SBASAM0 March   2024 ADS127L18

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 IMD Measurement
    12. 6.12 SFDR Measurement
    13. 6.13 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs (AINP, AINN)
        1. 7.3.1.1 Input Range
      2. 7.3.2 Reference Voltage (REFP, REFN)
        1. 7.3.2.1 Reference Voltage Range
      3. 7.3.3 Clock Operation
        1. 7.3.3.1 Internal Oscillator
        2. 7.3.3.2 External Clock
      4. 7.3.4 Power Supplies
        1. 7.3.4.1 AVDD1 and AVSS
        2. 7.3.4.2 AVDD2
        3. 7.3.4.3 IOVDD
        4. 7.3.4.4 Power-On Reset (POR)
        5. 7.3.4.5 CAPA and CAPD
      5. 7.3.5 VCM Output Voltage
      6. 7.3.6 GPIO
      7. 7.3.7 Modulator
      8. 7.3.8 Digital Filter
        1. 7.3.8.1 Wideband Filter
      9. 7.3.9 Low-Latency Filter (Sinc)
        1. 7.3.9.1 Sinc4 Filter
        2. 7.3.9.2 Sinc4 + Sinc1 Cascade Filter
        3. 7.3.9.3 Sinc3 Filter
        4. 7.3.9.4 Sinc3 + Sinc1 Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1  Speed Modes
      2. 7.4.2  Synchronization
        1. 7.4.2.1 Synchronized Control Mode
        2. 7.4.2.2 Start/Stop Control Mode
      3. 7.4.3  Digital Filter Settling
      4. 7.4.4  Conversion-Start Delay Time
      5. 7.4.5  Data Averaging
      6. 7.4.6  Calibration
        1. 7.4.6.1 Offset Calibration Registers
        2. 7.4.6.2 Gain Calibration Registers
        3. 7.4.6.3 Calibration Procedure
      7. 7.4.7  Reset
        1. 7.4.7.1 RESET Pin
        2. 7.4.7.2 Reset by SPI Register
        3. 7.4.7.3 Reset by SPI Input Pattern
      8. 7.4.8  Power-Down
      9. 7.4.9  Idle and Standby Modes
      10. 7.4.10 Diagnostics
        1. 7.4.10.1 ERROR Pin and ERR_FLAG Bit
        2. 7.4.10.2 Clock Counter
        3. 7.4.10.3 SCLK Counter
        4. 7.4.10.4 Frame-Sync CRC
        5. 7.4.10.5 SPI CRC
        6. 7.4.10.6 Register Map CRC
        7. 7.4.10.7 Self Test
      11. 7.4.11 Frame-Sync Data Port
        1. 7.4.11.1 FSYNC Pin
        2. 7.4.11.2 DCLK Pin
        3. 7.4.11.3 DOUTn Pins
        4. 7.4.11.4 DINn Pins
        5. 7.4.11.5 Time Division Multiplexing (TDM)
        6. 7.4.11.6 Data Size
        7. 7.4.11.7 STATUS_DP Header
        8. 7.4.11.8 Daisy Chain
        9. 7.4.11.9 Data Port Offset Timing
    5. 7.5 Programming
      1. 7.5.1 Hardware Programming
      2. 7.5.2 SPI Programming
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output (SDO)
      3. 7.5.3 SPI Frame
      4. 7.5.4 SPI Commands
        1. 7.5.4.1 Read Register Command
        2. 7.5.4.2 Write Register Command
      5. 7.5.5 SPI Daisy-Chain
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Driver
      2. 9.1.2 Antialias Filter
      3. 9.1.3 Reference Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.10.6 Register Map CRC

An optional CRC detects unintended changes to the register settings. The CRC value is two bytes located in registers 05h (high byte) and 06h (low byte). Calculate the CRC value over the register space and write the value to the CRC registers. The ADC checks the CRC register value against an internal calculation. The REG_ERR flag of the STATUS byte is set if the CRC register value is incorrect. Correct the CRC value, then write 1 to the REG_ERR bit to clear the error. The REG_CRC_EN bit of the GEN_CFG3 register enables the CRC.

The register map used for the CRC calculation varies between the ADS127L14 and the ADS127L18. For the ADS127L14, the CRC value is calculated over register addresses 08h to 30h. For the ADS127L18, the CRC value is calculated over register addresses 08h to 50h. Use a 16-bit polynomial for the register map CRC based on the CRC-16-IBM polynomial: X16 + X15 + X2 + 1. The 17 coefficients are 1 10000000 00000101.