Find TI packages

TI’s broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies. These packages include traditional ceramic and leaded options and advanced chip scale packages, using fine pitch wire bond and flip chip interconnects, with SiP, module, stacked and embedded die formats.

Select a package family below to view the options, or search all TI packages to explore TI’s complete package portfolio.

A complete description of TI package families can be found here.

Ball Grid Array (BGA)

High ball count grid array package

Ceramic Flat Pack (CFP)

Ceramic rectangular package with leads on opposite sides

Chip on Flex (COF)

Well suited for high pin-count, fine pitch applications

Dual In-Line (DIP)

Dual row through-hole package

Die-Size Ball Grid Array, WCSP (DSBGA)

Small form factor for low-to-moderate pin count devices

Land Grid Array (LGA)

High-pin-density solution in a miniature package

Leaded Chip Carrier (LCC)

Flat, square body with leads or pads on all four size and no exposed pad

Power Module

Fully integrated with active die and passives

Pin Grid Array (PGA)

High-pin-density solution in a miniature package

Quad Flat No Lead (QFN)

Thin profile no-lead package, enhanced thermal performance

Quad Flat Pack (QFP)

Leaded package on four sides, enhanced thermal

Small Outline (SO)

Leaded package with leads on opposite sides

Small Outline No Lead (SON)

Low lead inductance, thin profile for handheld applications

Transistor Outlines (TO)

Through-hole package with small footprint

Micro ChipScale Package (µCSP)

High pin capacity for compact systems

White paper

Simplifying Signal Chain Design for High Performance in Small Systems

This white paper addresses the key design considerations for working with small-package analog products to help you understand how you can leverage the benefits of these smaller devices in your design.

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