SNIS133E September   2003  – February 2024 LM95010

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Operating Ratings
    3. 5.3 DC Electrical Characteristics
    4. 5.4 AC Electrical Characteristics
    5. 5.5 Typical Performance Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  SensorPath BUS SWD
      2. 6.3.2  SensorPath BIT SIGNALING
      3. 6.3.3  Bus Inactive
      4. 6.3.4  Data Bit 0 and 1
      5. 6.3.5  Start Bit
      6. 6.3.6  Attention Request
      7. 6.3.7  Bus Reset
      8. 6.3.8  SensorPath BUS TRANSACTIONS
      9. 6.3.9  Bus Reset Operation
      10. 6.3.10 Read Transaction
      11. 6.3.11 Write Transaction
      12. 6.3.12 Read and Write Transaction Exceptions
      13. 6.3.13 Attention Request Transaction
  8. 7 Register Set
    1. 7.1  Fixed Number Setting
    2. 7.2  Register Set Summary
    3. 7.3  Device Reset Operation
    4. 7.4  Device Number (Addr 00o)
    5. 7.5  Manufacturer ID (Addr 01o)
    6. 7.6  Device ID (Addr 02o)
    7. 7.7  Capabilities Fixed (Addr 03o)
    8. 7.8  Device Status (Addr 04o)
    9. 7.9  Device Control (Addr 05o)
    10. 7.10 Temperature Measurement Function (TYPE - 0001)
    11. 7.11 Operation
    12. 7.12 Temperature Capabilities (Addr 10o)
    13. 7.13 Temperature Data Readout (Addr 11o)
    14. 7.14 Temperature Control (Addr 12o)
    15. 7.15 Conversion Rate (Addr 40o)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Mounting Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

See (1)(2)
Supply Voltage (V+)−0.5 V to 6.0 V
Voltage on Pin 2−0.3 V to (V+ + 0.3 V)
Voltage on all other Pins−0.5 V to 6.0 V
Input Current per Pin(3)5 mA
Package Input Current (3)30 mA
Package Power Dissipation (4)
Output Sink Current10 mA
Storage Temperature−65 °C to +150 °C
ESD Susceptibility (5)Human Body Model2000 V
Machine Model200 V
Soldering Information, Lead Temperature
VSSOP Package (6)Vapor Phase (60 seconds)215 °C
Infrared (15 seconds)220 °C
(1) All voltages are measured with respect to GND, unless otherwise noted.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
(3) When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > V+), the current at that pin should be limited to 5 mA. Parasitic components and/or ESD protection circuitry are shown below for the LM95010's pins. The nominal breakdown voltage of D3 is 6.5 V. SNP stands for snap-back device. Devices that are connected to a particular pin are marked with a "✓" in Table 5-1.
(4) Thermal resistance junction-to-ambient when attached to a printed circuit board with 2 oz. foil is 210 °C/W.
(5) Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. See Figure 5-1 for the ESD Protection Input Structure.
(6) See the URL “http://www.ti.com/packaging/” for other recommendations and methods of soldering surface mount devices.