Since the DRV8411A device has
integrated power MOSFETs capable of driving high current, careful attention should
be paid to the layout design and external component placement. Some design and
layout guidelines are provided below. For more information on layout
recommendations, please see the application note Best Practices for Board Layout of Motor Drivers.
- Low ESR ceramic capacitors should
be utilized for the VM-to-GND. X5R and X7R types are recommended.
- The VM power supply capacitor
should be placed as close to the device as possible to minimize the loop
inductance.
- The VM power supply bulk
capacitor can be of ceramic or electrolytic type, but should also be placed as
close as possible to the device to minimize the loop inductance.
- VM, xOUTx, and GND pins carry the
high current from the power supply to the outputs and back to ground. Thick
metal routing should be utilized for these traces as is feasible.
- GND should connect directly on
the PCB ground plane.
- The device thermal pad should be
attached to the PCB top layer ground plane and internal ground plane (when
available) through thermal vias to maximize the PCB heat sinking.
- The copper plane area attached to
the thermal pad should be maximized to ensure optimal heat sinking.