SNVSCT1 October   2025 LM5066H

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Current Limit
      2. 7.3.2  Foldback Current Limit
      3. 7.3.3  Soft Start Disconnect (SFT_STRT)
      4. 7.3.4  Circuit Breaker
      5. 7.3.5  Power Limit
      6. 7.3.6  UVLO
      7. 7.3.7  OVLO
      8. 7.3.8  Power Good
      9. 7.3.9  VDD Sub-Regulator
      10. 7.3.10 Remote Temperature Sensing
      11. 7.3.11 Damaged MOSFET Detection
      12. 7.3.12 Analog Current Monitor (IMON)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Up Sequence
      2. 7.4.2 Gate Control
      3. 7.4.3 Fault Timer and Restart
      4. 7.4.4 Shutdown Control
      5. 7.4.5 Enabling/Disabling and Resetting
    5. 7.5 Programming
      1. 7.5.1 PMBus Command Support
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 54V, 100A PMBus Hot Swap Design
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design-In Procedure
          1. 8.2.1.2.1 Selecting the Hotswap FETs
          2. 8.2.1.2.2 dv/dt-Based Start-Up
            1. 8.2.1.2.2.1 Choosing the VOUT Slew Rate
          3. 8.2.1.2.3 Select RSNS and CL Setting
          4. 8.2.1.2.4 Select Power Limit
          5. 8.2.1.2.5 Set Fault Timer
          6. 8.2.1.2.6 Check MOSFET SOA
          7. 8.2.1.2.7 Set UVLO and OVLO Thresholds
            1. 8.2.1.2.7.1 Option A
            2. 8.2.1.2.7.2 Option B
            3. 8.2.1.2.7.3 Option C
            4. 8.2.1.2.7.4 Option D
          8. 8.2.1.2.8 Power Good Pin
          9. 8.2.1.2.9 Input and Output Protection
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PWP|28
Thermal pad, mechanical data (Package|Pins)

11.1 Package Option Addendum

Packaging Information

Orderable part numberStatus
(1)		Material
type
(2)		Package | PinsPackage qty | CarrierRoHS
(3)		Lead finish/Ball material
(4)		MSL rating/Peak reflow
(5)		Op temp (°C)Part marking
(6)
 PLM5066H1PWPRPreviewPreproductionTSSOP (PWP) | 283000 | LARGE T&R

Yes

NIPDAULevel-3-260C-168 HR–40 to 125

P5066H1

 PLM5066H2NLPRPreviewPreproductionQFN (NLP) | 353000 | LARGE T&R

Yes

NIPDAULevel-3-260C-168 HR–40 to 125

PL5066H2

(1) Status: For more details on status, see our product life cycle.
(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.
(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.
(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.
(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.
(6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.
Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device.
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