SLUSBV4C June   2018  – June 2025 BQ40Z80

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Primary (1st Level) Safety Features
      2. 6.3.2  Secondary (2nd Level) Safety Features
      3. 6.3.3  Charge Control Features
      4. 6.3.4  Gas Gauging
      5. 6.3.5  Multifunction Pins
      6. 6.3.6  Configuration
        1. 6.3.6.1 Oscillator Function
        2. 6.3.6.2 System Present Operation
        3. 6.3.6.3 Emergency Shutdown
        4. 6.3.6.4 2-Series, 3-Series, 4-Series, 5-Series, or 6-Series Cell Configuration
        5. 6.3.6.5 Cell Balancing
      7. 6.3.7  Battery Parameter Measurements
        1. 6.3.7.1 Charge and Discharge Counting
      8. 6.3.8  Lifetime Data Logging Features
      9. 6.3.9  Authentication
      10. 6.3.10 Tamper Protection
      11. 6.3.11 LED Display
      12. 6.3.12 IATA Support
      13. 6.3.13 Voltage
      14. 6.3.14 Current
      15. 6.3.15 Temperature
      16. 6.3.16 Communications
        1. 6.3.16.1 SMBus On and Off State
        2. 6.3.16.2 SBS Commands
    4. 6.4 Device Functional Modes
  8. 7 Applications and Implementation
    1. 7.1 Application Information Disclaimer
    2. 7.2 Application Information
    3. 7.3 Typical Applications
      1. 7.3.1 Design Requirements
      2. 7.3.2 Detailed Design Procedure
        1. 7.3.2.1 Using the BQ40Z80EVM with BQSTUDIO
        2. 7.3.2.2 High-Current Path
          1. 7.3.2.2.1 Protection FETs
          2. 7.3.2.2.2 Chemical Fuse
          3. 7.3.2.2.3 Lithium-Ion Cell Connections
          4. 7.3.2.2.4 Sense Resistor
          5. 7.3.2.2.5 ESD Mitigation
        3. 7.3.2.3 Gas Gauge Circuit
          1. 7.3.2.3.1 Coulomb-Counting Interface
          2. 7.3.2.3.2 Power Supply Decoupling and PBI
          3. 7.3.2.3.3 System Present
          4. 7.3.2.3.4 SMBus Communication
          5. 7.3.2.3.5 FUSE Circuitry
        4. 7.3.2.4 Secondary-Current Protection
          1. 7.3.2.4.1 Cell and Battery Inputs
          2. 7.3.2.4.2 External Cell Balancing
          3. 7.3.2.4.3 PACK and FET Control
          4. 7.3.2.4.4 Pre-Discharge Control
          5. 7.3.2.4.5 Temperature Output
          6. 7.3.2.4.6 LEDs
      3. 7.3.3 Application Curve
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Protector FET Bypass and Pack Terminal Bypass Capacitors
        2. 7.5.1.2 ESD Spark Gap
      2. 7.5.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
7.3.2.3.3 System Present

The System Present signal is used to inform the gas gauge whether the pack is installed into or removed from the system. In the host system, this pin is grounded. The PRES pin of the BQ40Z80 is used if J5[1, 2] jumper is installed, and is occasionally sampled to test for system present. To save power, an internal pullup is provided by the gas gauge during a 4μs sampling pulse once per second. Use a resistor to pull the signal low; the resistance must be 20kΩ or lower to verify that the test pulse is lower than the VIL limit. The pullup current source is typically 10µA to 20µA.

Because the System Present signal is part of the pack connector interface to the outside world, it must be protected from external electrostatic discharge events. An integrated ESD protection on the PRES device pin reduces the external protection requirement to R12 for an 8kV ESD contact rating. If it is possible that the System Present signal shorts to PACK+, include an E2 spark gap for high-voltage protection.