產品詳細資料

Protocols USB 2.0 Configuration Crosspoint/exchange Number of channels 2 Bandwidth (MHz) 1200 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 13000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 50 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) Yes ESD CDM (kV) 1 Input/output continuous current (max) (mA) 100 COFF (typ) (pF) 6 CON (typ) (pF) 12 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 5 Propagation delay time (µs) 0.00005 Ron (max) (mΩ) 19000 Ron channel match (max) (Ω) 2.5 RON flatness (typ) (Ω) 4 Turnoff time (disable) (max) (ns) 100 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 2.3 VIL (max) (V) 0.6
Protocols USB 2.0 Configuration Crosspoint/exchange Number of channels 2 Bandwidth (MHz) 1200 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 13000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 50 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) Yes ESD CDM (kV) 1 Input/output continuous current (max) (mA) 100 COFF (typ) (pF) 6 CON (typ) (pF) 12 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 5 Propagation delay time (µs) 0.00005 Ron (max) (mΩ) 19000 Ron channel match (max) (Ω) 2.5 RON flatness (typ) (Ω) 4 Turnoff time (disable) (max) (ns) 100 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 2.3 VIL (max) (V) 0.6
WQFN (RUK) 20 9 mm² 3 x 3
  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)
  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 3
類型 標題 日期
* Data sheet TS3DS10224 High-Speed Differential Crosspoint, 1:4 Differential Multiplexer and Demultiplexer, 2 Channel Differential 1:2 Multiplexer and Demultiplexer, or Fan-Out Switch datasheet (Rev. E) PDF | HTML 2019年 10月 17日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
TI.com 無法提供
模擬型號

TS3DS10224 HSpice AIO (Linux) Model

SCDM137.ZIP (511 KB) - HSpice Model
模擬型號

TS3DS10224 HSpice AIO (Windows) Model

SCDM136.ZIP (511 KB) - HSpice Model
模擬型號

TS3DS10224 IBIS Model

SCDM301.ZIP (4 KB) - IBIS Model
封裝 引腳 下載
WQFN (RUK) 20 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片