DLP801RE
- 0.8-inch diagonal micromirror array
- WUXGA ( 1920 × 1200) display resolution
- 9.0-µm micromirror pitch
- ±14.5° micromirror tilt (relative to flat surface)
- Corner illumination
- Supports high optical power density for high-brightness large venue displays
- Up to 40W/cm 2 total optical power density
- 2xLVDS input data bus
- Supports WUXGA up to 120 Hz
- Laser-phosphor, and RGB laser supported by DLPC4430 display controller, DLPA100 power management and motor driver IC
The DLP801RE digital micromirror device (DMD) is a digitally controlled micro-electromechanical system (MEMS) spatial light modulator (SLM) that enables bright WUXGA solid-state illuminated display systems. The TI DLP 0.8-inch WUXGA chipset comprises the DMD, DLPC4430 display controller, DLPA300 micromirror driver, and DLPA100 power and motor driver. The compact physical size of the chipset provides a complete system that enables small form factor WUXGA displays with solid-state illumination.
To help accelerate the design cycle, the DMD ecosystem includes established resources, which include production ready optical modules, optical module manufacturers, and design houses.
To learn more about how to start designing with the DMD, visit the Getting Started with TI DLP display technology page.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | DLP801RE 0.8 WUXGA Digital Micromirror Device datasheet (Rev. A) | PDF | HTML | 2023/09/14 |
Application note | TI DLP® 디스플레이 기술 시작하기 (Rev. H) | PDF | HTML | 2024/04/19 | |
Application note | DMD Optical Efficiency for Visible Wavelengths (Rev. B) | PDF | HTML | 2023/04/10 | |
Application note | DLP System Design: Brightness Requirements and Tradeoffs (Rev. C) | PDF | HTML | 2022/05/05 | |
White paper | TI DLP® technology for Laser TV displays (Rev. A) | 2018/08/28 | ||
White paper | TI DLP® technology for digital signage (Rev. A) | 2018/08/28 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | 다운로드 |
---|---|---|
DLP-S600 (FYV) | 350 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치