產品詳細資料

Bits (#) 6 Data rate (max) (Mbps) 500 Topology Push-Pull Direction control (typ) Fixed-direction Vin (min) (V) 1.14 Vin (max) (V) 3.6 Vout (min) (V) 1.14 Vout (max) (V) 3.6 Applications GPIO, JTAG, RGMII, SPI, UART Features Output damping resistors, Output enable, Overvoltage tolerant inputs, Partial power down (Ioff), Vcc disconnect, Vcc isolation, Wettable flanks package Prop delay (ns) 2.3 Technology family TXV Supply current (max) (mA) 0.022 Rating Catalog Operating temperature range (°C) -40 to 125
Bits (#) 6 Data rate (max) (Mbps) 500 Topology Push-Pull Direction control (typ) Fixed-direction Vin (min) (V) 1.14 Vin (max) (V) 3.6 Vout (min) (V) 1.14 Vout (max) (V) 3.6 Applications GPIO, JTAG, RGMII, SPI, UART Features Output damping resistors, Output enable, Overvoltage tolerant inputs, Partial power down (Ioff), Vcc disconnect, Vcc isolation, Wettable flanks package Prop delay (ns) 2.3 Technology family TXV Supply current (max) (mA) 0.022 Rating Catalog Operating temperature range (°C) -40 to 125
WQFN (BQB) 16 8.75 mm² 3.5 x 2.5
  • Configurable design allows each port to operate with a power supply range from 1.2 V to 3.6 V

  • Supports up to 500Mbps for 1.65 V to 3.6 V
  • Meets RGMII 2.0 timing specifications:
    • < 750 ps rise and fall time
    • < ± 5 % duty cycle distortion
    • < ± 400 ps channel to channel skew
    • Up to 250Mbps/channel
  • Integrated 10 Ω damping output resistor to minimize signal reflections
  • High drive strength (up to 12 mA at 3.6 V)
  • Fully configurable symmetric dual-rail design
  • Optimal signal integrity performance with 390ps peak-to-peak jitter for 1.8 V to 3.3 V
  • Features VCC isolation and VCC disconnect
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Low power consumption:
    • 10-µA maximum (25°C)
    • 20-µA maximum (–40°C to 125°C)
  • Operating temperature from –40°C to +125°C
  • Configurable design allows each port to operate with a power supply range from 1.2 V to 3.6 V

  • Supports up to 500Mbps for 1.65 V to 3.6 V
  • Meets RGMII 2.0 timing specifications:
    • < 750 ps rise and fall time
    • < ± 5 % duty cycle distortion
    • < ± 400 ps channel to channel skew
    • Up to 250Mbps/channel
  • Integrated 10 Ω damping output resistor to minimize signal reflections
  • High drive strength (up to 12 mA at 3.6 V)
  • Fully configurable symmetric dual-rail design
  • Optimal signal integrity performance with 390ps peak-to-peak jitter for 1.8 V to 3.3 V
  • Features VCC isolation and VCC disconnect
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • ESD protection exceeds JESD 22:
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Low power consumption:
    • 10-µA maximum (25°C)
    • 20-µA maximum (–40°C to 125°C)
  • Operating temperature from –40°C to +125°C

The TXV0106 is a 6-bit, dual-supply fixed-direction low-skew, low jitter voltage translation device. This device can be used for redriving, voltage translation and power isolation when implementing skew sensitive interface, such as RGMII between Ethernet MAC and PHY. The Ax I/O pins and enable pin (OE) are referenced to VCCA logic levels, and Bx I/O pins are referenced to VCCB logic levels. This device has improved channel-to-channel skew, duty cycle distortion and symmetric rise or fall timing for applications requiring strict timing conditions.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, thus preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature is designed so that if either VCC supply is at or near 0V both ports will switch to a high-impedance state. This feature enables power isolation for communications across multiple MACs and PHYs, and is beneficial in situations where MACs and PHYs are powered up asynchronously preventing current backflow between devices.

The TXV0106 transmits data in a fixed direction from the A bus to the B bus. When OE is set to High, both Ax and Bx pins will be forced into a high-impedance state. See Device Functional Modes for a summary of the operation of the control logic.

The TXV0106 is a 6-bit, dual-supply fixed-direction low-skew, low jitter voltage translation device. This device can be used for redriving, voltage translation and power isolation when implementing skew sensitive interface, such as RGMII between Ethernet MAC and PHY. The Ax I/O pins and enable pin (OE) are referenced to VCCA logic levels, and Bx I/O pins are referenced to VCCB logic levels. This device has improved channel-to-channel skew, duty cycle distortion and symmetric rise or fall timing for applications requiring strict timing conditions.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, thus preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature is designed so that if either VCC supply is at or near 0V both ports will switch to a high-impedance state. This feature enables power isolation for communications across multiple MACs and PHYs, and is beneficial in situations where MACs and PHYs are powered up asynchronously preventing current backflow between devices.

The TXV0106 transmits data in a fixed direction from the A bus to the B bus. When OE is set to High, both Ax and Bx pins will be forced into a high-impedance state. See Device Functional Modes for a summary of the operation of the control logic.

下載 觀看有字幕稿的影片 影片

技術文件

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

14-24-NL-LOGIC-EVM — 適用於 14 針腳至 24 針腳無引線封裝的邏輯產品通用評估模組

14-24-NL-LOGIC-EVM 是一款靈活的評估模組 (EVM),設計用於支援任何具有 14 針腳至 24 針腳 BQA、BQB、RGY、RSV、RJW 或 RHL 封裝的邏輯或轉換裝置。

使用指南: PDF | HTML
TI.com 無法提供
開發板

TXV0106-EVM — TXV0106 評估模組

TXV0106 評估模組 (EVM) 是一個易於使用的平台,用於評估 TXV0106 產品的功能與性能。此 EVM 具有選用電路和跨接器,可針對不同應用來配置產品。此產品提供固定與方向控制低偏斜、低抖動電壓轉換的選項。輸出可透過專屬的輸出啟用 (OE) 控制功能來啟用及停用。
使用指南: PDF | HTML
TI.com 無法提供
模擬型號

TXV0106 IBIS Model

SCEM797.ZIP (44 KB) - IBIS Model
封裝 針腳 CAD 符號、佔位空間與 3D 模型
WQFN (BQB) 16 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片