SCDS390B September   2018  – March 2025 TMUX1511

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
      1. 5.8.1 Eye Diagrams
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  IPOFF Leakage Current
    5. 6.5  Transition Time
    6. 6.6  TON (VDD) and TOFF (VDD) Time
    7. 6.7  Propagation Delay
    8. 6.8  Skew
    9. 6.9  Charge Injection
    10. 6.10 Capacitance
    11. 6.11 Off Isolation
    12. 6.12 Channel-to-Channel Crosstalk
    13. 6.13 Bandwidth
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Beyond Supply Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Powered-off Protection
      5. 7.3.5 Fail-Safe Logic
      6. 7.3.6 Low Capacitance
      7. 7.3.7 Integrated Pull-Down Resistors
    4. 7.4 Device Functional Modes
    5. 7.5 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Protocol / Signal Isolation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Transimpedance Amplifier Feedback Control
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME TSSOP UQFN X2QFN
SEL1 1 1 7 I Select pin 1: controls state of switch #1 (logic low = OFF, logic high = ON). Internal 6MΩ pull-down to GND.
S1 2 2 3 I/O Source pin 1. Can be an input or output.
D1 3 3 4 I/O Drain pin 1. Can be an input or output.
SEL2 4 4 8 I Select pin 2: controls state of switch #2 (logic low = OFF, logic high = ON). Internal 6MΩ pull-down to GND.
S2 5 5 5 I/O Source pin 2. Can be an input or output.
D2 6 6 6 I/O Drain pin 2. Can be an input or output.
N.C. - 7 - Not Connected Not Connected - Can be shorted to GND or left floating
GND 7 8 1 P Ground (0V) reference
D3 8 9 11 I/O Drain pin 3. Can be an input or output.
S3 9 10 12 I/O Source pin 3. Can be an input or output.
SEL3 10 11 - I Select pin 3: controls state of switch #3 (logic low = OFF, logic high = ON). Internal 6MΩ pull-down to GND.
N.C. - 12 - Not Connected Not Connected - Can be shorted to GND or left floating
D4 11 13 9 I/O Drain pin 4. Can be an input or output.
S4 12 14 10 I/O Source pin 4. Can be an input or output.
SEL4 13 15 - I Select pin 4: controls state of switch #4 (logic low = OFF, logic high = ON). Internal 6MΩ pull-down to GND.
VDD 14 16 2 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VDD and GND.
(1) I = input, O = output, I/O = input and output, P = power