SCDS390B September   2018  – March 2025 TMUX1511

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
      1. 5.8.1 Eye Diagrams
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  IPOFF Leakage Current
    5. 6.5  Transition Time
    6. 6.6  TON (VDD) and TOFF (VDD) Time
    7. 6.7  Propagation Delay
    8. 6.8  Skew
    9. 6.9  Charge Injection
    10. 6.10 Capacitance
    11. 6.11 Off Isolation
    12. 6.12 Channel-to-Channel Crosstalk
    13. 6.13 Bandwidth
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Beyond Supply Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Powered-off Protection
      5. 7.3.5 Fail-Safe Logic
      6. 7.3.6 Low Capacitance
      7. 7.3.7 Integrated Pull-Down Resistors
    4. 7.4 Device Functional Modes
    5. 7.5 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Protocol / Signal Isolation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Transimpedance Amplifier Feedback Control
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) DEVICE DEVICE DEVICE UNIT
PW (TSSOP) RSV (UQFN) RWB (X2QFN)
14 PINS 16 PINS 12 PINS
RθJA Junction-to-ambient thermal resistance 129.4 141.5 166.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.8 77.9 59.5 °C/W
RθJB Junction-to-board thermal resistance 72.4 67.6 103.6 °C/W
ΨJT Junction-to-top characterization parameter 11.6 5.1 1.0 °C/W
ΨJB Junction-to-board characterization parameter 71.9 65.5 103.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.