SBASAM0 March   2024 ADS127L18

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
  7. 6 Parameter Measurement Information
    1. 6.1  Offset Error Measurement
    2. 6.2  Offset Drift Measurement
    3. 6.3  Gain Error Measurement
    4. 6.4  Gain Drift Measurement
    5. 6.5  NMRR Measurement
    6. 6.6  CMRR Measurement
    7. 6.7  PSRR Measurement
    8. 6.8  SNR Measurement
    9. 6.9  INL Error Measurement
    10. 6.10 THD Measurement
    11. 6.11 IMD Measurement
    12. 6.12 SFDR Measurement
    13. 6.13 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs (AINP, AINN)
        1. 7.3.1.1 Input Range
      2. 7.3.2 Reference Voltage (REFP, REFN)
        1. 7.3.2.1 Reference Voltage Range
      3. 7.3.3 Clock Operation
        1. 7.3.3.1 Internal Oscillator
        2. 7.3.3.2 External Clock
      4. 7.3.4 Power Supplies
        1. 7.3.4.1 AVDD1 and AVSS
        2. 7.3.4.2 AVDD2
        3. 7.3.4.3 IOVDD
        4. 7.3.4.4 Power-On Reset (POR)
        5. 7.3.4.5 CAPA and CAPD
      5. 7.3.5 VCM Output Voltage
      6. 7.3.6 GPIO
      7. 7.3.7 Modulator
      8. 7.3.8 Digital Filter
        1. 7.3.8.1 Wideband Filter
      9. 7.3.9 Low-Latency Filter (Sinc)
        1. 7.3.9.1 Sinc4 Filter
        2. 7.3.9.2 Sinc4 + Sinc1 Cascade Filter
        3. 7.3.9.3 Sinc3 Filter
        4. 7.3.9.4 Sinc3 + Sinc1 Filter
    4. 7.4 Device Functional Modes
      1. 7.4.1  Speed Modes
      2. 7.4.2  Synchronization
        1. 7.4.2.1 Synchronized Control Mode
        2. 7.4.2.2 Start/Stop Control Mode
      3. 7.4.3  Digital Filter Settling
      4. 7.4.4  Conversion-Start Delay Time
      5. 7.4.5  Data Averaging
      6. 7.4.6  Calibration
        1. 7.4.6.1 Offset Calibration Registers
        2. 7.4.6.2 Gain Calibration Registers
        3. 7.4.6.3 Calibration Procedure
      7. 7.4.7  Reset
        1. 7.4.7.1 RESET Pin
        2. 7.4.7.2 Reset by SPI Register
        3. 7.4.7.3 Reset by SPI Input Pattern
      8. 7.4.8  Power-Down
      9. 7.4.9  Idle and Standby Modes
      10. 7.4.10 Diagnostics
        1. 7.4.10.1 ERROR Pin and ERR_FLAG Bit
        2. 7.4.10.2 Clock Counter
        3. 7.4.10.3 SCLK Counter
        4. 7.4.10.4 Frame-Sync CRC
        5. 7.4.10.5 SPI CRC
        6. 7.4.10.6 Register Map CRC
        7. 7.4.10.7 Self Test
      11. 7.4.11 Frame-Sync Data Port
        1. 7.4.11.1 FSYNC Pin
        2. 7.4.11.2 DCLK Pin
        3. 7.4.11.3 DOUTn Pins
        4. 7.4.11.4 DINn Pins
        5. 7.4.11.5 Time Division Multiplexing (TDM)
        6. 7.4.11.6 Data Size
        7. 7.4.11.7 STATUS_DP Header
        8. 7.4.11.8 Daisy Chain
        9. 7.4.11.9 Data Port Offset Timing
    5. 7.5 Programming
      1. 7.5.1 Hardware Programming
      2. 7.5.2 SPI Programming
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output (SDO)
      3. 7.5.3 SPI Frame
      4. 7.5.4 SPI Commands
        1. 7.5.4.1 Read Register Command
        2. 7.5.4.2 Write Register Command
      5. 7.5.5 SPI Daisy-Chain
  9. 8 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Driver
      2. 9.1.2 Antialias Filter
      3. 9.1.3 Reference Voltage
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Timing Requirements

1.65V ≤ IOVDD ≤ 1.95V, over operating ambient temperature range, unless otherwise noted
MIN MAX UNIT
CLOCK
tc(CLKIN) CLKIN period 9.7 2000 ns
tw(CLKINL) Pulse duration, CLKIN low 4.5 ns
tw(CLKINH) Pulse duration, CLKIN high 4.5 ns
tc(CLK) (2) ADC clock period, max-speed mode 29.8 2000 ns
ADC clock period, high-speed mode 38.2 2000
ADC clock period, mid-speed mode 76.4 2000
ADC clock period, low-speed mode 305 2000
tw(CLKL) Pulse duration, CLK low, max-speed mode 13.4 ns
Pulse duration, CLK low, high-speed mode 17
Pulse duration, CLK low, mid-speed mode 34
Pulse duration, CLK low, low-speed mode 128
tw(CLKH) Pulse duration, CLK high, max-speed mode 13.4 ns
Pulse duration, CLK high, high-speed mode 17
Pulse duration, CLK high, mid-speed mode 34
Pulse duration, CLK high, low-speed mode 128
FRAME-SYNC DATA PORT
tc(DCLK) DCLK period, stand-alone operation 9.7 ns
DCLK period, DOUT to DIN daisy chain connection 29.8 ns
SPI CONFIGURATION PORT
tc(SCLK) SCLK period 25 ns
tw(SCL) Pulse duration, SCLK low 10 ns
tw(SCH) Pulse duration, SCLK high 10 ns
td(CSSC) Delay time, first SCLK rising edge after CS falling edge 10 ns
tsu(DI) Setup time, SDI valid before SCLK falling edge 4 ns
th(DI) Hold time, SDI valid after SCLK falling edge 6 ns
td(SCCS) Delay time, CS rising edge after final SCLK falling edge 10 ns
tw(CSH) Pulse duration, CS high 20 ns
START PIN
tw(STL) Pulse duration, START low 4 tCLK
tw(STH) Pulse duration, START high 4 tCLK
tsu(STCL) Setup time, START transition before CLKIN rising edge (1) 9 ns
th(STCL) Hold time, START transition after CLKIN rising edge (1) 9 ns
tsu(STFS) Setup time, START falling edge or STOP bit before FSYNC rising edge to stop next conversion (start/stop conversion mode) 24 tCLK
RESET PIN
tw(RSL) Pulse duration, RESET low 4 tCLK
(1) START rising edge should not be applied between the setup and hold time period at the rising edge of CLKIN.
(2) MCLK is the main ADC clock.