SPRSP07F June   2017  – December 2019 66AK2G12

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. 4.3.1  DSS
      2. 4.3.2  DDR EMIF
      3. 4.3.3  GPMC
      4. 4.3.4  Timers
      5. 4.3.5  I2C
      6. 4.3.6  UART
      7. 4.3.7  SPI
      8. 4.3.8  QSPI
      9. 4.3.9  McASP
      10. 4.3.10 USB
      11. 4.3.11 PCIESS
      12. 4.3.12 DCAN
      13. 4.3.13 EMAC
      14. 4.3.14 MLB
      15. 4.3.15 McBSP
      16. 4.3.16 MMC/SD
      17. 4.3.17 GPIO
      18. 4.3.18 ePWM
      19. 4.3.19 PRU-ICSS
      20. 4.3.20 Emulation and Debug Subsystem
      21. 4.3.21 System and Miscellaneous
        1. 4.3.21.1 Boot Mode Configuration
        2. 4.3.21.2 Reset
        3. 4.3.21.3 Oscillator Reference Clocks and Clock Generator
        4. 4.3.21.4 Miscellaneous
        5. 4.3.21.5 Interrupt Controllers (INTC)
        6. 4.3.21.6 Power Supplies
    4. 4.4 Pin Multiplexing
    5. 4.5 Connections for Unused Pins
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power-On-Hour (POH) Limits
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Operating Performance Points
    6. 5.6 Power Consumption Summary
    7. 5.7 Electrical Characteristics
      1. Table 5-2  DDR3L SSTL DC Electrical Characteristics
      2. Table 5-3  I2C OPEN DRAIN DC Electrical Characteristics
      3. Table 5-4  Oscillators DC Electrical Characteristics
      4. Table 5-5  LVDS Input Buffer DC Electrical Characteristics
      5. Table 5-6  LVDS Output Buffer DC Electrical Characteristics
      6. Table 5-7  MLB LVDS Buffers DC Electrical Characteristics
      7. Table 5-8  PORn DC Electrical Characteristics
      8. Table 5-9  1.8-Volt I/O LVCMOS DC Electrical Characteristics
      9. Table 5-10 3.3-Volt I/O LVCMOS DC Electrical Characteristics
      10. 5.7.1      USB0_PHY and USB1_PHY DC Electrical Characteristics
      11. 5.7.2      PCIe SERDES DC Electrical Characteristics
    8. 5.8 Thermal Resistance Characteristics for ABY Package
      1. Table 5-11 Thermal Resistance Characteristics for ABY Package
    9. 5.9 Timing and Switching Characteristics
      1. 5.9.1 Power Supply Sequencing
        1. 5.9.1.1 Power-Up Sequence
        2. 5.9.1.2 Power-Down Sequence
      2. 5.9.2 Reset Timing
        1. 5.9.2.1 Reset Electrical Data/Timing
      3. 5.9.3 Clock Specifications
        1. 5.9.3.1  Input Clocks / Oscillators
          1. 5.9.3.1.1 System Oscillator (SYSOSC) with External Crystal Circuit
          2. 5.9.3.1.2 System Oscillator (SYSOSC) with External LVCMOS Clock Source
          3. 5.9.3.1.3 System Oscillator (SYSOSC) Not Used
          4. 5.9.3.1.4 Optional LVDS Clock Inputs
        2. 5.9.3.2  Optional LVDS Clock Inputs Not Used
        3. 5.9.3.3  Optional Audio Oscillator (AUDOSC) with External Crystal Circuit
        4. 5.9.3.4  Optional Audio Oscillator (AUDOSC) with External LVCMOS Clock Source
        5. 5.9.3.5  Optional Audio Oscillator (AUDOSC) Not Used
        6. 5.9.3.6  Optional USB PHY Reference Clock
        7. 5.9.3.7  PCIe Reference Clock
        8. 5.9.3.8  Output Clocks
        9. 5.9.3.9  PLLs
          1. 5.9.3.9.1 DDR_PLL Settings
        10. 5.9.3.10 Recommended Clock and Control Signal Transition Behavior
      4. 5.9.4 Peripherals
        1. 5.9.4.1  DCAN
        2. 5.9.4.2  DSS
        3. 5.9.4.3  DDR EMIF
        4. 5.9.4.4  EMAC
          1. 5.9.4.4.1 EMAC MDIO Interface Timings
          2. 5.9.4.4.2 EMAC MII Timings
            1. Table 5-28 Timing Requirements for MII_RXCLK—MII Operation
            2. Table 5-29 Timing Requirements for MII_TXCLK—MII Operation
            3. Table 5-30 Timing Requirements for EMAC MII Receive 10 Mbps and 100 Mbps
            4. Table 5-31 Switching Characteristics Over Recommended Operating Conditions for EMAC MII Transmit 10 Mbps and 100 Mbps
          3. 5.9.4.4.3 EMAC RMII Timings
            1. Table 5-32 Timing Requirements for EMAC RMII_REFCLK—RMII Operation
            2. Table 5-33 Timing Requirements for EMAC RMII Receive
            3. Table 5-34 Switching Characteristics Over Recommended Operating Conditions for EMAC RMII_REFCLK —RMII Operation
            4. Table 5-35 Switching Characteristics Over Recommended Operating Conditions for EMAC RMII Transmit 10 Mbps and 100 Mbps
          4. 5.9.4.4.4 EMAC RGMII Timings
            1. Table 5-36 Timing Requirements for RGMII_RXC—RGMII Operation
            2. Table 5-37 Timing Requirements for EMAC RGMII Input Receive for 10 Mbps, 100 Mbps, and 1000 Mbps
            3. Table 5-38 Switching Characteristics Over Recommended Operating Conditions for Transmit - RGMII operation for 10 Mbps, 100 Mbps, and 1000 Mbps
            4. Table 5-39 Switching Characteristics Over Recommended Operating Conditions for EMAC RGMII Transmit - RGMII_TXD[3:0], and RGMII_TXCTL - RGMII Mode
            5. Table 5-40 Switching Characteristics Over Recommended Operating Conditions for EMAC RGMII Transmit - RGMII_TXD[3:0], and RGMII_TXCTL - RGMII ID Mode
        5. 5.9.4.5  GPMC
          1. 5.9.4.5.1 GPMC and NOR Flash—Synchronous Mode
            1. Table 5-41 GPMC and NOR Flash Timing Conditions—Synchronous Mode
            2. Table 5-42 GPMC and NOR Flash Timing Requirements—Synchronous Mode
            3. Table 5-43 GPMC and NOR Flash Switching Characteristics—Synchronous Mode
          2. 5.9.4.5.2 GPMC and NOR Flash—Asynchronous Mode
            1. Table 5-44 GPMC and NOR Flash Internal Timing Parameters—Asynchronous Mode
            2. Table 5-45 GPMC and NOR Flash Timing Requirements—Asynchronous Mode
            3. Table 5-46 GPMC and NOR Flash Switching Characteristics—Asynchronous Mode
        6. 5.9.4.6  I2C
          1. Table 5-47 Timing Requirements for I2C Input Timings
          2. Table 5-48 Switching Characteristics Over Recommended Operating Conditions for I2C Output Timings
        7. 5.9.4.7  McASP
          1. Table 5-49 Timing Requirements for McASP
        8. 5.9.4.8  McBSP
          1. Table 5-51 McBSP Timing Requirements
          2. Table 5-52 McBSP Switching Characteristics
          3. Table 5-53 McBSP Timing Requirements for FSR When GSYNC = 1
        9. 5.9.4.9  MLB
        10. 5.9.4.10 MMC/SD
          1. Table 5-60 MMC Timing Conditions
          2. Table 5-61 Timing Requirements for MMC0_CMD and MMC0_DATn
          3. Table 5-62 Timing Requirements for MMC1_CMD and MMC1_DATn when operating in SDR mode
          4. Table 5-63 Timing Requirements for MMC1_CMD and MMC1_DATn when operating in DDR mode
          5. Table 5-64 Switching Characteristics for MMCi_CLK
          6. Table 5-65 Switching Characteristics for MMC0_CMD and MMC0_DATn—HSPE=0
          7. Table 5-66 Switching Characteristics for MMC1_CMD and MMC1_DATn—HSPE=0 when operating in SDR mode
          8. Table 5-67 Switching Characteristics for MMC1_CMD and MMC1_DATn—HSPE=0 when operating in DDR mode
        11. 5.9.4.11 PCIESS
        12. 5.9.4.12 PRU-ICSS
          1. 5.9.4.12.1 Programmable Real-Time Unit (PRU-ICSS PRU)
            1. 5.9.4.12.1.1 PRU-ICSS PRU Direct Input/Output Mode Electrical Data and Timing
              1. Table 5-68 PRU-ICSS PRU Timing Requirements - Direct Input Mode
              2. Table 5-69 PRU-ICSS PRU Switching Requirements – Direct Output Mode
            2. 5.9.4.12.1.2 PRU-ICSS PRU Parallel Capture Mode Electrical Data and Timing
              1. Table 5-70 PRU-ICSS PRU Timing Requirements – Parallel Capture Mode
            3. 5.9.4.12.1.3 PRU-ICSS PRU Shift Mode Electrical Data and Timing
              1. Table 5-71 PRU-ICSS PRU Timing Requirements – Shift In Mode
              2. Table 5-72 PRU-ICSS PRU Switching Requirements – Shift Out Mode
          2. 5.9.4.12.2 PRU-ICSS EtherCAT (PRU-ICSS ECAT)
            1. 5.9.4.12.2.1 PRU-ICSS ECAT Electrical Data and Timing
              1. Table 5-73 PRU-ICSS ECAT Timing Requirements – Input Validated With SYNCx
              2. Table 5-74 PRU-ICSS ECAT Timing Requirements – LATCHx_IN
              3. Table 5-75 PRU-ICSS ECAT Switching Requirements – Digital IOs
          3. 5.9.4.12.3 PRU-ICSS MII_RT and Switch
            1. 5.9.4.12.3.1 PRU-ICSS MDIO Electrical Data and Timing
              1. Table 5-76 PRU-ICSS MDIO Timing Requirements – MDIO_DATA
              2. Table 5-77 PRU-ICSS MDIO Switching Characteristics – MDIO_CLK
              3. Table 5-78 PRU-ICSS MDIO Switching Characteristics – MDIO_DATA
            2. 5.9.4.12.3.2 PRU-ICSS MII_RT Electrical Data and Timing
              1. Table 5-79 PRU-ICSS MII_RT Timing Requirements – MII_RXCLK
              2. Table 5-80 PRU-ICSS MII_RT Timing Requirements – MII_TXCLK
              3. Table 5-81 PRU-ICSS MII_RT Timing Requirements – MII_RXD[3:0], MII_RXDV, and MII_RXER
              4. Table 5-82 PRU-ICSS MII_RT Switching Characteristics – MII_TXD[3:0] and MII_TXEN
          4. 5.9.4.12.4 PRU-ICSS Universal Asynchronous Receiver Transmitter (PRU-ICSS UART)
            1. Table 5-83 PRU-ICSS UART Timing Conditions
            2. Table 5-84 Timing Requirements for PRU-ICSS UART Receive
            3. Table 5-85 Switching Characteristics Over Recommended Operating Conditions for PRU-ICSS UART Transmit
          5. 5.9.4.12.5 PRU-ICSS PRU Sigma Delta and EnDAT Modes
            1. Table 5-86 PRU-ICSS PRU Timing Requirements - Sigma Delta Mode
            2. Table 5-87 PRU-ICSS PRU Timing Requirements - EnDAT Mode
            3. Table 5-88 PRU-ICSS PRU Switching Requirements - EnDAT Mode
        13. 5.9.4.13 QSPI
        14. 5.9.4.14 SPI
          1. 5.9.4.14.1 SPI—Slave Mode
            1. Table 5-91 Timing Requirements for SPI Input Timings—Slave Mode
            2. Table 5-92 Switching Characteristics for SPI Output Timings—Slave Mode
          2. 5.9.4.14.2 SPI—Master Mode
            1. Table 5-93 SPI Timing Conditions—Master Mode
            2. Table 5-94 Timing Requirements for SPI Input Timings—Master Mode
            3. Table 5-95 Switching Characteristics for SPI Output Timings—Master Mode
        15. 5.9.4.15 Timers
        16. 5.9.4.16 UART
          1. Table 5-98 Timing Requirements for UART
          2. Table 5-99 Switching Characteristics Over Recommended Operating Conditions for UART
        17. 5.9.4.17 USB
      5. 5.9.5 Emulation and Debug Subsystem
        1. 5.9.5.1 IEEE 1149.1 Standard-Test-Access Port (JTAG)
          1. 5.9.5.1.1 JTAG Electrical Data and Timing
            1. Table 5-100 Timing Requirements for IEEE 1149.1 JTAG
            2. Table 5-101 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Arm A15
    4. 6.4  C66x DSP Subsystem
    5. 6.5  C66x Cache Subsystem
    6. 6.6  PRU-ICSS
    7. 6.7  Memory Subsystem
      1. 6.7.1 MSMC
      2. 6.7.2 DDR EMIF
      3. 6.7.3 GPMC
    8. 6.8  Interprocessor Communication
      1. 6.8.1 MSGMGR
      2. 6.8.2 SEM
    9. 6.9  EDMA
    10. 6.10 Peripherals
      1. 6.10.1  DCAN
      2. 6.10.2  DSS
      3. 6.10.3  eCAP
      4. 6.10.4  ePWM
      5. 6.10.5  eQEP
      6. 6.10.6  GPIO
      7. 6.10.7  I2C
      8. 6.10.8  ASRC
      9. 6.10.9  McASP
      10. 6.10.10 McBSP
      11. 6.10.11 MLB
      12. 6.10.12 MMC/SD
      13. 6.10.13 NSS
      14. 6.10.14 PCIESS
      15. 6.10.15 QSPI
      16. 6.10.16 SPI
      17. 6.10.17 Timers
      18. 6.10.18 UART
      19. 6.10.19 USB
  7. 7Applications, Implementation, and Layout
    1. 7.1 DDR3L Board Design and Layout Guidelines
      1. 7.1.1 DDR3L General Board Layout Guidelines
      2. 7.1.2 DDR3L Board Design and Layout Guidelines
        1. 7.1.2.1  Board Designs
        2. 7.1.2.2  DDR3L Device Combinations
        3. 7.1.2.3  DDR3L Interface Schematic
          1. 7.1.2.3.1 32-Bit DDR3L Interface
          2. 7.1.2.3.2 16-Bit DDR3L Interface
        4. 7.1.2.4  Compatible JEDEC DDR3L Devices
        5. 7.1.2.5  PCB Stackup
        6. 7.1.2.6  Placement
        7. 7.1.2.7  DDR3L Keepout Region
        8. 7.1.2.8  Bulk Bypass Capacitors
        9. 7.1.2.9  High-Speed Bypass Capacitors
          1. 7.1.2.9.1 Return Current Bypass Capacitors
        10. 7.1.2.10 Net Classes
        11. 7.1.2.11 DDR3L Signal Termination
        12. 7.1.2.12 VREF_DDR Routing
        13. 7.1.2.13 VTT
        14. 7.1.2.14 CK and ADDR_CTRL Topologies and Routing Definition
          1. 7.1.2.14.1 Four DDR3L Devices
            1. 7.1.2.14.1.1 CK and ADDR_CTRL Topologies, Four DDR3L Devices
            2. 7.1.2.14.1.2 CK and ADDR_CTRL Routing, Four DDR3L Devices
          2. 7.1.2.14.2 One DDR3L Device
            1. 7.1.2.14.2.1 CK and ADDR_CTRL Topologies, One DDR3L Device
            2. 7.1.2.14.2.2 CK and ADDR/CTRL Routing, One DDR3L Device
        15. 7.1.2.15 Data Topologies and Routing Definition
          1. 7.1.2.15.1 DQS and DQ/DM Topologies, Any Number of Allowed DDR3L Devices
          2. 7.1.2.15.2 DQS and DQ/DM Routing, Any Number of Allowed DDR3L Devices
        16. 7.1.2.16 Routing Specification
          1. 7.1.2.16.1 CK and ADDR_CTRL Routing Specification
          2. 7.1.2.16.2 DQS and DQ Routing Specification
    2. 7.2 High Speed Differential Signal Routing Guidance
    3. 7.3 Power Distribution Network (PDN) Implementation Guidance
      1. 7.3.1 Decoupling/Filtering of Analog Power Supplies and Reference Inputs
        1. 7.3.1.1 PLL Power Supplies
        2. 7.3.1.2 DDR EMIF PHY DLL Power Supplies
        3. 7.3.1.3 DDR EMIF PHY Voltage Reference Input
        4. 7.3.1.4 Internal LDO Outputs
        5. 7.3.1.5 PCIe PHY Power Supply
        6. 7.3.1.6 USB PHY Power Supplies
    4. 7.4 Single-Ended Interfaces
      1. 7.4.1 General Routing Guidelines
    5. 7.5 Clock Routing Guidelines
      1. 7.5.1 Oscillator Routing
      2. 7.5.2 Oscillator Ground Connection
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABY|625
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.10.9 McASP

The Multi-channel Audio Serial Port (McASP) module functions as a general-purpose audio serial port optimized for the needs of multichannel audio applications. The McASP supports transmission and reception of time-division multiplexed (TDM) and Inter-IC Sound (I2S) protocols. In addition, it supports intercomponent digital audio interface transmission (DIT).

The McASP consists of transmit and receive sections that may operate synchronized, or completely independently with separate master clocks, bit clocks, and frame syncs, and using different transmit modes with different bit-stream formats. The McASP module also includes up to 16 serializers that can be individually enabled to either transmit or receive.

The device integrates three McASP modules (McASP0, McASP1, and McASP2) with:

  • McASP0 supporting 16 serializers with independent TX/RX clock zones
  • McASP1 supporting 10 serializers with independent TX/RX clock zones
  • McASP2 supporting 6 serializers with independent TX/RX clock zones

Each McASP module includes the following main features:

  • Up to 16 individually assignable serializers, each with its own data pins (AXR)
  • A single 32-bit buffer per serializer for transmit and receive operations
  • 2x interconnect slave interface ports:
    • A configuration (CFG) port
    • A slave DMA data port synchronized with functional clock
  • Two independent clock generator modules for transmit and receive:
    • Clocking flexibility allows the McASP to receive and transmit at different rates. For example, the McASP can receive data at 48 kHz but output up-sampled data at 96 kHz or 192 kHz.
  • Configurable functional clocks:
    • May be generated internally (master mode)
    • May be supplied by an external device (slave mode)
    • May be divided down internally
  • Independent transmit and receive modules, each providing:
    • Programmable clock and frame sync generator
    • TDM streams from 2 to 32, and 384 time slots
    • Support for time slot sizes of 8, 12, 16, 20, 24, 28, and 32 bits
    • Data formatter for bit manipulation
  • Glueless connection to audio analog-to-digital converters (ADC), digital-to-analog converters (DAC), codec, digital audio interface receiver (DIR), and S/PDIF transmit physical layer components.
  • Support for wide variety of I2S and similar bit-stream formats
  • Integrated digital audio interface transmitter (DIT):
    • S/PDIF, IEC60958-1, AES-3 formats.
    • Enhanced channel status/user data RAM
  • 384-slot TDM with external digital audio interface receiver (DIR) device:
    • For DIR reception, an external DIR receiver integrated circuit should be used with I2S output format and connected to the McASP receive section
  • Support for 2x DMA requests (1 per direction) per each McASP module:
    • 1 level-sensitive transmit direct memory access (DMA) request common for all of the McASP serializers
    • 1 level-sensitive receive direct memory access (DMA) request common for all of the McASP serializers
  • One transmit interrupt request common for all serializers per McASP module
  • One receive interrupt request common for all serializers per McASP module
  • Extensive error checking and recovery:
    • Transmit underruns and receiver overruns due to the system not meeting real-time requirements
    • Early or late frame sync in TDM mode
    • DMA error due to incorrect programming
  • McASP Audio FIFO (AFIFO):
    • Provides additional data buffering
    • Provides added tolerance to variations in host/DMA controller response times
    • May be used as a DMA event pacer
    • Independent Read FIFO and Write FIFO
    • 256 bytes of RAM for each FIFO (read and write), where:
      • 256 bytes = four 32-bit words per serializer in the case of 16 data pins
      • 256 bytes = 64 32-bit words in the case of one data pin
    • Option to bypass Write FIFO and/or Read FIFO independently

For more information, see section Multi-channel Audio Serial Port (McASP) in chapter Peripherals of the Device TRM.