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CSD95372BQ5MC

AKTIV

60-A-Synchron-Buck NexFET™ mit Dual-Cool-Gehäuse und intelligenter Leistungsstufe

Produktdetails

VDS (V) 20 Ploss current (A) 30
VDS (V) 20 Ploss current (A) 30
VSON-CLIP (DMC) 12 30 mm² 6 x 5
  • 60-A Continuous Operating Current Capability
  • 93.4% System Efficiency at 30 A
  • Low Power Loss of 2.8 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature-Compensated Bidirectional Current
    Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and
      Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Deadtime for Shoot-Through Protection
  • High-Density SON 5 × 6 mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • DualCool™ Packaging
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen-Free
  • 60-A Continuous Operating Current Capability
  • 93.4% System Efficiency at 30 A
  • Low Power Loss of 2.8 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature-Compensated Bidirectional Current
    Sense
  • Analog Temperature Output (600 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and
      Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Deadtime for Shoot-Through Protection
  • High-Density SON 5 × 6 mm Footprint
  • Ultra-Low Inductance Package
  • System-Optimized PCB Footprint
  • DualCool™ Packaging
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen-Free

The CSD95372BQ5MC NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95372BQ5MC NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and Power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet CSD95372BQ5MC Synchronous Buck NexFET™ Smart Power Stage datasheet (Rev. A) PDF | HTML 09 Jul 2015

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Simulationsmodell

CSD95372BQ5M PSpice Model

SLPM114.ZIP (22 KB) - PSpice Model
Referenzdesigns

PMP4482 — 12 Vin, Dual-Phase, 50 A, Intelligentes Leistungsmodul – On-Board Referenzdesign

PMP4482 is a full featured power module reference design including output UV/OV/OC and input voltage UV protection. It provides 0.7~2V output voltage with load current up to 50A by using TPS40428 and CSD95372. The built-in temperature and current sensors improve the accuracy and eliminate discrete (...)
Test report: PDF
Schaltplan: PDF
Gehäuse Pins Herunterladen
VSON-CLIP (DMC) 12 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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