SLOS080W September   1978  – July 2025 TL071 , TL071A , TL071B , TL071H , TL072 , TL072A , TL072B , TL072H , TL072M , TL074 , TL074A , TL074B , TL074H , TL074M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics for TL07xH
    8. 5.8  Electrical Characteristics (DC) for TL07xC, TL07xAC, TL07xBC, TL07xI, TL07xM
    9. 5.9  Electrical Characteristics (AC) for TL07xC, TL07xAC, TL07xBC, TL07xI, TL07xM
    10. 5.10 Typical Characteristics: TL07xH
    11. 5.11 Typical Characteristics: All Devices Except TL07xH
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.1 Device Nomenclature

Table 9-1 Device Nomenclature
PART NUMBER DEFINITION
TL07xyzzzzzz x is the channel count
If y = H, the die is manufactured on the latest flow (CSO: RFB).

Section 5.7 and Section 5.10 describe the performance of the new die.
If y ≠ H and y ≠ M, the die is manufactured on the legacy flow (CSO: SFAB) or the latest flow (CSO: RFB).

Section 5.8, Section 5.9, and Section 5.11 describe the performance of the original die.

Section 5.7 and Section 5.10 describe the performance of the new die.
If y = M, the device is specified for the extended temperature range of –55°C to +125°C. The die is manufactured on the legacy flow (CSO:SFAB).

The letters and numbers represented by z are grade-out and package options described in Section 5.8 and the Package Option Addendum at the end of this data sheet.