SLOS080W September   1978  – July 2025 TL071 , TL071A , TL071B , TL071H , TL072 , TL072A , TL072B , TL072H , TL072M , TL074 , TL074A , TL074B , TL074H , TL074M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics for TL07xH
    8. 5.8  Electrical Characteristics (DC) for TL07xC, TL07xAC, TL07xBC, TL07xI, TL07xM
    9. 5.9  Electrical Characteristics (AC) for TL07xC, TL07xAC, TL07xBC, TL07xI, TL07xM
    10. 5.10 Typical Characteristics: TL07xH
    11. 5.11 Typical Characteristics: All Devices Except TL07xH
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Thermal Information for Quad Channel

THERMAL METRIC(1) TL074xx UNIT
D
(SOIC)		 DYY
(SOT-23)		 FK
(TSSOP)		 J
(TSSOP)		 N
(TSSOP)		 NS
(TSSOP)		 PW
(TSSOP)		 W
(TSSOP)
14 PINS 14 PINS 20 PINS 14 PINS 14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 114.2 153.2 – – 80 76 – 128.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.3 88.7 5.61 14.5 – – 14.5 56.1 °C/W
RθJB Junction-to-board thermal resistance 70.2 65.4 – – – – – 127.6 °C/W
ψJT Junction-to-top characterization parameter 28.8 9.5 – – – – – 29 °C/W
ψJB Junction-to-board characterization parameter 69.8 65.0 – – – – – 106.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A – – – – – 0.5 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.