ALPHA-XILINX-KU060-SPACE

Alpha Data® board for Xilinx® Kintex® UltraScale™ XQRKU060 FPGA with TI power

ALPHA-XILINX-KU060-SPACE

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Overview

This is a development kit for the Xilinx® XQRKU060 FPGA with industrial -1 speed grade. ADA-SDEV-KIT2 has a modular board design with a XRTC-compatible configuration module, two FMC connectors, DDR3 DRAM, system monitoring, and space-grade TI power management and temperature-sensing solutions.

Buck converters (integrated switch)
TPS50601A-SP Radiation-hardened QMLV, 3-V to 7-V input, 6-A synchronous step-down converter TPS7H4001-SP Radiation-hardness-assured (RHA), 3-V to 7-V input, 18-A, synchronous step-down converter

 

DDR memory power ICs
TPS7H3301-SP Radiation-hardened QMLV, 2.3-V to 3.5-V input, 3-A sink and source DDR termination LDO regulator

 

Digital temperature sensors
TMP461-SP Radiation-hardness-assured (RHA), high-accuracy remote and local temperature sensor

 

Linear & low-dropout (LDO) regulators
TPS7H1101A-SP Radiation-hardened QMLV, 1.5-V to 7-V input, 3-A low-noise adjustable low-dropout (LDO) regulator

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Development kit

ADA-SDEV-KIT — Alpha Data® board for Xilinx® Kintex® UltraScale™ XQRKU060 FPGA with TI power

TI's Standard Terms and Conditions for Evaluation Items apply.

Technical documentation

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Type Title Date
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) PDF | HTML 17 Nov 2022
Application note Single-Event Effects Confidence Interval Calculations (Rev. A) PDF | HTML 19 Oct 2022
Selection guide TI Space Products (Rev. I) 03 Mar 2022
White paper Powering a New Era of High-Performance Space-Grade Xilinx FPGAs PDF | HTML 29 Mar 2021
Radiation & reliability report TMP461-SP Total Ionizing Dose (TID) Report (Rev. C) 04 Jan 2021
Radiation & reliability report Single-Event Effects Test Report for TMP461-SP High-Accuracy Remote and Local (Rev. B) 04 Jan 2021
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing 17 Jun 2019
Radiation & reliability report TPS50601A-SP Total Ionizing Dose (TID) Radiation Report (Rev. B) 30 May 2019
Radiation & reliability report TPS50601A-SP Single-event Effects (SEE) Test Report (Rev. A) 05 Feb 2019
Radiation & reliability report TMP461-SP (5962R1721701VXC) Neutron Displacement Damage Characterization 10 Sep 2018
Application note Use of an LDO as a Load Switch for Space Applications 01 Aug 2018
Radiation & reliability report TPS50601A-SP Neutron Displacement Damage (NDD) Characterization Report (Rev. A) 24 Jul 2018
Application note Conditional Stability in Feedback Systems 21 Feb 2018
Radiation & reliability report TPS7H1101-SP Neutron Displacement Damage Characterization Report 23 Oct 2017
Radiation & reliability report TPS7H3301-SP Single-Event Effects Radiation Report (Rev. A) 25 Jan 2017
Application note External Soft-Start Circuit for TPS7H3301-SP Power-Up Sequencing Applications 07 Jul 2016
Radiation & reliability report TPS7H3301-SP Total Ionizing Dose Radiation Report 01 Jul 2016
Radiation & reliability report TPS7H1101‐SP TID and SEE Report (Rev. A) 27 Apr 2015

Related design resources

Hardware development

EVALUATION BOARD
TMP461EVM-CVAL Radiation Hardness Assured (RHA) High-Accuracy Remote and Local Temperature Sensor Evaluation Module TPS50601ASPEVM-D TPS50601A-SP dual-operation evaluation module TPS50601ASPEVM-S TPS50601A-SP single-operation evaluation module TPS7H1101SPEVM TPS7H1101SPEVM Evaluation Module TPS7H3301EVM-CVAL TPS7H3301-SP DDR Termination Evaluation Module TPS7H4001EVM-CVAL TPS7H4001 evaluation module for one-channel, 18-A, synchronous step-down converter TPS7H4001QEVM-CVAL TPS7H4001 evaluation module for four-channel, 72-A, synchronous step-down converter

Support & training

Third-party support
TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact Alpha Data Parallel Systems Ltd..

Videos

Disclaimer

Certain information and resources (including links to non-TI sites) above may be provided by a third-party partner, and is included here merely for your convenience. TI is not the provider of, and is not responsible for, the content of such information and resources, and you should evaluate them carefully for your intended uses and on your own behalf. The inclusion of such information and resources here does not imply endorsement of any third-party company by TI, and shall not be construed as a warranty or representation regarding the suitability of any third-party products or services, either alone or in combination with any TI product or service.