The LDC1612 Evaluation Module demonstrates the use of inductive sensing technology to sense and measure the presence, position or composition of a conductive target object. The module includes two example PCB sensor coils that connect to the two channels of the LDC1612. An MSP430 microcontroller is used to interface the LDC to a host computer.
This module is designed to provide the user with maximum flexibility for system prototyping. It is perforated at two locations: one, between the PCB sensor coil (LC tank) and the LDC1612, and another, between the LDC1612 and the MSP430 interface. The first perforation gives the user the option to snap off the PCB coils from the module and experiment with custom sensor coils. The second perforation allows the user to connect the LDC1612 and sensor coils to a different microcontroller system or use multiple such sensors in one system.
An accompanying GUI allows for maximum flexibility and quick system prototyping.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | EVM User's guide | LDC131x and LDC161x EVM User’s Guide (Rev. A) | 21 Sep 2016 | |
| Certificate | LDC1612EVM EU Declaration of Conformity (DoC) | 02 Jan 2019 | ||
| Technical article | Inductive sensing: How to design an inductive sensor with the new WEBENCH Coil Designer | 19 Aug 2015 | ||
| Technical article | Inductive sensing: How to sense spring compression | 13 Jul 2015 | ||
| Technical article | Inductive sensing: How far can I sense? | 17 Jun 2015 |
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