SLASEU5A October   2019  – February 2021 MSP430F5438A-ET

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Functional Block Diagram
  5. 5Revision History
  6. 6Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Signal Descriptions
  7. 7Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Recommended Operating Conditions
    3. 7.3  Active Mode Supply Current Into VCC Excluding External Current
    4. 7.4  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    5. 7.5  Thermal Resistance Characteristics
    6. 7.6  Schmitt-Trigger Inputs – General Purpose I/O
    7. 7.7  Inputs – Ports P1 and P2
    8. 7.8  Leakage Current – General Purpose I/O
    9. 7.9  Outputs – General Purpose I/O (Full Drive Strength)
    10. 7.10 Outputs – General Purpose I/O (Reduced Drive Strength)
    11. 7.11 Output Frequency – General Purpose I/O
    12. 7.12 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    13. 7.13 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
    14. 7.14 Crystal Oscillator, XT1, Low-Frequency Mode
    15. 7.15 Crystal Oscillator, XT1, High-Frequency Mode
    16. 7.16 Crystal Oscillator, XT2
    17. 7.17 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    18. 7.18 Internal Reference, Low-Frequency Oscillator (REFO)
    19. 7.19 DCO Frequency
    20. 7.20 PMM, Brownout Reset (BOR)
    21. 7.21 PMM, Core Voltage
    22. 7.22 PMM, SVS High Side
    23. 7.23 PMM, SVM High Side
    24. 7.24 PMM, SVS Low Side
    25. 7.25 PMM, SVM Low Side
    26. 7.26 Wakeup From Low-Power Modes and Reset
    27. 7.27 Timer_A
    28. 7.28 Timer_B
    29. 7.29 USCI (UART Mode) Recommended Operating Conditions
    30. 7.30 USCI (UART Mode)
    31. 7.31 USCI (SPI Master Mode) Recommended Operating Conditions
    32. 7.32 USCI (SPI Master Mode)
    33. 7.33 USCI (SPI Slave Mode)
    34. 7.34 USCI (I2C Mode)
    35. 7.35 12-Bit ADC, Power Supply and Input Range Conditions
    36. 7.36 12-Bit ADC, Timing Parameters
    37. 7.37 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage
    38. 7.38 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage
    39. 7.39 12-Bit ADC, Temperature Sensor and Built-In VMID
    40. 7.40 REF, External Reference
    41. 7.41 REF, Built-In Reference
    42. 7.42 Flash Memory
    43. 7.43 JTAG and Spy-Bi-Wire Interface
  8. 8Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
    3. 8.3  Interrupt Vector Addresses
    4. 8.4  Memory Organization
    5. 8.5  Bootloader (BSL)
    6. 8.6  JTAG Operation
      1. 8.6.1 JTAG Standard Interface
      2. 8.6.2 Spy-Bi-Wire Interface
    7. 8.7  Flash Memory
    8. 8.8  RAM Memory
    9. 8.9  Peripherals
      1. 8.9.1  Digital I/O
      2. 8.9.2  Oscillator and System Clock
      3. 8.9.3  Power Management Module (PMM)
      4. 8.9.4  Hardware Multiplier (MPY)
      5. 8.9.5  Real-Time Clock (RTC_A)
      6. 8.9.6  Watchdog Timer (WDT_A)
      7. 8.9.7  System Module (SYS)
      8. 8.9.8  DMA Controller
      9. 8.9.9  Universal Serial Communication Interface (USCI)
      10. 8.9.10 TA0
      11. 8.9.11 TA1
      12. 8.9.12 TB0
      13. 8.9.13 ADC12_A
      14. 8.9.14 CRC16
      15. 8.9.15 REF Voltage Reference
      16. 8.9.16 Embedded Emulation Module (EEM) (L Version)
      17. 8.9.17 Peripheral File Map
      18. 8.9.18 Input/Output Diagrams
        1. 8.9.18.1  Port P1, P1.0 to P1.7, Input/Output With Schmitt Trigger
        2. 8.9.18.2  Port P2, P2.0 to P2.7, Input/Output With Schmitt Trigger
        3. 8.9.18.3  Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
        4. 8.9.18.4  Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger
        5. 8.9.18.5  Port P5, P5.0 and P5.1, Input/Output With Schmitt Trigger
        6. 8.9.18.6  Port P5, P5.2, Input/Output With Schmitt Trigger
        7. 8.9.18.7  Port P5, P5.3, Input/Output With Schmitt Trigger
        8. 8.9.18.8  Port P5, P5.4 to P5.7, Input/Output With Schmitt Trigger
        9. 8.9.18.9  Port P6, P6.0 to P6.7, Input/Output With Schmitt Trigger
        10. 8.9.18.10 Port P7, P7.0, Input/Output With Schmitt Trigger
        11. 8.9.18.11 Port P7, P7.1, Input/Output With Schmitt Trigger
        12. 8.9.18.12 Port P7, P7.2 and P7.3, Input/Output With Schmitt Trigger
        13. 8.9.18.13 Port P7, P7.4 to P7.7, Input/Output With Schmitt Trigger
        14. 8.9.18.14 Port P8, P8.0 to P8.7, Input/Output With Schmitt Trigger
        15. 8.9.18.15 Port P9, P9.0 to P9.7, Input/Output With Schmitt Trigger
        16. 8.9.18.16 Port P10, P10.0 to P10.7, Input/Output With Schmitt Trigger
        17. 8.9.18.17 Port P11, P11.0 to P11.2, Input/Output With Schmitt Trigger
        18. 8.9.18.18 Port J, J.0 JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
        19. 8.9.18.19 Port J, J.1 to J.3 JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    10. 8.10 Device Descriptors (TLV)
  9. 9Device and Documentation Support
    1. 9.1 Trademarks
    2. 9.2 Electrostatic Discharge Caution
    3. 9.3 Support Resources
    4. 9.4 Glossary
      1.      Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.14 Crystal Oscillator, XT1, Low-Frequency Mode

over recommended ranges of supply voltage and TJ = –40°C to 85°C (unless otherwise noted)(1) (2)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
ΔIDVCC.LF Differential XT1 oscillator crystal current consumption from lowest drive setting, LF mode fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
TA = 25°C		 3.0 V 0.075 µA
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 2,
TA = 25°C		 0.170
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C		 0.290
fXT1,LF0 XT1 oscillator crystal frequency, LF mode XTS = 0, XT1BYPASS = 0 32768 Hz
fXT1,LF,SW XT1 oscillator logic-level square-wave input frequency, LF mode XTS = 0, XT1BYPASS = 1 (3) (4) 10 32.768 50 kHz
OALF Oscillation allowance for LF crystals (5) XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF		 210 kΩ
XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF		 300
CL,eff Integrated effective load capacitance, LF mode (6) XTS = 0, XCAPx = 0 (7) 2 pF
XTS = 0, XCAPx = 1 5.5
XTS = 0, XCAPx = 2 8.5
XTS = 0, XCAPx = 3 12.0
Duty cycle, LF mode XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz		 30 70 %
fFault,LF Oscillator fault frequency, LF mode (8) XTS = 0 (9) 10 10000 Hz
tSTART,LF Startup time, LF mode fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C, CL,eff = 6 pF		 3.0 V 1000 ms
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C, CL,eff = 12 pF		 500
(1) To improve EMI on the XT1 oscillator, the following guidelines should be observed.
  • Keep the trace between the device and the crystal as short as possible.
  • Design a good ground plane around the oscillator pins.
  • Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
  • Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
  • Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
  • If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.
(2) Use of crystal oscillator is not ensured above 85°C. It is recommended that an external digital clock source or other internally generated clock source.
(3) When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this data sheet.
(4) Maximum frequency of operation of the entire device cannot be exceeded.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following guidelines, but should be evaluated based on the actual crystal selected for the application:
  • For XT1DRIVEx = 0, CL,eff ≤ 6 pF.
  • For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF.
  • For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF.
  • For XT1DRIVEx = 3, CL,eff ≥ 6 pF.
(6) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal.
(7) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(8) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag.
(9) Measured with logic-level input frequency but also applies to operation with crystals.