 1 Turnoff time (disable) (max) (ns) 10 Turnon time (enable) (max) (ns) 200 VIH (min) (V) 1.2 VIL (max) (V) 0.4
DSBGA (YZP) 6 2.1875 mm² 1.75 x 1.25
  • Ultra Low RON for GND Switch (80-mΩ typical)
  • RON for MIC Switch <10-Ω
  • 3.0V to 3.6V V+ Operation
  • Control Input is 1.8-V Logic Compatible
  • 6-bump, 0.5mm pitch CSP Package (1.45mm × 0.95mm × 0.5mm)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2)
    • ±8-kV Contact Discharge (IEC 61000-4-2)
  • Ultra Low RON for GND Switch (80-mΩ typical)
  • RON for MIC Switch <10-Ω
  • 3.0V to 3.6V V+ Operation
  • Control Input is 1.8-V Logic Compatible
  • 6-bump, 0.5mm pitch CSP Package (1.45mm × 0.95mm × 0.5mm)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2)
    • ±8-kV Contact Discharge (IEC 61000-4-2)

The TS3A26746E is a 2 × 2 cross-point switch that is used to interchange the Ground and MIC connections on a headphone connector. The Ground switch has an ultra low RON of <0.1Ω to minimize voltage drop across it, preventing undesired increases in headphone ground reference voltage. The switch state is controlled via the SEL input. When SEL=High, GND is connected to RING2 and MIC is connected to SLEEVE. When SEL=Low, GND is connected to SLEEVE and MIC is connected to RING2. An internal 100k pull-up resistor on the SEL input sets the default state of the switch.

The TS3A26746E is a 2 × 2 cross-point switch that is used to interchange the Ground and MIC connections on a headphone connector. The Ground switch has an ultra low RON of <0.1Ω to minimize voltage drop across it, preventing undesired increases in headphone ground reference voltage. The switch state is controlled via the SEL input. When SEL=High, GND is connected to RING2 and MIC is connected to SLEEVE. When SEL=Low, GND is connected to SLEEVE and MIC is connected to RING2. An internal 100k pull-up resistor on the SEL input sets the default state of the switch.
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技術文件

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類型 標題 日期
* Data sheet 2 X 2 CROSSPOINT SWITCH FOR AUDIO APPLICATIONS datasheet (Rev. C) 2013年 5月 23日
Technical article USB Type-C audio: Do I need to buy a new pair of headphones? PDF | HTML 2016年 7月 7日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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TS3A26746E HSpice Model

SCDM143.ZIP (587 KB) - HSpice Model
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DSBGA (YZP) 6 檢視選項
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