SBASAM0 March   2024 ADS127L18

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
  7. Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 IMD Measurement
    12. 6.12 SFDR Measurement
    13. 6.13 Noise Performance
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs (AINP, AINN)
        1. 7.3.1.1 Input Range
      2. 7.3.2 Reference Voltage (REFP, REFN)
        1. 7.3.2.1 Reference Voltage Range
      3. 7.3.3 Clock Operation
        1. 7.3.3.1 Internal Oscillator
        2. 7.3.3.2 External Clock
      4. 7.3.4 Power Supplies
        1. 7.3.4.1 AVDD1 and AVSS
        2. 7.3.4.2 AVDD2
        3. 7.3.4.3 IOVDD
        4. 7.3.4.4 Power-On Reset (POR)
        5. 7.3.4.5 CAPA and CAPD
      5. 7.3.5 VCM Output Voltage
      6. 7.3.6 GPIO
      7. 7.3.7 Modulator
      8. 7.3.8 Digital Filter
        1. 7.3.8.1 Wideband Filter
      9. 7.3.9 Low-Latency Filter (Sinc)
        1. 7.3.9.1 Sinc4 Filter
        2. 7.3.9.2 Sinc4 + Sinc1 Cascade Filter
        3. 7.3.9.3 Sinc3 Filter
        4. 7.3.9.4 Sinc3 + Sinc1 Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1  Speed Modes
      2. 7.4.2  Synchronization
        1. 7.4.2.1 Synchronized Control Mode
        2. 7.4.2.2 Start/Stop Control Mode
      3. 7.4.3  Digital Filter Settling
      4. 7.4.4  Conversion-Start Delay Time
      5. 7.4.5  Data Averaging
      6. 7.4.6  Calibration
        1. 7.4.6.1 Offset Calibration Registers
        2. 7.4.6.2 Gain Calibration Registers
        3. 7.4.6.3 Calibration Procedure
      7. 7.4.7  Reset
        1. 7.4.7.1 RESET Pin
        2. 7.4.7.2 Reset by SPI Register
        3. 7.4.7.3 Reset by SPI Input Pattern
      8. 7.4.8  Power-Down
      9. 7.4.9  Idle and Standby Modes
      10. 7.4.10 Diagnostics
        1. 7.4.10.1 ERROR Pin and ERR_FLAG Bit
        2. 7.4.10.2 Clock Counter
        3. 7.4.10.3 SCLK Counter
        4. 7.4.10.4 Frame-Sync CRC
        5. 7.4.10.5 SPI CRC
        6. 7.4.10.6 Register Map CRC
        7. 7.4.10.7 Self Test
      11. 7.4.11 Frame-Sync Data Port
        1. 7.4.11.1 FSYNC Pin
        2. 7.4.11.2 DCLK Pin
        3. 7.4.11.3 DOUTn Pins
        4. 7.4.11.4 DINn Pins
        5. 7.4.11.5 Time Division Multiplexing (TDM)
        6. 7.4.11.6 Data Size
        7. 7.4.11.7 STATUS_DP Header
        8. 7.4.11.8 Daisy Chain
        9. 7.4.11.9 Data Port Offset Timing
    5. 7.5 Programming
      1. 7.5.1 Hardware Programming
      2. 7.5.2 SPI Programming
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output (SDO)
      3. 7.5.3 SPI Frame
      4. 7.5.4 SPI Commands
        1. 7.5.4.1 Read Register Command
        2. 7.5.4.2 Write Register Command
      5. 7.5.5 SPI Daisy-Chain
  9. Register Map
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Driver
      2. 9.1.2 Antialias Filter
      3. 9.1.3 Reference Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Read Register Command

The read register command reads register data. The command follows an off-frame protocol where the read command is sent in one frame and the ADC responds with register data in the next frame. The first byte of the read command is 00h plus a 7-bit register address. The second byte is an arbitrary value. The response to a register address outside the valid range is 00h. When the SPI out-of-range address feature is enabled, the ADDR_ERR flag is set in the STATUS byte. The register data format is most-significant-bit first. Full duplex operation is supported by shifting in the next command during the data output frame.

Figure 7-43 shows an example of reading register data with the STATUS and CRC bytes disabled. Frame 1 is the command frame and frame 2 is the register data response frame. The frames are delimited by taking CS high. In this example, the length of the response frame is two bytes long because the STATUS and CRC bytes are disabled. Terminate the response frame after reading the register data by taking CS high.

GUID-20230208-SS0I-HBKQ-STZ3-JNJW8M2X6LPT-low.svg Figure 7-43 Read Register Data (STATUS and CRC Disabled)

Figure 7-44 shows an example of reading register data with the SPI STATUS and CRC bytes enabled. In this example, the length of the frames are three bytes long because the STATUS and CRC bytes are enabled. The value of the second command byte is arbitrary, but is used with the first byte for the CRC In byte calculation. The register data and the STATUS bytes are used for the CRC Out calculation.

GUID-20230208-SS0I-G941-M8LF-T9XCS4QVJ6H5-low.svg Figure 7-44 Read Register Data (STATUS and CRC Enabled)