JAJU732C June   2019  – July 2022

 

  1.   概要
  2.   Resources
  3.   特長
  4.   アプリケーション
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1  UCC21530
      2. 2.2.2  AMC1311
      3. 2.2.3  AMC3302
      4. 2.2.4  AMC3306M05
      5. 2.2.5  LM76003
      6. 2.2.6  LMZ31707
      7. 2.2.7  OPA320
      8. 2.2.8  ISO7721
      9. 2.2.9  SN6501
      10. 2.2.10 SN6505B
      11. 2.2.11 TMP235
      12. 2.2.12 LMT87
      13. 2.2.13 TL431
      14. 2.2.14 LMV762
      15. 2.2.15 TMS320F280049 C2000 MCU
      16. 2.2.16 TMDSCNCD280049C
    3. 2.3 System Design Theory
      1. 2.3.1 Dual Active Bridge Analogy With Power Systems
      2. 2.3.2 Dual-Active Bridge - Switching Sequence
      3. 2.3.3 Dual-Active Bridge - Zero Voltage Switching (ZVS)
      4. 2.3.4 Dual-Active Bridge - Design Considerations
        1. 2.3.4.1 Leakage Inductor
        2. 2.3.4.2 Effect of Inductance on Current
        3. 2.3.4.3 Phase Shift
        4. 2.3.4.4 Capacitor Selection
        5. 2.3.4.5 Soft Switching Range
        6. 2.3.4.6 Switching Frequency
        7. 2.3.4.7 Transformer Selection
        8. 2.3.4.8 SiC MOSFET Selection
      5. 2.3.5 Loss Analysis
        1. 2.3.5.1 Design Equations
        2. 2.3.5.2 SiC MOSFET and Diode Losses
        3. 2.3.5.3 Transformer Losses
        4. 2.3.5.4 Inductor Losses
        5. 2.3.5.5 Gate Driver Losses
        6. 2.3.5.6 Efficiency
        7. 2.3.5.7 Thermal Considerations
  8. 3Circuit Description
    1. 3.1 Power Stage
    2. 3.2 DC Voltage Sensing
      1. 3.2.1 Primary DC Voltage Sensing
      2. 3.2.2 Secondary DC Voltage Sensing
    3. 3.3 Current Sensing
    4. 3.4 Power Architecture
      1. 3.4.1 Auxiliary Power Supply
      2. 3.4.2 Isolated Power Supply for Sense Circuits
    5. 3.5 Gate Driver
      1. 3.5.1 Gate Driver Circuit
      2. 3.5.2 Gate Driver Bias Power Supply
      3. 3.5.3 Gate Driver Discrete Circuits - Short-Circuit Detection and Two Level Turn Off
  9. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Required Hardware and Software
      1. 4.1.1 Hardware
      2. 4.1.2 Software
        1. 4.1.2.1 Getting Started With Software
        2. 4.1.2.2 Pin Configuration
        3. 4.1.2.3 PWM Configuration
        4. 4.1.2.4 High-Resolution Phase Shift Configuration
        5. 4.1.2.5 ADC Configuration
        6. 4.1.2.6 ISR Structure
    2. 4.2 Test Setup
    3. 4.3 PowerSUITE GUI
    4. 4.4 LABs
      1. 4.4.1 Lab 1
      2. 4.4.2 Lab 2
      3. 4.4.3 Lab 3
      4. 4.4.4 Lab 4
      5. 4.4.5 Lab 5
    5. 4.5 Test Results
      1. 4.5.1 Open-Loop Performance
      2. 4.5.2 Closed-Loop Performance
  10. 5Design Files
    1. 5.1 Schematics
    2. 5.2 Bill of Materials
    3. 5.3 PCB Layout Recommendations
      1. 5.3.1 Layout Prints
    4. 5.4 Altium Project
    5. 5.5 Gerber Files
    6. 5.6 Assembly Drawings
  11. 6Related Documentation
    1. 6.1 Trademarks
  12. 7Terminology
  13. 8About the Author
  14. 9Revision History

2.3.4.7 Transformer Selection

In a power supply design, transformers and inductors are major contributors to size. Increasing the operating frequency reduces their size, but increasing the switching frequency beyond a particular value affects the efficiency of the power module. This is because the skin effect becomes very high at that frequency where the current flows through the surface of the conductor. Similar to the skin effect, there is a proximity effect, which causes current to only flow on surfaces closest to each other. Furthermore, from a proximity standpoint in high-frequency designs, conductor size and the number of layers must be optimized. With a planar transformer, more interleaving to reduce the proximity effect can be achieved. This interleaving can be tailored to produce a specific amount of leakage so as to aid in power transfer and to contribute to ZVS.

Planar transformers offer the following advantages over conventional transformers and hence were used in this reference design:

  • Planar magnetics have very high power density. They are more compact and consume less space when compared to a conventional transformer of the same power rating.
  • They have the ability to do more interleaving to reduce AC conductor losses.
  • They have consistent spacing between turns and layers which translate into consistent parasitics. Both leakage inductance and intra-winding capacitances can be maintained to very predictable and tight values.
  • Tight control over the leakage inductance is possible with planar magnetics.
  • The transformer's compact size can support integration of the additional shim inductor with the transformer itself without the need for a separate component on board.

focuses on the actual planar transformer chosen for this application with details on the loss numbers.

The leakage inductor alone cannot ensure soft switching up to light loads. As seen previously, increasing the soft switching range by increasing inductor value increases the RMS currents. In practice, leakage inductor is chosen to provide soft switching only up to ½ or 1/3 of rated load. Beyond this point, the transformer magnetizing inductance is used for ensuring soft switching near light loads. The magnetizing inductance is chosen generally ten times the value of leakage inductance as a starting point for this optimization.