SLOS080W September   1978  – July 2025 TL071 , TL071A , TL071B , TL071H , TL072 , TL072A , TL072B , TL072H , TL072M , TL074 , TL074A , TL074B , TL074H , TL074M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for Single Channel
    5. 5.5  Thermal Information for Dual Channel
    6. 5.6  Thermal Information for Quad Channel
    7. 5.7  Electrical Characteristics for TL07xH
    8. 5.8  Electrical Characteristics (DC) for TL07xC, TL07xAC, TL07xBC, TL07xI, TL07xM
    9. 5.9  Electrical Characteristics (AC) for TL07xC, TL07xAC, TL07xBC, TL07xI, TL07xM
    10. 5.10 Typical Characteristics: TL07xH
    11. 5.11 Typical Characteristics: All Devices Except TL07xH
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Total Harmonic Distortion
      2. 7.3.2 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Inverting Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision V (April 2023) to Revision W (July 2025)

  • Deleted references to trim function from all packages except PS (SO, 8) packageGo
  • Changed Vn from 18nV/√Hz to 37nV/√Hz in Features Go
  • Updated Device Information table to match Package Option Addendum Go
  • Updated front page image to show which device uses the PS package onlyGo
  • Updated Pin Configuration and Functions to show that only PS package (PDIP, 8) has trim functionGo
  • Added note regarding old and new diesGo
  • Deleted Figure 5-19, THD+N Ratio vs Frequency and Figure 5-20, THD+N vs Output Amplitude Go
  • Added "for PS Package (SO, 8) Only" to Figure 7-3 captionGo
  • Deleted Unity Gain Buffer and System Examples sectionsGo
  • Deleted Equation 1 from Detailed Design Procedure Go
  • Deleted "This ensures the part does not draw too much current." from Detailed Design Procedure Go
  • Added Device Nomenclature tableGo

Changes from Revision U (December 2022) to Revision V (April 2023)

  • Updated Overview, Functional Block Diagram, and Feature Description sections Go