SLVSF06 March   2019 TPS65653-Q1

PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice.  

  1. 1 Features
    1.     Simplified Schematic
  2. 2 Applications
  3. 3 Description
    1.     DC/DC Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Serial Bus Timing Parameters
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DC/DC Converters
        1. 7.3.1.1 Overview
        2. 7.3.1.2 Transition Between PWM and PFM Modes
        3. 7.3.1.3 Buck Converter Load Current Measurement
        4. 7.3.1.4 Spread-Spectrum Mode
      2. 7.3.2 Sync Clock Functionality
      3. 7.3.3 Power-Up
      4. 7.3.4 Regulator Control
        1. 7.3.4.1 Enabling and Disabling Regulators
        2. 7.3.4.2 Changing Output Voltage
      5. 7.3.5 Enable and Disable Sequences
      6. 7.3.6 Device Reset Scenarios
      7. 7.3.7 Diagnosis and Protection Features
        1. 7.3.7.1 Power-Good Information (PGOOD pin)
          1. 7.3.7.1.1 PGOOD Pin Gated mode
          2. 7.3.7.1.2 PGOOD Pin Continuous Mode
        2. 7.3.7.2 Warnings for Diagnosis (Interrupt)
          1. 7.3.7.2.1 Output Power Limit
          2. 7.3.7.2.2 Thermal Warning
        3. 7.3.7.3 Protection (Regulator Disable)
          1. 7.3.7.3.1 Short-Circuit and Overload Protection
          2. 7.3.7.3.2 Overvoltage Protection
          3. 7.3.7.3.3 Thermal Shutdown
        4. 7.3.7.4 Fault (Power Down)
          1. 7.3.7.4.1 Undervoltage Lockout
      8. 7.3.8 Operation of the GPO Signals
      9. 7.3.9 Digital Signal Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1  DEV_REV
        2. 7.6.1.2  OTP_REV
        3. 7.6.1.3  BUCK0_CTRL_1
        4. 7.6.1.4  BUCK0_CTRL_2
        5. 7.6.1.5  BUCK1_CTRL_1
        6. 7.6.1.6  BUCK1_CTRL_2
        7. 7.6.1.7  BUCK0_VOUT
        8. 7.6.1.8  BUCK1_VOUT
        9. 7.6.1.9  BUCK0_DELAY
        10. 7.6.1.10 BUCK1_DELAY
        11. 7.6.1.11 GPO_DELAY
        12. 7.6.1.12 GPO2_DELAY
        13. 7.6.1.13 GPO_CTRL
        14. 7.6.1.14 CONFIG
        15. 7.6.1.15 PLL_CTRL
        16. 7.6.1.16 PGOOD_CTRL_1
        17. 7.6.1.17 PGOOD_CTRL_2
        18. 7.6.1.18 PG_FAULT
        19. 7.6.1.19 RESET
        20. 7.6.1.20 INT_TOP_1
        21. 7.6.1.21 INT_TOP_2
        22. 7.6.1.22 INT_BUCK
        23. 7.6.1.23 TOP_STAT
        24. 7.6.1.24 BUCK_STAT
        25. 7.6.1.25 TOP_MASK_1
        26. 7.6.1.26 TOP_MASK_2
        27. 7.6.1.27 BUCK_MASK
        28. 7.6.1.28 SEL_I_LOAD
        29. 7.6.1.29 I_LOAD_2
        30. 7.6.1.30 I_LOAD_1
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Inductor Selection
        2. 8.2.1.2 Buck Input Capacitor Selection
        3. 8.2.1.3 Buck Output Capacitor Selection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The high frequency and large switching currents of the TPS65653-Q1 make the choice of layout important. Good power supply results only occur when care is given to proper design and layout. Layout affects noise pickup and generation and can cause a good design to perform with less-than-expected results. With a range of output currents from milliamps to several amps, good power supply layout is much more difficult than most general PCB design. Use the following steps as a reference to ensure the device is stable and maintains proper voltage and current regulation across its intended operating voltage and current range.

  1. Place CIN as close as possible to the VIN_Bx pin and the PGND_Bx pin. Route the VIN trace wide and thick to avoid IR drops. The trace between the positive node of the input capacitor and the VIN_Bx pin(s) of TPS65653-Q1, as well as the trace between the negative node of the input capacitor and power PGND_Bx pin(s), must be kept as short as possible. The input capacitance provides a low-impedance voltage source for the switching converter. The inductance of the connection is the most important parameter of a local decoupling capacitor — parasitic inductance on these traces must be kept as small as possible for proper device operation. The parasitic inductance can be reduced by using a ground plane as close as possible to top layer by using thin dielectric layer between top layer and ground plane.
  2. The output filter, consisting of L and COUT, converts the switching signal at SW_Bx to the noiseless output voltage. It must be placed as close as possible to the device keeping the switch node small, for best EMI behavior. Route the traces between the output capacitors of the TPS65653-Q1 and the input capacitors of the load direct and wide to avoid losses due to the IR drop.
  3. Input for analog blocks (VANA and AGND) must be isolated from noisy signals. Connect VANA directly to a quiet system voltage node and AGND to a quiet ground point where no IR drop occurs. Place the decoupling capacitor as close as possible to the VANA pin.
  4. If remote voltage sensing can be used for the load, connect the TPS65653-Q1 feedback pins FB_Bx to the respective sense pins on the load capacitor. The sense lines are susceptible to noise. They must be kept away from noisy signals such as PGND_Bx, VIN_Bx, and SW_Bx, as well as high bandwidth signals such as the I2C. Avoid both capacitive and inductive coupling by keeping the sense lines short and direct, and close to each other. Run the lines in a quiet layer. Isolate them from noisy signals by a voltage or ground plane if possible. If series resistors are used for load current measurement, place them after connection of the voltage feedback.
  5. PGND_Bx, VIN_Bx and SW_Bx must be routed on thick layers. They must not surround inner signal layers which are not able to withstand interference from noisy PGND_Bx, VIN_Bx and SW_Bx.

Due to the small package of this converter and the overall small solution size, the thermal performance of the PCB layout is important. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of a given component. Proper PCB layout, focusing on thermal performance, results in lower die temperatures. Wide power traces come with the ability to sink dissipated heat. This can be improved further on multi-layer PCB designs with vias to different planes. This results in reduced junction-to-ambient (RθJA) and junction-to-board (RθJB) thermal resistances, thereby reducing the device junction temperature, TJ. TI strongly recommends performance of a careful system-level 2D or full 3D dynamic thermal analysis at the beginning product design process by using a thermal modeling analysis software.