SLVSI22 August   2025 DRV8844A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Stage
      2. 6.3.2 Logic Inputs
      3. 6.3.3 Bridge Control
      4. 6.3.4 Charge Pump
      5. 6.3.5 Protection Circuits
        1. 6.3.5.1 Overcurrent Protection (OCP)
        2. 6.3.5.2 Thermal Shutdown (TSD)
        3. 6.3.5.3 Undervoltage Lockout (UVLO)
      6. 6.3.6 CLR_FAULT and nSLEEP Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Application Information
      1. 7.2.1 Driving Solenoid Loads
      2. 7.2.2 Driving Stepper Motor
      3. 7.2.3 Driving Brushed DC motor
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
        1. 7.4.3.1 Heatsinking
      4. 7.4.4 Power Dissipation
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Community Resources
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)DRV8844AUNIT

DGQ

(HVSSOP)
28 PINS
RθJAJunction-to-ambient thermal resistance

31.9

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

32.1

°C/W
RθJBJunction-to-board thermal resistance

9.7

°C/W
ψJTJunction-to-top characterization parameter

1.0

°C/W
ψJBJunction-to-board characterization parameter

9.7

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

1.7

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.