SNAS635F December   2013  – August 2025 LMK00334

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements, Propagation Delay, and Output Skew
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Differential Voltage Measurement Terminology
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Crystal Power Dissipation vs RLIM
      2. 7.3.2 Clock Inputs
      3. 7.3.3 Clock Outputs
        1. 7.3.3.1 Reference Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 VCC and VCCO Power Supplies
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Driving the Clock Inputs
        2. 8.2.1.2 Crystal Interface
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Termination and Use of Clock Drivers
        2. 8.2.2.2 Termination for DC-Coupled Differential Operation
        3. 8.2.2.3 Termination for AC-Coupled Differential Operation
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Current Consumption and Power Dissipation Calculations
        1. 8.3.1.1 Power Dissipation Example: Worst-Case Dissipation
      2. 8.3.2 Power Supply Bypassing
        1. 8.3.2.1 Power Supply Ripple Rejection
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Thermal Management
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.