SPRSP07F June   2017  – December 2019 66AK2G12

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. 4.3.1  DSS
      2. 4.3.2  DDR EMIF
      3. 4.3.3  GPMC
      4. 4.3.4  Timers
      5. 4.3.5  I2C
      6. 4.3.6  UART
      7. 4.3.7  SPI
      8. 4.3.8  QSPI
      9. 4.3.9  McASP
      10. 4.3.10 USB
      11. 4.3.11 PCIESS
      12. 4.3.12 DCAN
      13. 4.3.13 EMAC
      14. 4.3.14 MLB
      15. 4.3.15 McBSP
      16. 4.3.16 MMC/SD
      17. 4.3.17 GPIO
      18. 4.3.18 ePWM
      19. 4.3.19 PRU-ICSS
      20. 4.3.20 Emulation and Debug Subsystem
      21. 4.3.21 System and Miscellaneous
        1. 4.3.21.1 Boot Mode Configuration
        2. 4.3.21.2 Reset
        3. 4.3.21.3 Oscillator Reference Clocks and Clock Generator
        4. 4.3.21.4 Miscellaneous
        5. 4.3.21.5 Interrupt Controllers (INTC)
        6. 4.3.21.6 Power Supplies
    4. 4.4 Pin Multiplexing
    5. 4.5 Connections for Unused Pins
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power-On-Hour (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. Table 5-2  DDR3L SSTL DC Electrical Characteristics
      2. Table 5-3  I2C OPEN DRAIN DC Electrical Characteristics
      3. Table 5-4  Oscillators DC Electrical Characteristics
      4. Table 5-5  LVDS Input Buffer DC Electrical Characteristics
      5. Table 5-6  LVDS Output Buffer DC Electrical Characteristics
      6. Table 5-7  MLB LVDS Buffers DC Electrical Characteristics
      7. Table 5-8  PORn DC Electrical Characteristics
      8. Table 5-9  1.8-Volt I/O LVCMOS DC Electrical Characteristics
      9. Table 5-10 3.3-Volt I/O LVCMOS DC Electrical Characteristics
      10. 5.7.1      USB0_PHY and USB1_PHY DC Electrical Characteristics
      11. 5.7.2      PCIe SERDES DC Electrical Characteristics
    8. 5.8 Thermal Resistance Characteristics for ABY Package
      1. Table 5-11 Thermal Resistance Characteristics for ABY Package
    9. 5.9 Timing and Switching Characteristics
      1. 5.9.1 Power Supply Sequencing
        1. 5.9.1.1 Power-Up Sequence
        2. 5.9.1.2 Power-Down Sequence
      2. 5.9.2 Reset Timing
        1. 5.9.2.1 Reset Electrical Data/Timing
      3. 5.9.3 Clock Specifications
        1. 5.9.3.1  Input Clocks / Oscillators
          1. 5.9.3.1.1 System Oscillator (SYSOSC) with External Crystal Circuit
          2. 5.9.3.1.2 System Oscillator (SYSOSC) with External LVCMOS Clock Source
          3. 5.9.3.1.3 System Oscillator (SYSOSC) Not Used
          4. 5.9.3.1.4 Optional LVDS Clock Inputs
        2. 5.9.3.2  Optional LVDS Clock Inputs Not Used
        3. 5.9.3.3  Optional Audio Oscillator (AUDOSC) with External Crystal Circuit
        4. 5.9.3.4  Optional Audio Oscillator (AUDOSC) with External LVCMOS Clock Source
        5. 5.9.3.5  Optional Audio Oscillator (AUDOSC) Not Used
        6. 5.9.3.6  Optional USB PHY Reference Clock
        7. 5.9.3.7  PCIe Reference Clock
        8. 5.9.3.8  Output Clocks
        9. 5.9.3.9  PLLs
          1. 5.9.3.9.1 DDR_PLL Settings
        10. 5.9.3.10 Recommended Clock and Control Signal Transition Behavior
      4. 5.9.4 Peripherals
        1. 5.9.4.1  DCAN
        2. 5.9.4.2  DSS
        3. 5.9.4.3  DDR EMIF
        4. 5.9.4.4  EMAC
          1. 5.9.4.4.1 EMAC MDIO Interface Timings
          2. 5.9.4.4.2 EMAC MII Timings
            1. Table 5-28 Timing Requirements for MII_RXCLK—MII Operation
            2. Table 5-29 Timing Requirements for MII_TXCLK—MII Operation
            3. Table 5-30 Timing Requirements for EMAC MII Receive 10 Mbps and 100 Mbps
            4. Table 5-31 Switching Characteristics Over Recommended Operating Conditions for EMAC MII Transmit 10 Mbps and 100 Mbps
          3. 5.9.4.4.3 EMAC RMII Timings
            1. Table 5-32 Timing Requirements for EMAC RMII_REFCLK—RMII Operation
            2. Table 5-33 Timing Requirements for EMAC RMII Receive
            3. Table 5-34 Switching Characteristics Over Recommended Operating Conditions for EMAC RMII_REFCLK —RMII Operation
            4. Table 5-35 Switching Characteristics Over Recommended Operating Conditions for EMAC RMII Transmit 10 Mbps and 100 Mbps
          4. 5.9.4.4.4 EMAC RGMII Timings
            1. Table 5-36 Timing Requirements for RGMII_RXC—RGMII Operation
            2. Table 5-37 Timing Requirements for EMAC RGMII Input Receive for 10 Mbps, 100 Mbps, and 1000 Mbps
            3. Table 5-38 Switching Characteristics Over Recommended Operating Conditions for Transmit - RGMII operation for 10 Mbps, 100 Mbps, and 1000 Mbps
            4. Table 5-39 Switching Characteristics Over Recommended Operating Conditions for EMAC RGMII Transmit - RGMII_TXD[3:0], and RGMII_TXCTL - RGMII Mode
            5. Table 5-40 Switching Characteristics Over Recommended Operating Conditions for EMAC RGMII Transmit - RGMII_TXD[3:0], and RGMII_TXCTL - RGMII ID Mode
        5. 5.9.4.5  GPMC
          1. 5.9.4.5.1 GPMC and NOR Flash—Synchronous Mode
            1. Table 5-41 GPMC and NOR Flash Timing Conditions—Synchronous Mode
            2. Table 5-42 GPMC and NOR Flash Timing Requirements—Synchronous Mode
            3. Table 5-43 GPMC and NOR Flash Switching Characteristics—Synchronous Mode
          2. 5.9.4.5.2 GPMC and NOR Flash—Asynchronous Mode
            1. Table 5-44 GPMC and NOR Flash Internal Timing Parameters—Asynchronous Mode
            2. Table 5-45 GPMC and NOR Flash Timing Requirements—Asynchronous Mode
            3. Table 5-46 GPMC and NOR Flash Switching Characteristics—Asynchronous Mode
        6. 5.9.4.6  I2C
          1. Table 5-47 Timing Requirements for I2C Input Timings
          2. Table 5-48 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
        7. 5.9.4.7  McASP
          1. Table 5-49 Timing Requirements for McASP
        8. 5.9.4.8  McBSP
          1. Table 5-51 McBSP Timing Requirements
          2. Table 5-52 McBSP Switching Characteristics
          3. Table 5-53 McBSP Timing Requirements for FSR When GSYNC = 1
        9. 5.9.4.9  MLB
        10. 5.9.4.10 MMC/SD
          1. Table 5-60 MMC Timing Conditions
          2. Table 5-61 Timing Requirements for MMC0_CMD and MMC0_DATn
          3. Table 5-62 Timing Requirements for MMC1_CMD and MMC1_DATn when operating in SDR mode
          4. Table 5-63 Timing Requirements for MMC1_CMD and MMC1_DATn when operating in DDR mode
          5. Table 5-64 Switching Characteristics for MMCi_CLK
          6. Table 5-65 Switching Characteristics for MMC0_CMD and MMC0_DATn—HSPE=0
          7. Table 5-66 Switching Characteristics for MMC1_CMD and MMC1_DATn—HSPE=0 when operating in SDR mode
          8. Table 5-67 Switching Characteristics for MMC1_CMD and MMC1_DATn—HSPE=0 when operating in DDR mode
        11. 5.9.4.11 PCIESS
        12. 5.9.4.12 PRU-ICSS
          1. 5.9.4.12.1 Programmable Real-Time Unit (PRU-ICSS PRU)
            1. 5.9.4.12.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
              1. Table 5-68 PRU-ICSS PRU Timing Requirements - Direct Input Mode
              2. Table 5-69 PRU-ICSS PRU Switching Requirements – Direct Output Mode
            2. 5.9.4.12.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
              1. Table 5-70 PRU-ICSS PRU Timing Requirements – Parallel Capture Mode
            3. 5.9.4.12.1.3 PRU-ICSS PRU Shift Mode Electrical Data and Timing
              1. Table 5-71 PRU-ICSS PRU Timing Requirements – Shift In Mode
              2. Table 5-72 PRU-ICSS PRU Switching Requirements – Shift Out Mode
          2. 5.9.4.12.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
            1. 5.9.4.12.2.1 PRU-ICSS ECAT Electrical Data and Timing
              1. Table 5-73 PRU-ICSS ECAT Timing Requirements – Input Validated With SYNCx
              2. Table 5-74 PRU-ICSS ECAT Timing Requirements – LATCHx_IN
              3. Table 5-75 PRU-ICSS ECAT Switching Requirements – Digital IOs
          3. 5.9.4.12.3 PRU-ICSS MII_RT and Switch
            1. 5.9.4.12.3.1 PRU-ICSS MDIO Electrical Data and Timing
              1. Table 5-76 PRU-ICSS MDIO Timing Requirements – MDIO_DATA
              2. Table 5-77 PRU-ICSS MDIO Switching Characteristics – MDIO_CLK
              3. Table 5-78 PRU-ICSS MDIO Switching Characteristics – MDIO_DATA
            2. 5.9.4.12.3.2 PRU-ICSS MII_RT Electrical Data and Timing
              1. Table 5-79 PRU-ICSS MII_RT Timing Requirements – MII_RXCLK
              2. Table 5-80 PRU-ICSS MII_RT Timing Requirements – MII_TXCLK
              3. Table 5-81 PRU-ICSS MII_RT Timing Requirements – MII_RXD[3:0], MII_RXDV, and MII_RXER
              4. Table 5-82 PRU-ICSS MII_RT Switching Characteristics – MII_TXD[3:0] and MII_TXEN
          4. 5.9.4.12.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
            1. Table 5-83 PRU-ICSS UART Timing Conditions
            2. Table 5-84 Timing Requirements for PRU-ICSS UART Receive
            3. Table 5-85 Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART Transmit
          5. 5.9.4.12.5 PRU-ICSS PRU Sigma Delta and EnDAT Modes
            1. Table 5-86 PRU-ICSS PRU Timing Requirements - Sigma Delta Mode
            2. Table 5-87 PRU-ICSS PRU Timing Requirements - EnDAT Mode
            3. Table 5-88 PRU-ICSS PRU Switching Requirements - EnDAT Mode
        13. 5.9.4.13 QSPI
        14. 5.9.4.14 SPI
          1. 5.9.4.14.1 SPI—Slave Mode
            1. Table 5-91 Timing Requirements for SPI Input Timings—Slave Mode
            2. Table 5-92 Switching Characteristics for SPI Output Timings—Slave Mode
          2. 5.9.4.14.2 SPI—Master Mode
            1. Table 5-93 SPI Timing Conditions—Master Mode
            2. Table 5-94 Timing Requirements for SPI Input Timings—Master Mode
            3. Table 5-95 Switching Characteristics for SPI Output Timings—Master Mode
        15. 5.9.4.15 Timers
        16. 5.9.4.16 UART
          1. Table 5-98 Timing Requirements for UART
          2. Table 5-99 Switching Characteristics Over Recommended Operating Conditions for UART
        17. 5.9.4.17 USB
      5. 5.9.5 Emulation and Debug Subsystem
        1. 5.9.5.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
          1. 5.9.5.1.1 JTAG Electrical Data and Timing
            1. Table 5-100 Timing Requirements for IEEE 1149.1 JTAG
            2. Table 5-101 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Arm A15
    4. 6.4  C66x DSP Subsystem
    5. 6.5  C66x Cache Subsystem
    6. 6.6  PRU-ICSS
    7. 6.7  Memory Subsystem
      1. 6.7.1 MSMC
      2. 6.7.2 DDR EMIF
      3. 6.7.3 GPMC
    8. 6.8  Interprocessor Communication
      1. 6.8.1 MSGMGR
      2. 6.8.2 SEM
    9. 6.9  EDMA
    10. 6.10 Peripherals
      1. 6.10.1  DCAN
      2. 6.10.2  DSS
      3. 6.10.3  eCAP
      4. 6.10.4  ePWM
      5. 6.10.5  eQEP
      6. 6.10.6  GPIO
      7. 6.10.7  I2C
      8. 6.10.8  ASRC
      9. 6.10.9  McASP
      10. 6.10.10 McBSP
      11. 6.10.11 MLB
      12. 6.10.12 MMC/SD
      13. 6.10.13 NSS
      14. 6.10.14 PCIESS
      15. 6.10.15 QSPI
      16. 6.10.16 SPI
      17. 6.10.17 Timers
      18. 6.10.18 UART
      19. 6.10.19 USB
  7. 7Applications, Implementation, and Layout
    1. 7.1 DDR3L Board Design and Layout Guidelines
      1. 7.1.1 DDR3L General Board Layout Guidelines
      2. 7.1.2 DDR3L Board Design and Layout Guidelines
        1. 7.1.2.1  Board Designs
        2. 7.1.2.2  DDR3L Device Combinations
        3. 7.1.2.3  DDR3L Interface Schematic
          1. 7.1.2.3.1 32-Bit DDR3L Interface
          2. 7.1.2.3.2 16-Bit DDR3L Interface
        4. 7.1.2.4  Compatible JEDEC DDR3L Devices
        5. 7.1.2.5  PCB Stackup
        6. 7.1.2.6  Placement
        7. 7.1.2.7  DDR3L Keepout Region
        8. 7.1.2.8  Bulk Bypass Capacitors
        9. 7.1.2.9  High-Speed Bypass Capacitors
          1. 7.1.2.9.1 Return Current Bypass Capacitors
        10. 7.1.2.10 Net Classes
        11. 7.1.2.11 DDR3L Signal Termination
        12. 7.1.2.12 VREF_DDR Routing
        13. 7.1.2.13 VTT
        14. 7.1.2.14 CK and ADDR_CTRL Topologies and Routing Definition
          1. 7.1.2.14.1 Four DDR3L Devices
            1. 7.1.2.14.1.1 CK and ADDR_CTRL Topologies, Four DDR3L Devices
            2. 7.1.2.14.1.2 CK and ADDR_CTRL Routing, Four DDR3L Devices
          2. 7.1.2.14.2 One DDR3L Device
            1. 7.1.2.14.2.1 CK and ADDR_CTRL Topologies, One DDR3L Device
            2. 7.1.2.14.2.2 CK and ADDR/CTRL Routing, One DDR3L Device
        15. 7.1.2.15 Data Topologies and Routing Definition
          1. 7.1.2.15.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3L Devices
          2. 7.1.2.15.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3L Devices
        16. 7.1.2.16 Routing Specification
          1. 7.1.2.16.1 CK and ADDR_CTRL Routing Specification
          2. 7.1.2.16.2 DQS and DQ Routing Specification
    2. 7.2 High Speed Differential Signal Routing Guidance
    3. 7.3 Power Distribution Network (PDN) Implementation Guidance
      1. 7.3.1 Decoupling/Filtering of Analog Power Supplies and Reference Inputs
        1. 7.3.1.1 PLL Power Supplies
        2. 7.3.1.2 DDR EMIF PHY DLL Power Supplies
        3. 7.3.1.3 DDR EMIF PHY Voltage Reference Input
        4. 7.3.1.4 Internal LDO Outputs
        5. 7.3.1.5 PCIe PHY Power Supply
        6. 7.3.1.6 USB PHY Power Supplies
    4. 7.4 Single-Ended Interfaces
      1. 7.4.1 General Routing Guidelines
    5. 7.5 Clock Routing Guidelines
      1. 7.5.1 Oscillator Routing
      2. 7.5.2 Oscillator Ground Connection
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABY|625
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1.1 Features

    Processor cores:

  • Arm®Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz
    • Supports full Implementation of Armv7-A architecture instruction set
    • Integrated SIMDv2 (Arm®Neon™ Technology) and VFPv4 (Vector Floating Point)
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 512KB of L2 memory
    • Error Correction Code (ECC) protection for L1 data memory ECC for L2 memory
    • Parity protection for L1 program memory
    • Global Timebase Counter (GTC)
      • 64-Bit free-running counter that provides timebase for Arm A15 internal timers
      • Compliant to Armv7 MPCore Architecture for Generic Timers
  • C66x fixed- and floating-point VLIW DSP subsystem at up to 1000 MHz
    • Fully object-code compatible With C67x+ and C64x+ cores
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 1024KB of L2 configurable as L2 RAM or cache
    • Error detection for L1 program memory
    • ECC for L1 data memory
    • ECC for L2 data memory

    • Industrial subsystem:

  • Up to Two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS), each supports:
    • Two Programmable Real-Time Units (PRUs) with enhanced multiplier and accumulator, each PRU supports:
      • 16KB of program memory With ECC
      • 8KB of data memory With ECC
      • CRC32 and CRC16 hardware accelerator
      • 20 × enhanced GPIO
      • Serial Capture Unit (SCU), supporting direct connection, 16-bit parallel capture, 28-bit shift, MII_RT, EnDat 2.2 protocol and Sigma-Delta demodulation
      • Scratch pad and XFR direct connect
    • 64KB of general-purpose memory With ECC
    • One Ethernet MII_RT module with two MII ports configurable for connection with each PRU; supports multiple industrial communication protocols
    • Industrial Ethernet Peripheral (IEP) to manage and generate industrial Ethernet functions
    • Built-In Universal Asynchronous Receiver and Transmitter (UART) 16550, with a dedicated 192-MHz clock to support 12-Mbps PROFIBUS®
    • Built-In industrial Ethernet 64-Bit timer
    • Built-In enhanced capture module (eCAP)

    • Memory subsystem:

  • Multicore Shared Memory Controller (MSMC) with 1024KB of shared L2 RAM
    • Provides high-performance interconnect to internal shared SRAM and DDR EMIF for both Arm A15 and C66x Access
    • Supports Arm I/O coherency where Arm A15 is cache coherent to other system masters accessing the MSMC-SRAM or DDR EMIF
    • Supports ECC on SRAM
  • Up to 36-Bit DDR External Memory Interface (EMIF)
    • Supports DDR3L at up to 1066 MT/s
    • Supports 4-GB memory address range
    • Supports 32-Bit SDRAM data bus with 4-bit ECC
    • Supports 16-Bit and 32-Bit SDRAM data bus without ECC
  • General-Purpose Memory Controller (GPMC)
    • Flexible 8- and 16-Bit asynchronous memory interface with up to four chip selects
    • Supports NOR, Muxed-NOR, SRAM
    • Supports general-purpose memory-port expansion with the following modes:
      • Asynchronous read and write access
      • Asynchronous read page access (4-, 8-, 16-Word16)
      • Synchronous read and write access
      • Synchronous read burst access without wrap capability (4-, 8-, 16-Word16)

    • Network Subsystem (NSS):

  • Ethernet MAC (EMAC) subsystem
    • One-port Gigabit Ethernet: RMII, MII, RGMII
    • Supports 10-, 100-, 1000-Mbps full duplex
    • Supports 10-, 100-Mbps half duplex
    • Supports Ethernet Audio Video Bridging (eAVB)
    • Maximum frame size 2016 Bytes (2020 Bytes with VLAN)
    • Eight priority level QOS support (802.1p)
    • IEEE 1588v2 (2008 Annex D, Annex E, and
      Annex F) to facilitate Audio Video Bridging 802.1AS Precision Time Protocol (PTP)
    • CPTS module with timestamping support for IEEE 1588v2
    • DSCP priority mapping (IPv4 and IPv6)
    • MDIO module for PHY management
    • Enhanced statistics collection
  • Navigator Subsystem (NAVSS)
    • Built-In packet DMA controller for optimized network processing
    • Built-In Queue Manager (QM) for optimized network processing
      • Supports up to 128 queues
      • 2048 buffers supported in internal queue RAM
  • Crypto Engine (SA) supports:
    • Crypto Function Library for AES, DES, 3DES, SHA1, MD5, SHA2-224 and SHA2-256 Operations
    • Block data encryption supported through hardware cores
      • AES with 128-, 192-, and 256-Bit Key supports
      • DES and 3DES with 1, 2, or 3 Different Key support
    • Programmable Mode Control Engine (MCE)
    • Public Key Accelerator (PKA) with elliptic curve cryptography
      • Elliptic Curve Diffie–Hellman (ECDH) based key exchange and digital signature (ECDSA) applications
      • Authentication for SHA1, MD5, SHA2-224 and SHA2-256
      • Keyed HMAC operation through hardware core
        • True Random Number Generator (TRNG)

        • Display Subsystem:

      • Supports one video pipe with in-loop scaling, color space
      • Conversion and background color overlay
      • Input data format: BITMAP, RGB16, RGB24, RGB32, ARGB16, ARGB32, YUV420, YUV422, and RGB565-A8
      • Supported display interfaces:
        • MIPI® DPI 2.0 parallel interface
        • RFBI (MIPI-DBI 2.0) up to QVGA at 30fps
        • BT.656 4:2:2
        • BT.1120 4:2:2 up to 1920 × 1080 at 30fps
      • In-loop scaling capability
      • LCD interface supports:
        • Active Matrix (TFT)
        • Passive Matrix (STN)
        • Grayscale
        • TDM
        • AC Bias Control
        • Dither
        • CPR

        • Asynchronous Audio Sample Rate Converter (ASRC)

      • High performance asynchronous sample rate converter with 140 dB Signal-to-Noise (SNR)
      • Up to 8 stereo streams (16 audio channels)
      • Automatically sensing / detection of input sample frequencies
      • Attenuation of sampling clock jitter
      • 16-, 18-, 20-, 24-Bit data input/output
      • Audio sample rates from 8 kHz to 216 kHz
      • Input/output sampling ratios from 16:1 to 1:16
      • Group mode, where multiple ASRC blocks use the same timing loop for input or output
      • Linear phase FIR filter
      • Controllable soft mute
      • Independent clock generator, and rate and stamp generator, for each input and output clock zone
      • Separate DMA events for input and output, for each channel and group

        • High-speed serial interfaces:

      • PCI Express® 2.0 port with integrated PHY:
        • Single lane Gen2-compliant port
        • Root Complex (RC) and End Point (EP) modes
      • Up to two USB 2.0 High-Speed dual-role ports with Integrated PHYs, support:
        • Dual-role-device (DRD) Capability with:
          • USB 2.0 peripheral (or device) at
            HS (480Mbps) and FS (12Mbps) speeds
          • USB 2.0 host at HS (480Mbps),
            FS (12Mbps), and LS (1.5Mbps) speeds
          • USB 2.0 static peripheral and static host operations
        • xHCI controller with the following features:
          • Compatible to the xHCI specification (revision 1.1) in host mode
          • All modes of transfer (control, bulk, interrupt, and isochronous)
          • 15 transmit (TX), 15 receive (RX) endpoints (EPs), and one bidirectional endpoint (EP0)

        • Flash media interfaces:

      • QSPI™ with XIP and up to four chip selects, supports:
        • Memory-mapped direct mode of operation for performing FLASH data transfers and executing code from FLASH memory (XIP)
        • Supports up to 96 MHz
        • Internal SRAM buffer with ECC
        • High speed read data capture mechanism
      • Two Multimedia Card (MMC) and Secure Digital (SD) ports
        • Supports JEDEC JESD84 v4.5-A441 and SD3.0 physical layer with SDA3.00 standards
        • MMC0 supports 3.3-V I/O for:
          • SD DS and HS mode
          • eMMC mode HS-SDR
            up to 48 MHz
        • MMC1 supports 1.8-V I/O modes for eMMC, including HS-SDR and DDR at up to 48 MHz with 4- and 8-Bit bus width

        • Audio peripherals:

      • Three Multichannel Audio Serial Port (McASP) peripherals
        • Transmit and receive clocks up to 50 MHz
        • Two independent clock zones and independent transmit and receive clocks per McASP
        • Up to 16-, 10-, 6-serial data pins for McASP0, McASP1, and McASP2, respectively
        • Supports TDM, I2S, and similar formats
        • Supports DIT mode
        • Built-In FIFO buffers for optimized system traffic
      • Multichannel Buffered Serial Port (McBSP)
        • Transmit and receive clocks up to 50 MHz
        • Two clock zones and two serial-data pins
        • Supports TDM, I2S, and similar formats

        • Real-time control interfaces:

      • Six Enhanced High Resolution Pulse Width Modulation (eHRPWM) Modules, Each Counter supports:
        • Dedicated 16-Bit Time-Base with Period and Frequency Control
        • Two independent PWM outputs with single edge operation
        • Two independent PWM outputs with dual-edge symmetric operation
        • One independent PWM output with dual-edge asymmetric operation
      • Two 32-Bit Enhanced Capture Modules (eCAP):
        • Supports one capture input or one auxiliary PWM output configuration options
        • 4-Event time-stamp registers (Each 32-Bits)
        • Interrupt on either of the four events
      • Three 32-Bit Enhanced Quadrature Pulse Encoder Modules (eQEP), each supports:
        • Quadrature decoding
        • Position counter and control unit for position measurement
        • Unit time base for speed and frequency measurement

        • General connectivity:

      • Two Controller Area Network (CAN) Ports
        • Supports CAN v2.0 Part A, B (ISO 11898-1) protocol
        • Bit rates up to 1 Mbps
        • Dual clock source
        • ECC protection for message RAM
      • One Media Local Bus (MLB)
        • Supports both 3-pin (up to MOST50, 1024 × Fs) and 6-pin (up to MOST150, 2048 × Fs) versions of MediaLB® Physical layer specification v4.2
        • Supports all types of data transfer over 64 logical channels (synchronous stream, isochronous, asynchronous packet, control message)
        • Supports 3-wire MOST 150 protocol
      • Three Inter-Integrated Circuit (I2C) interfaces, each supports:
        • Standard (up to 100 kHz) and
          Fast (up to 400 kHz) modes
        • 7-Bit addressing mode
        • Supports EEPROM size up to 4Mbit
      • Four Serial Peripheral Interfaces (SPI), each supports:
        • Operates at up to 50 MHz in master mode and 25 MHz in slave mode
        • Two chip selects
      • Three UART interfaces
        • All UARTs are 16C750-compatible and operate at up to 3M baud
        • UART0 supports 8 pins with full modem control, with DSR, DTR, DCD, and RI signals
        • UART1 and UART2 are 4-pin interfaces
      • General-Purpose I/O (GPIO)
        • Up to 212 GPIOs muxed with other interfaces
        • Can be configured as interrupt pins

        • Timers and miscellaneous modules:

      • Seven 64-Bit timers:
        • Two 64-Bit timers dedicated to Arm A15 and DSP cores (one timer per core)
          • Watchdog and General-Purpose (GP)
        • Four 64-Bit timers are shared for general purposes
          • Each 64-Bit timer can be configured as two individual 32-Bit timers
          • One 64-Bit timer dedicated for PMMC
          • Two timers input/output pin pairs
        • Interprocessor communication with:
          • Message manager to facilitate multiprocessor access to the PMMC:
            • Provides hardware acceleration for pushing and popping messages to/from logical queues
            • Supports up to 64 queues and 128 messages
          • Semaphore module with up to 64 independent semaphores and 16 masters (device cores)
        • EDMA with 128 (2 × 64) channels and
          1024 (2 × 512) PaRAM entries

          • Keystone II System on Chip (SoC) architecture:

        • Security
          • Supports General-Purpose (GP) and High-Secure (HS) devices
          • Supports secure boot
          • Supports customer secondary keys
          • 4KB of One-Time Programmable (OTP) ROM for customer keys
        • Power management
          • Integrated Power Management Microcontroller (PMMC) technology
        • Supports primary boot from UART, I2C, SPI, GPMC, SD or eMMC, USB device firmware upgrade v1.1, PCIe®, and Ethernet interfaces
        • Keystone II debug architecture with integrated Arm CoreSight™ support and trace capability

          • Operating Temperature (TJ):

        • –40°C to 125°C (Industrial Extended)
        • –40°C to 105°C (Extended)
        • 0°C to 90°C (Commercial)