SLOS879B April 2014 – September 2016 DRV2625
The decoupling capacitor for the power supply (VDD should be placed close to the device pin. The filtering capacitor for the regulator (REG) should be placed close to the device REG pin. When creating the pad size for the WCSP pins, TI recommends that the PCB layout use nonsolder mask-defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area and the opening size is defined by the copper pad width.